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Wednesday, February 19, 2020

• Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom
• Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)
• Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes
• Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2020
• STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
• Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration
• Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption
• Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team

Tuesday, February 18, 2020

• Adapting the Microcontroller for AI in the Endpoint
• Aldec and Codasip at Embedded World: Showcasing an Integrated UVM Simulation Environment for Verifying Custom Instructions with RISC-V Cores
• Adesto's EcoXiP™ Octal xSPI Memory Delivers Exceptional System Operation with STMicroelectronics' New STM32H7A3/7B3 and STM32H7B0 MCUs
• Accelerating Innovation for Safety Systems with Arm Flexible Access
• Car to Cloud: Vehicles Are Getting Connected
• Renesas Electronics and Hitachi Develop High-Speed, High-Precision Automotive A/D Converter Circuit With Stable Operation Under Harsh Conditions
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay
• Synopsys' Fusion Compiler Adopted by AMD
• Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP
• CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz
• Imagination's RF IP included in Autotalks' PLUTON2 Chipset

Monday, February 17, 2020

• Securing Low-Cost Embedded IoT Devices
• The US wants TSMC to stop manufacturing chips for Huawei
• Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development
• Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle
• OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor
• CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results
• CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
• Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer
• SMIC Reports 2019 Fourth Quarter Result
• SmartDV Offers New Design IP for DDR5 and LPDDR5
• SiPearl launches its development with 6.2m euros of European funds
• Covid-19 Is Crimping the Electronics Industry

Sunday, February 16, 2020

• Medical AI: Automate the Important Stuff
• RVSoC Offers a Lightweight Linux-Capable RISC-V Core in Just 5,000 Lines of Verilog
• The FD-SOI Chip Design Book: Yes, It's Finally Here!
• Gen-Z Core Specification 1.1 now available for public download
• Launch of SiPearl, designing the microprocessor for the European exascale supercomputer

Thursday, February 13, 2020

• Synopsys Completes Acquisition of Certain IP Assets from INVECAS
• Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand

Wednesday, February 12, 2020

• Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs
• UltraSoC collaborates with PDF Solutions to prevent in-life product failures using end-to-end analytics and advanced machine learning techniques
• XMOS announces world's lowest cost, most flexible AI processor
• Socionext Introduces Time-Sensitive Network (TSN) IP to Realize Smart Factories
• Faraday's AIoT Platform ASIC Solution Escalates System Accomplishment
• Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor
• Cadence Reports Fourth Quarter 2019 Financial Results
• Five Semiconductor Companies Hold 53% of Global Wafer Capacity

Wednesday, February 12, 2020

• TSMC Board of Directors Meeting Resolutions

Tuesday, February 11, 2020

• Mobile World Congress Cancelled
• GSMA Statement on MWC Barcelona 2020 from John Hoffman, CEO GSMA Limited
• Edge Intelligence Ticks Many Boxes For AI
• Full steam ahead for TSMC despite coronavirus
• Synopsys Announces First Application Security Testing Solution to Analyze Both Open Source and Proprietary Code on the Developer's Desktop
• BrainChip's Akida Development Environment Now Freely Available for Use
• Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design
• New Mathematically Lossless Video Compression IP Cores Announced by Hardent
• SmartDV Adds Support for MIPI I3C 1.1 Across Entire IP Portfolio
• UMC Reports Sales for January 2020

Monday, February 10, 2020

• Nokia and SoftBank team up to complete world's first 5G connected car test
• TSMC Board of Directors Meeting Resolutions
• Low-Latency Ethernet MAC IP Core from CAST now ASIL-D Certified

Sunday, February 9, 2020

• Arm Cortex-M55 and Ethos-U55 Processors: Extending the Performance of Arm's ML Portfolio for Endpoint Devices
• New AI technology from Arm delivers unprecedented on-device intelligence for IoT
• Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms
• SEGGER releases Floating-Point Library for RISC-V
• EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency
• TSMC January 2020 Revenue Report
• BrainChip Showcases Vision and Learning Capabilities of its Akida Neural Processing IP and Device at tinyML Summit 2020
• Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor