Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Friday, June 5, 2020
Auto Sector Stuck in Neutral as a Few IC Makers Recover
Thursday, June 4, 2020
Huawei's proposal to replace TCP/IP is going nowhere fast
Wednesday, June 3, 2020
Nolam Embedded Systems discloses the MIL-STD1553 solution integrated on REFLEX CES Arria 10 SoC Module
IAR Systems launches support for the RISC-V P extension for Packed-SIMD instructions
SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols
Synopsys Accelerates FIPS 140-3 Certification with NIST-Validated True Random Number Generator IP
Tuesday, June 2, 2020
Former General Manager of GlobalFoundries China joins SMIC
Lattice Accelerates FPGA-Based Processor Design With New IP Ecosystem and Design Environment
The Increasingly Ordinary Task Of Verifying RISC-V
GPU Market Provides a Ray (Tracing) of Hope
Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V
Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
Efinix Announces Availability of Three RISC-V SoCs
Synopsys Introduces Industry's First Complete USB4 IP Solution
MIPI Alliance Completes Development of A-PHY v1.0, an Industry-Standard Long-Reach SerDes Physical Layer Interface for Automotive Applications
Enyx launches an ultra-low latency development framework for building standardized, FPGA-based trading systems
Securing the Internet of Things in a Quantum World
MediaTek Will Not Illegally Supply TSMC Chips To Huawei
SMIC plans to raise $2.8 billion as the US tries to hamper China's Semiconductor growth
Monday, June 1, 2020
Collaboration focuses on development tools for RISC-V-based MCUs
PUFsecurity IP Open Source Program: Bridging the Gap in Chip Security
NEUCHIPS Announces World's First Deep Learning Recommendation Model (DLRM) Accelerator: RecAccel
First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year
UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3
Codasip Extends SweRV Support Package to Include Western Digital SweRV EH2 & EL2 RISC-V Cores
GigaDevice GD32 MCU and Amazon AWS Launch New Embedded Cloud Platform
Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications
Sunday, May 31, 2020
Don't Let Baggage Hinder Innovation: RISC-V Lets Us Start with a Clean Slate
DARPA Marries IC Security with System-Level Synthesis
Dolphin Design unveils SPIDER, a turnkey platform to accelerate the design of energy efficient power management systems
Global Semiconductor Sales Decrease 1.2 Percent Month-to-Month in April
Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC
Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
Cloud Computing Is Changing Everything About Electronic Design
Seamless Microsystems announces a major design-win
Samsung Foundry Certifies Synopsys Design Compiler NXT for 5/4nm FinFET Process Technologies
Thursday, May 28, 2020
eInfochips collaborates with EchoNous Inc. to develop the recently FDA-cleared KOSMOS platform
Imagination's GPU selected by SemiDrive for automotive chip
Texas Instruments Maintains Firm Grip As World's Top Analog IC Supplier
Wednesday, May 27, 2020
What's So Important About Processor Extensibility?
Domain-Specific Processors Enable More Than Moore
How On-Premises Enhances your Chances of IoT Success
DARPA Looks to Automate Security for IC Design
Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA
Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs
Chip Equipment Becomes Trade War's Latest Battlefield
TSMC Delivers World-first 7nm Automotive Design Enablement Platform
TSMC to move 5nm Plus process to volume production in 4Q20
Tuesday, May 26, 2020
SI semi forecast is -6% in 2020; +10-15% in 2021
5G? Wait 'Til Next Year
Lattice and Etron Deliver Small, Low Power Reference Design for Edge AI and Video Processing Applications
Domain Specific Accelerators Will Drive Vector Processing on RISC-V
UltraSoC and Canis Labs partner to secure the CAN bus
Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission
Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC HS Processor IP
GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
Cadence to Optimize Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development
Monday, May 25, 2020
Verizon Teams Up with Movandi, NXP, Qualcomm for 5G
Can AI Turn Your Data Center Green?
Arm replaces CPU and GPU flagships, and more
SMIC makes major move to complete its 7nm & 8nm processes
CEO Interview: Dolphin Design - FD-SOI IP Platform for Energy Efficient SoC Design for IoT, Automotive and More
New Arm IP delivers true digital immersion for the 5G era
Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP
GlobalFoundries Abandons Chengdu Wafer Fab
CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies
Sunday, May 24, 2020
Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices
Senators Seek Suspension of TSMC US Fab Project
Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
The TSMC and Huawei Announcements Are Not as Linked as You May Think
Previous
|
Next
Did you miss last D&R News Alerts ?