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Wednesday, October 30, 2019
The Linley Group Microprocessor Report Highlights BrainChip's Akida™ Spiking-Neural-Network Processor
China IC 'Big Fund' Phase II Aims Self-Sufficiency
DMP adopted for NEDO project of "Survey of issues for finding ideas regarding Technology Development for AI Chip and Next-generation Computing for High-efficiency and High-speed Processing"
China GDP and PMI Contraction A Risk Factor For Global Economy
How to Choose Between AI Accelerators
CEVA Appoints Bernadette Andrietti to its Board of Directors
AI Takes Over Linley Fall Processor Conference
Cadence Presented with Four 2019 TSMC Partner of the Year Awards
Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps
Tuesday, October 29, 2019
Synopsys and AMD Execute Multi-Year ZeBu Emulation Agreement
Silex Insight Fast-track FIPS 140-2 Certification with NIST-Validated Crypto Coprocessor
GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure Business
Monday, October 28, 2019
David Zinsner Appointed to Credo Board of Directors
Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers
Pre-Silicon Security Assessment
TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
Synopsys Ships More Than 3,000 HAPS-80 Prototyping Systems
Achronix and BittWare Launch VectorPath Accelerator Card with Speedster7t FPGAs
'The AI Inference Processor is Dead'
Hex Five Adds MultiZone Security Isolation with Micron's Authenta Flash
AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity
Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools
Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process
Arm to Deliver CHERI-based Prototype to Tackle Security Threats
Sunday, October 27, 2019
PathPartner Technology to Showcase Driver and Passenger Safety Solutions at TU-Automotive Europe
Accellera Announces Standardization Initiative to Address Design Automation and Tool Interoperability for Functional Safety
Sofics Analog I/O's and ESD clamps proven for TSMC 16nm, 12nm and 7nm FinFET processes
Gidel Provides 3x Acceleration of FPGA and ASIC Development and Validation for Vision and Image Processing
Micron Introduces Comprehensive AI Development Platform
North American Semiconductor Equipment Industry Posts September 2019 Billings
Micron Introduces Industry's First Silicon-Based Security-as-a-Service Platform for IoT Edge Devices
SiFive Announces New U8-Series Core IP For High-Performance Compute
Dr. Necip Sayiner Joins Rambus Board of Directors
Xilinx Envisions its Future Without Huawei
NSITEXE Achieves First-Pass Silicon Success for High-Performance Data Flow Processor-based SoC Test Chip Using DesignWare IP
Wednesday, October 23, 2019
RISC-V Challenges And Opportunities
Veriest experts presenting at DVCon Europe Conference
SiFive Announces New SiFive Shield For Modern SoC Design
TensorFlow gets native support for PowerVR GPUs via optimised open-source SYCL libraries
VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications
Innosilicon's Broad IP Portfolio Qualified on GLOBALFOUNDRIES 12LP FinFET Platform for High-Performance Applications
Renesas Expands Access to Portfolio of Leading-Edge IP Licenses
AES Encryption IP Cores from CAST Receive NIST Certification
Tuesday, October 22, 2019
Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22nm FD-SOI at IEEE S3S Conference, 2019.
The Crucial Role of PUF in AIoT Security
TSMC Outlines 5nm Plans, 7nm and EUV Progress
Astera Labs Accelerates PCI Express 5.0 System Deployment in Collaboration with Intel and Synopsys
New Arm IP brings intelligent, immersive experiences to mainstream markets
Monday, October 21, 2019
GCC support for the draft Bit Manipulation Extension for RISC-V
Dialog further extends IoT influence, acquires Creative Chips for $80m cash
Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing
BrainChip Awarded New Patent for Artificial Intelligence Dynamic Neural Network
Chips&Media Delivers The World's First Commercial AV1 Hardware Decoder IP, WAVE510A
CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi Technologies
USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US
Cadence Reports Third Quarter 2019 Financial Results
Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs
Microchip's Low-Power Radiation-Tolerant (RT) PolarFire FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost
PHY Wireless Launched to Address Today's Real World Cellular Location and Capacity Challenges
Rambus Closes Sale of Payments and Ticketing Businesses to Visa
OPENEDGES and INNOSILICON unveil advanced DDR Controller and DDR PHY integrated IP solutions
Sunday, October 20, 2019
Shanghai FD-SOI Forum 2019 – the Full Recap
TSMC Recognizes Synopsys with Four "Partner of the Year" Awards
Samsung wants to rally more fabless customers
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