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Thursday, November 14, 2019

• Gyrfalcon Unveils Fourth AI Accelerator Chip
• Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D FPGAs
• Synopsys Completes Acquisition of DINI Group
• Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use

Wednesday, November 13, 2019

• Reduce TCO with Arm Based SmartNICs
• FlexIC Foundry enables custom flexible integrated circuit design
• Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications
• Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices

Tuesday, November 12, 2019

• Mirabilis Design unveils the first rapid prototyping platform for Artificial Intelligence Processors and Applications
• Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores
• Efinix Rolls Out Trion T120 FPGAs
• New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging
• Rambus Announces Comprehensive PCI Express 5.0 Interface Solution

Monday, November 11, 2019

• Avnet Releases MaaXBoard for Embedded Computing, Edge AI Development
• TSMC Board of Directors Meeting Resolutions
• Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter
• Xilinx Vitis Unified Software Platform Now Available for Download
• SMIC Reports 2019 Third Quarter Result
• Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era
• Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure
• New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East
• Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors
• Blaize Emerges from Stealth to Transform AI Computing
• Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications
• Achronix to Showcase 7nm FPGA Solutions at SC19
• Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC
• GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio

Sunday, November 10, 2019

• Wireless 3D Integration - Making Stacking Silicon as Easy as Stacking Lego (2/2)
• Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety
• MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services
• Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon
• Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in Beijing
• Synopsys to Acquire Certain IP Assets from eSilicon
• eSilicon to be Acquired by Inphi and Synopsys
• Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS Packet Conditioners
• Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications for TSMC 16nm

Thursday, November 7, 2019

• Are Smartphones Equipped to Control a Vehicle?
• UMC Reports Sales for October 2019
• TSMC October 2019 Revenue Report
• MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology

Wednesday, November 6, 2019

• Abaco Announces Industry's First 6U VPX Solution to Feature New Xilinx RF System-on-Chip Technology
• Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung
• CEVA, Inc. Announces Third Quarter 2019 Financial Results
• SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

Tuesday, November 5, 2019

• Applause's new AI solution helps tackle bias and sources data at scale
• Wireless 3D Integration – Making Stacking Silicon as Easy as Stacking Lego (1/2)
• Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis
• Announcing OpenTitan, the First Transparent Silicon Root of Trust
• Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
• Marvell Completes Acquisition of Avera Semi
• GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

Monday, November 4, 2019

• Wearable AI market to cross $180bn frontier by 2025
• 6 MEMS and Sensors Startups on Fast Track to Grow
• Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
• Rambus Reports Third Quarter 2019 Financial Results
• AdaCore Introduces Support for C++ Embedded Environments
• GUC Monthly Sales Report - Oct 2019
• IAR Systems delivers development from device to cloud through integration with Amazon Web Services
• Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program

Sunday, November 3, 2019

• TSMC adding 8,000 new jobs as it focuses on 3nm and beyond
• Faraday Reports Third Quarter 2019 Financial Results
• OPENEDGES unveils high performance & low power GDDR6 controller IP
• UltraSoC furthers academic support with Europractice partnership
• Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September
• Palma Ceia SemiDesign Establishes United Kingdom Center
• Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications
• Xilinx Alveo Accelerators Power SK Telecom's Real-Time AI-based Physical Intrusion and Theft Detection Service