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Wednesday, November 27, 2019

• Creonic Participates in H2020 "VERTIGO" Research Project
• Semico Forecasts Strong Growth for RISC-V
• SiFive Welcomes Ann Chin As SiFive IP Business Unit General Manager

Tuesday, November 26, 2019

• European Union Cybersecurity Agency focuses on connected cars in latest research
• Inmarsat GX5 satellite, manufactured by Thales Alenia Space, now in orbit
• SiFive Welcomes Stuart Ching As Chief Revenue Officer
• Trade dispute drives RISC-V-Foundation to Switzerland
• Soitec reports First Half Results of Fiscal Year 2020
• GlobalWafers completes new fab in South Korea
• University of Tokyo and TSMC Announce Organization-Wide Advanced Semiconductor Technology Collaboration

Monday, November 25, 2019

• The transformation of UMC
• Silex Insight Introduces Video Codec IP using RAW input (CFA)
• Imperas delivers highest quality RISC-V RV32I compliance test suites to implementers and adopters of RISC-V
• MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC
• Aldec's Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board

Sunday, November 24, 2019

• Netherlands Energy Harvesting Semiconductor Firm Nowi Reaches $14 Million in Funding
• WiLAN Signs Wireless License with LG
• S2C Delivers New Prodigy FPGA Prototyping Solutions with the Industry's Highest Capacity FPGA from Intel
• MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs
• AccelerComm introduces improved channel equalisation for 5G NR at MWC Barcelona 2020

Friday, November 22, 2019

• SparkFun Picks SiFive's FE310 to Power RISC-V-Based RED-V Thing Plus, RED-V RedBoard Dev Boards

Wednesday, November 20, 2019

• SiFive Welcomes Stuart Ching As Chief Revenue Officer
• UltraSoC joins the OpenHW Group and extends its commitment to an open-source future for technology development
• SmartDV's Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow
• Renesas' R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN

Tuesday, November 19, 2019

• Cadence Named the #1 Technology Company on Investor's Business Daily List of the Top 50 ESG Companies
• Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk "I-fuse: A Disruptive OTP Technology"
• Credo Joins Open Compute Project (OCP) to Accelerate 400G and Beyond Connectivity Solutions for Hyperscale Datacenters and Telecom
• Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
• North American Semiconductor Equipment Industry Posts October 2019 Billings

Monday, November 18, 2019

• SMIC Proposed Issue of US$200 Million Zero Coupon Convertible Bonds
• ST signs up for more Cree silicon carbide wafers
• RISC-V Myths and More
• RISC-V Not So Risky
• UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions
• EasyIC Design joins Arm Approved Design Partner Program
• Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm
• IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19
• Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor
• High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers

Sunday, November 17, 2019

• RISC-V Markets, Security And Growth Prospects
• Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work
• Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators
• ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development
• Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing
• Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology
• NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center
• Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP
• Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019