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Thursday, July 23, 2020

• M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process
• Faraday Reports Second Quarter 2020 Revenues at NT$1,306 Million with an EPS of NT$0.58
• North American Semiconductor Equipment Industry Posts June 2020 Billings

Thursday, July 23, 2020

• ARC International Signs Software Marketing Agreement with Metrowerks

Wednesday, July 22, 2020

• Village Island creates a new breakthrough in the Broadcast market by offering JPEG-XS technology on its VICO series
• Softbank talks to Apple and Nvidia about Arm sale
• AI Edge Inference is Totally Different to Data Center
• Mobile Semiconductor's Enhanced Memory Compilers Dramatically Improve Power On Edge AI Devices
• Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs
• Brite Semiconductor Provides Total Solution for NVDIMM OEM
• Aldec Provides Static Verification for RISC-V Designs with the latest release of ALINT-PRO
• Carlos Mazure, EVP of Soitec and Chairman of the SOI Industry Consortium, Joins Silvaco Board of Directors
• European Space Agency, Blue Pearl Software and ADIUVO Engineering Partner Contract to Improve the usability of ESA Soft-Cores
• SiFive Elevates Custom SoC Design With Enhanced Processor IP Portfolio
• Speculation Arises over Samsung's Possible Acquisition of ARM

Tuesday, July 21, 2020

• Alchip Technologies 7nm ASIC Capabilities Set Advanced Technology Pace
• OpenHW Ecosystem Implements Imperas RISC-V reference models for Coverage Driven Verification of Open Source CORE-V processor IP cores
• Samsung Electronics and TSMC Planning on More Investments
• GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX

Monday, July 20, 2020

• CFI funding fuels new services for researchers from CMC and CNDN
• Moore's Law Isn't Slowing down - Just Ask System Companies
• Codasip Releases the First Linux-Capable RISC-V Core Bk7 Optimized for Domain-Specific Applications
• Synaptics to Acquire DisplayLink, Extending Video Interface Market Leadership
• New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X
• Cadence Reports Second Quarter 2020 Financial Results
• Flex Logix Announces EFLX eFPGA And nnMAX AI Inference IP Model Support For The Veloce Strato Emulation Platform From Mentor

Sunday, July 19, 2020

• Long-Range Wireless Power Transfer for Industrial IoT
• Antitrust: the European Commission launches sector inquiry into the consumer Internet of Things (IoT)
• Long-Range Wireless Power Transfer for Industrial IoT
• How SMIC Can Keep Up With Advanced Process Technologies
• TSMC open to possibility of building plants in Japan
• CFX announces commercial availability of anti-fuse OTP technology on SMIC 40HV process
• True Circuits Participates in First Virtual DAC! Showcases Silicon Proven PLLs, DLLs and DDR 4/3 PHYs
• STMicroelectronics makes acquisitions to further strengthen the wireless connectivity capabilities of STM32 microcontrollers
• Mentor introduces Calibre nmLVS-Recon technology to dramatically streamline overall IC circuit verification
• SmartDV, Aldec Partner to Link SmartDV's Verification IP with Aldec's Riviera-PRO Simulator
• Synopsys VCS Used by Graphcore to Verify Next-Generation Colossus GC200 IPU
• Perforce Software Acquires Methodics, Expanding DevOps Portfolio
• PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect
• SMIC: Advanced Process Technologies and Gov't Funding (Part 2)
• Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform

Thursday, July 16, 2020

• Nestwave wins Must Award in the category Most Innovative Startup
• Innovative Advantage upgrades streams from HD to 4K in business jets with the intoPIX TICO RDD35 Technology
• USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0
• CHIPS Alliance Announces AIB 2.0 Draft Specification to Accelerate Design of Open Source Chiplets
• TSMC Raises Capital Expenditure Plan on Improved Outlook
• Spin Memory Announces Extension of Series B Funding

Wednesday, July 15, 2020

• Kandou Appoints Jeff Winzeler CFO
• Menta Announces New Software Version and New Adaptive DSP at DAC 2020
• Buying Avatar, Siemens Revives Legendary Place & Route Tool
• EasyIC Design celebrates its 10th anniversary
• Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology
• 1Q/4Q "Direction Indicator" Signals Rebound in the 2020 IC Market
• Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development
• Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors
• Axiomise Announces the Release of the Next-Generation RISC-V App
• TSMC Reports Second Quarter EPS of NT$4.66

Tuesday, July 14, 2020

• Maxim Integrated Deal Cements Analog Devices at No 2 in Analog
• Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio
• British chip designer Graphcore unveils new AI processor more complex than Nvidia's
• SATA-IO Increases Interoperability Features with Revision 3.5 Specification
• How SMIC Can Keep Up With Advanced Process Technologies
• Softbank Said to Have a Buyout Offer for Arm
• Efinix Announces Trion Titanium Family
• SMIC: Advanced Process Technologies and Gov't Funding
• JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems
• Dr. Walden Rhines Joins Cornami as President and CEO
• Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs

Monday, July 13, 2020

• Axiomise Announces the Release of the Next-Generation RISC-V® App
• TSMC pushing to produce advanced chips using experimental design by 2023, 2024
• Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor
• VITEC Licenses Codasip Bk5 Core for Multi-Purpose Use in Video Products

Sunday, July 12, 2020

• TSMC's market cap continues record upswing after June sales report
• Arm Research Selected for DARPA Secure Silicon Program
• TSMC June 2020 Revenue Report
• DMP releases AI Processor IP Core "ZIA DV740"
• Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership
• DMP releases IP Core "ZIA ISP"
• Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform
• Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing
• ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020