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Monday, January 4, 2021

• SMIC gains a rise in their share value
• EU Hexa-X Project Gets €12m to Develop 6G Vision
• Where Are GPUs Headed in 2021?
• EPS Global and Intrinsic-ID Announce Strategic Partnership
• Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip
• CEVA and DARPA Establish Partnership for Technology Innovation

Sunday, January 3, 2021

• GaN Devices in LiDAR System Design
• 4D Imaging Radar Looks to Advance ADAS and Level 5 Automation
• Edge AI: Energy-saving "building blocks" for smart end devices
• Global Semiconductor Sales Increase 7 Percent Year-to-Year in November
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory
• Greek IP company Adveos bought by Shanghai-based Beken

Friday, January 1, 2021

• TSMC and Samsung to face major issues in the development of 3nm

Wednesday, December 30, 2020

• TSMC, other foundries' revenue expected to reach new high in 2021

Tuesday, December 29, 2020

• Prospects for the Semiconductor Industry in the Post-COVID Era
• Foundry Revenue Expected to Reach New High in 2021

Monday, December 28, 2020

• Why the next 10 years may belong to ARM
• Graphcore raises $222 million in Series E Funding Round
• Foundry Revenue Expected to Reach New High in 2021 with Close to 6% YoY Growth as Capacities Remain Scarce Across Industry, Says TrendForce
• Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%

Sunday, December 27, 2020

• Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy
• Advanced Packaging For More-than-Moore Era

Wednesday, December 23, 2020

• Chip Startups are Gaining Traction in Auto Industry
• United States, Europe and China Leading AI Development