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Thursday, January 9, 2020

• Practical applications for AI and ML in embedded systems
• CSEM Bluetooth 5.1 IP icyTRX is ready for LE Audio on multiple processes

Wednesday, January 8, 2020

• How to Get Started with RISC-V-Based Microcontrollers
• Build your own Edge AI SoC with SiFive RISC-V CPUs and CEVA AI chips
• Half-bridge SOI driver offers integrated bootstrap diodes
• Xiaomi and MPEG LA Announce Xiaomi's Signing of MPEG LA's HEVC License
• Synopsys Expands Portfolio of Automotive VDKs with Support for NXP S32G Vehicle Network Processor
• UK Judge Finds Conversant Wireless' European Standard-Essential Patents Infringed by Huawei and ZTE
• China Only Region to Register Pure-Play Foundry Market Growth in 2019
• Andes Technology Takes the Lead in Launching RISC-V Total Solutions and Driving Industry-Academia Collaboration with over 120 Projects
• UMC Reports Sales for December 2019

Tuesday, January 7, 2020

• ONiO.zero offers a RISC-V Microcontroller that runs without battery
• Open Source Hardware Risks
• Low-Power FD-SOI FPGA Melds AI and Bridging
• Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride

Monday, January 6, 2020

• IoT security: What we can learn from recent threats
• Processors for ADAS and auto computing
• Imagination in action at CES 2020
• Synopsys to Acquire Certain IP Assets of INVECAS
• SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets
• Siemens partners with Arm to accelerate the future of mobility by redefining design capabilities for complex electronic systems
• LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
• ESD Alliance Reports EDA Industry Revenue Increase for Q3 2019
• Synopsys Releases Industry's First Bluetooth LE Audio Codec for Power-Sensitive Audio and Voice Applications
• CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio
• Bluespec, Inc. to Open Source Its Proven BSV High-level HDL Tools
• Omni Design Joins TSMC IP Alliance Program
• SHA IP Core with native SHA2-256 HMAC support

Sunday, January 5, 2020

• Siemens-Arm Looks to 2025 Vehicles' Platform Design
• Gowin Semiconductor Takes Leadership Position in Always-on Low Power FPGAs with GW1NZ-ZV Device Production
• Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs
• CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices
• zGlue Launches ChipBuilder Pro to Quickly and Easily Enable the Next Generation of Consumer Experiences on IoT and AI-Powered Devices
• GUC Monthly Sales Report - Dec 2019

Thursday, January 2, 2020

• Global Semiconductor Market Likely to Grow 6% in 2020, reports SIA
• Wi-Fi Alliance brings Wi-Fi 6 into 6 GHz

Wednesday, January 1, 2020

• Architecture of AI chip slightly tweaked, results in cutting power consumption by 5x
• OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications
• Israeli Startup TriEye Collaborates with Porsche to Help Drivers "See" Better in Low Visibility Conditions
• Cloud, 5G and 'wetware' attacks – the 5 biggest cybersecurity threats of 2020
• 2020: When AVs Attack, Who's at Fault?
• HiSilicon No Longer Huawei's Captive Chipmaker
• Imagination and Apple Sign New Agreement

Tuesday, December 31, 2019

• CES 2020: Biggest Computing Trends to Watch

Monday, December 30, 2019

• China semiconductor equipment expense to see double-digit growth
• Our 2020 tech predictions: Samsung, Surface Duo, 5G and Elon Musk
• RISC-V Lagarto is First Open Source Chip Developed in Spain

Sunday, December 29, 2019

• The single most important 2020 IoT trend
• 5 Innovations That Will Dominate CES 2020
• SiFive to Attend CES 2020
• AI: A Little Too Human, But Not Human Enough
• A View of the Future for GLOBALFOUNDRIES
• AImotive's latest aiWare3P delivers superior NN acceleration for production L2-L3 automotive AI
• Digital Blocks extends leadership of UDP/IP networking with 50 & 100 GbE