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Thursday, June 25, 2020
Elephant in Automated Vehicle Room
Solving a Problem like Reuse - an FD-SOI Analog IP Perspective from Thalia
Rockchip selects Ensigma iEW200 low-power Wi-Fi
Intilop Delivers a Ready to Deploy, Four Thousand TCP/UDP Session 2U-Hardware Accelerator Box with Linux Kernel Bypass Drivers for Extreme-Performance Networking
Synopsys Broadens Collaboration with EPFL
Wednesday, June 24, 2020
Analysts believe that SMIC will not develop a process below 7/5nm
VeriSilicon: FD-SOI & Design-Lite - A Beautiful Combination (CEO Interview)
Macnica adopts intoPIX TICO-XS for its 4K ProAV OEM solutions
Bamboo Systems Launches Next Generation Server
Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program
Percepio Closes Series A Funding Round with Fairpoint Capital
Apple Moving Macs from Intel to Arm
Taiwan Edges South Korea as Largest Base for IC Wafer Capacity
Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX
SMIC to come out stronger after pandemic–Sy-Coson
Tuesday, June 23, 2020
IAR Systems delivers advanced trace for RISC-V based applications
Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA
AI-based cybersecurity: Hype or reality?
TSMC invested 300 R&D teams to assist Apple in developing Mac chips
UMC Recognized for Excellence by Texas Instruments
TSMC has reportedly begun production of the Snapdragon 875 SoC using the 5nm process
T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm.
Monday, June 22, 2020
AIoT Chip Slashes Power Consumption for Person Detection
Adesto Announces Completion of CFIUS Review for Proposed Acquisition of Adesto by Dialog Semiconductor
Arm Technology Powers the World's Fastest Supercomputer
Siemens acquires UltraSoC to drive design for silicon lifecycle management
Rianta Releases 200G/400G Single Channel MAC IP Core
Sunday, June 21, 2020
GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth
Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator
Synopsys Replenishes Repurchase Authorization to $500 Million
QuickLogic Announces Pricing of $8.75 Million Public Offering of Common Stock
intoPIX releases the FastTICO-XS SDK v1.2.4 for Nvidia GPU
Thursday, June 18, 2020
Time to Think About the How and Where of Cryptography
GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government
North American Semiconductor Equipment Industry Posts May 2020 Billings
Wednesday, June 17, 2020
Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization
Intel's 10nm Node: Past, Present, and Future
Automotive IC Market Forecast With Strongest CAGR Through 2024
U.S. Chip Revival Gains Traction
Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium)
Intel's 10nm Node: Past, Present, and Future - Part 2
Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform"
Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab
Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring
Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform
Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center
NXP Teams with TSMC on 5nm for Next-Gen Auto Platform
Where Innovation Is Happening in Geolocation: Signal Processing
Tuesday, June 16, 2020
Samsung Provides One-Stop Foundry Design Environment with the Launch of 'SAFE™ Cloud Design Platform'
Siemens extends Xcelerator portfolio to help transform electrical/electronic systems development
Autonomous Vehicles in Covid Economy
CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions
Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC
Monday, June 15, 2020
Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming
QuickLogic Announces Open Reconfigurable Computing Initiative
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips
Sunday, June 14, 2020
Intel's 10nm Node: Past, Present, and Future
Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud
Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem
BrainChip Successfully Launches the Akida Early Access Program
Embedded Hardware Security Heads to the Edge
IAR Systems enables secure code with updated MISRA C compliance in leading development tools
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