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Wednesday, March 4, 2020
HBM Flourishes, But HMC Lives
MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV
Tessolve strengthens its VLSI Design services with the acquisition of T&VS
GUC Monthly Sales Report - Feb 2020
Faraday Announces Low-DPPM Solution for a Wide Range of ASIC Applications
UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology
Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC Design
Tuesday, March 3, 2020
GlobalFoundries promises embedded MRAM on state-of-the-art FD-SOI node
How Secure Is Your LoRaWAN IoT Device?
Soitec's engineered substrates for 5G
Intel is accelerating its shift to 7nm/5nm to compete with TSMC and AMD
CEVA Unveils World's Most Powerful DSP Architecture
Mellanox to Acquire World Leading Network Intelligence Technology Developer Titan IC to Strengthen Leadership in Security and Data Analytics
Defacto Announces STAR 8.0 and Provides a Unified "All-in-One" SoC Design Solution to Help Conciliating Between RTL, IP-XACT, UPF, SDC, and Physical Design Information
Veriest contributes to the verification of Nuvoton's Computing MCU devices
Monday, March 2, 2020
Changing the game for cloud computing with Neoverse
TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer
Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers
Ampere Altra - Industry's First 80-Core Server Processor Unveiled
Sunday, March 1, 2020
Espressif's 240MHz ESP32-S2 SoCs, Modules, and Boards Enter Mass Production with RISC-V Coprocessor
Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors
VeriSilicon Hantro Video and ZSP IP are Adopted by ASPEED Cupola360 Image Processor SoC
Fraunhofer IIS brings comprehensive MPEG audio codec suite to NXP Semiconductors
Blu Wireless appoints Alan Jones as new Chief Executive Officer
Thursday, February 27, 2020
Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
Wednesday, February 26, 2020
Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones
GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform
PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs
Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights
Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020
Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process
ESD Alliance Welcomes Avery Design Systems to Member Community
VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide
Tuesday, February 25, 2020
Artificial Intelligence Innovation in Taiwan
All Processing Bends Toward AI
SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs
Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols
UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP
Menta and Secure-IC partner to optimize embedded cybersecurity
Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity
Monday, February 24, 2020
Record shipments of Arm-based chips in previous quarter
Safety in cars: Infineon's AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018
Optimizing Automotive Augmented Reality Applications
RISC-V reference models support processor verification
RISC-V gaining ground
BrainChip Featured in ActualTech Media's Emerging AI/ML and Data Science EcoCast
Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps
Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution
SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing
OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch
Sunday, February 23, 2020
Why you should care about Bluetooth LE Audio
Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors
GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
Imperas announce first reference model with UVM encapsulation for RISC-V verification
Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications
Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis
NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning
North American Semiconductor Equipment Industry Posts January 2020 Billings
Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer
Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things
Hex Five Announces MultiZone Security for Arm Cortex?M Series Processors
Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference
Intel Announces Unmatched Portfolio for 5G Network Infrastructure
Arasan Announces immediate availability of its SUREBOOT xSPI Host IP
UltraSoC launches CAN Sentinel to boost automotive cybersecurity
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