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Monday, January 19, 2026

• TSMC Reports Fourth Quarter EPS of NT$19.50
• Sassine Ghazi 2026 Letter to Stakeholders: Re-engineering Engineering in the Age of AI
• Portugal enters the European semiconductor map
• Why PICs Power Next-Gen Data Centers and Quantum-Safe Security
• NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform
• Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles
• Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development
• TSMC Will Struggle to Meet AI Demand for Years, Analysts Say
• Chips&Media Accelerates AI-Based Video IP Evolution and Autonomous Driving Reference Expansion
• Processors for Smart Manufacturing
• SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion
• Breakthrough in silicon switches: Prof. Hua Wang’s IDEAS Group presents new class of high-frequency switches in "Nature Electronics"
• Samsung perfecting 2nm Exynos 2600 yields, TSMC eyes 1.6nm in 2026
• Samsung to close down one of its 8-inch foundry fabs within the year
• T2M Presents TGE200 RISC-V IP Core: Ultra-Low-Power for IoT & MCU Platforms

Friday, January 16, 2026

• eMemory and PUFsecurity’s PUFPQC Achieves NIST FIPS 205 and SP 800-208 Certification, Reaching a Milestone in Comprehensive Post-Quantum Cryptography Protection
• SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform
• Quadric, Inference Engine for On-Device AI Chips, Raises $30M Series C as Design Wins Accelerate Across Edge
• Quadric's SDK Selected by TIER IV for AI Processing Evaluation and Optimization, Supporting Autoware Deployment in Next-Generation Autonomous Vehicles

Thursday, January 15, 2026

• TES is introducing a new 10-bit SAR ADC IP for XFAB’s XT018 technology.
• Samsung’s Non-memory Chip Business Signals Return to Profitability This Year
• Siemens acquires ASTER Technologies to deliver industry-leading PCB test engineering solutions
• Interview: Weebit Nano, TI, and the Future of Resistive RAM
• Intel, Infineon, Synopsys Back European Scaleup Program
• Leonardo launches the course "Climate Action 2026", for a more sustainable Supply Chain
• Photonics Lights Up Canada’s Semiconductor Scene
• AI Boom Reshapes Global Semiconductor Supply Chains
• Ceva Expands Edge AI Portfolio From Wearables to SDVs
• The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era
• Innosilicon ships 14.4 Gbps LPDDR6 IP to its first customers
• Inside CEA-Leti’s Push to Industrialize MicroLED Interconnects
• 5 Chiplets Design Challenges Hampering Wider Take-off

Wednesday, January 14, 2026

• Arteris Closes Acquisition of Cycuity
• GlobalFoundries to Acquire Synopsys’ Processor IP Solutions Business, Expanding Capabilities to Accelerate Physical AI Applications
• Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology

Tuesday, January 13, 2026

• LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions

Monday, January 12, 2026

• Soitec Board of Directors appoints Laurent Rémont Chief Executive Officer, effective April 2026
• Pixelworks Completes Previously Proposed Sale of its Shanghai Semiconductor Subsidiary to VeriSilicon
• TSMC Reportedly Plans Mature-Node Tool Shift to Singapore, Accelerates Exit as Arizona Expands
• EnSilica reports strong revenue growth, improved profitability
• 6G standardisation moves closer as 2026 begins
• Soluna and Siemens Collaborate to Solve GPU Power Swings in Behind-the-Meter AI
• Polymage Labs ties up with US-based Tenstorrent to develop AI compiler
• Keysight Achieves Industry-Leading Live NR-NTN Connectivity in n252 S-Band, Including Satellite-to-Satellite Mobility, in Collaboration with Samsung
• Faster SDV development with IPG Automotive and Synopsys collaboration
• SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development
• 6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans
• Energy-efficient RF power modules developed using SOI technology
• Samsung Electronics Gets Green Light in Foundry Business
• TSMC to Lead Rivals at 2-nm Node, Analysts Say
• T2M Presents TGE100 RISC-V CPU Core: Ultra-Low-Power Computing for Area-Constrained IoT and MCU Platforms
• Quintauris and SiFive Announce Partnership to Advance RISC-V Ecosystem Development
• Quintauris Demonstrates RISC-V Innovation in Automotive at CES
• Microservice Store Launches "embedded Microservice Runtime", The Foundational Technology Powering a Secure Marketplace for IoT Devices

Friday, January 9, 2026

• TES offers CAN Flexible Data-Rate Controller IP Core for System-on-Chip (SoC) Designs