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Monday, October 26, 2020

• TSMC top patent applicant in Taiwan for sixth straight quarter
• Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family
• Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
• Cortus Announces the Opening of another New Design Centre in Meyreuil (France)
• AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader

Sunday, October 25, 2020

• EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
• Nvidia-Arm Deal a Boon for RISC-V?
• China Forecast to Represent 22% of the Foundry Market in 2020
• GlobalFoundries Details Ambitious Technology Roadmap
• North American Semiconductor Equipment Industry Posts September 2020 Billings
• Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
• Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021
• EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
• Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
• Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th
• Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
• Micro Magic, Inc. Unleashes World's Fastest RISC-V Core

Friday, October 23, 2020

• Movellus Delivers Clock Generation Module on TSMC 3nm Process

Wednesday, October 21, 2020

• 6 Considerations for Integrating Sensors in Vehicles
• Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
• GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO
• TSMC Sees HPC As Next Inflection Point
• PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY
• Arm partners with Mentor to offer complete verification service
• M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
• SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
• SmartDV Appoints Karthik Gopal as Asia General Manager
• eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
• TSMC Bets on HPC for Future Growth

Tuesday, October 20, 2020

• Soitec reports FY'21 second quarter revenues
• Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities
• Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
• Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
• TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
• IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
• Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
• Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
• Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP

Monday, October 19, 2020

• Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge
• Chips&Media showcase at Samsung Foundry SAFE FORUM 2020 as an IP partner
• Veridify Security Welcomes Happiest Minds as Systems Integrator Partner
• Taiwan Semiconductor's Technology Dominance And Its Impact On Customers And Suppliers
• Codasip Announces a New Design Center in France
• Cadence Reports Third Quarter 2020 Financial Results
• TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
• Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
• Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
• TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
• SK hynix to Acquire Intel NAND Memory Business

Sunday, October 18, 2020

• TSMC revenue for 2020 to rise by 30% despite losing Huawei
• Hardware Is Back, Says CEA-Leti's CEO
• riscvOVPsim gets Risc-V vector instructions
• 'Samsung set to win over TSMC in the end'
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
• Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
• Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
• Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
• Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
• Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
• Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency

Thursday, October 15, 2020

• China is catching up: SMIC foundry is now able to produce 7 nm chips

Wednesday, October 14, 2020

• Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
• TSMC Reports Third Quarter EPS of NT$5.30
• GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
• Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
• CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
• JEDEC Announces Publication of JEDEC Module Sideband Bus
• Industry's first security microcontrollers for a complete IoT lifecycle management solution