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Thursday, May 28, 2020

• eInfochips collaborates with EchoNous Inc. to develop the recently FDA-cleared KOSMOS platform
• Imagination's GPU selected by SemiDrive for automotive chip
• Texas Instruments Maintains Firm Grip As World's Top Analog IC Supplier

Wednesday, May 27, 2020

• What's So Important About Processor Extensibility?
• Domain-Specific Processors Enable More Than Moore
• How On-Premises Enhances your Chances of IoT Success
• DARPA Looks to Automate Security for IC Design
• Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA
• Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs
• Chip Equipment Becomes Trade War's Latest Battlefield
• TSMC Delivers World-first 7nm Automotive Design Enablement Platform
• TSMC to move 5nm Plus process to volume production in 4Q20

Tuesday, May 26, 2020

• SI semi forecast is -6% in 2020; +10-15% in 2021
• 5G? Wait 'Til Next Year
• Lattice and Etron Deliver Small, Low Power Reference Design for Edge AI and Video Processing Applications
• Domain Specific Accelerators Will Drive Vector Processing on RISC-V
• UltraSoC and Canis Labs partner to secure the CAN bus
• Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission
• Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC HS Processor IP
• GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
• Cadence to Optimize Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development

Monday, May 25, 2020

• Verizon Teams Up with Movandi, NXP, Qualcomm for 5G
• Can AI Turn Your Data Center Green?
• Arm replaces CPU and GPU flagships, and more
• SMIC makes major move to complete its 7nm & 8nm processes
• CEO Interview: Dolphin Design - FD-SOI IP Platform for Energy Efficient SoC Design for IoT, Automotive and More
• New Arm IP delivers true digital immersion for the 5G era
• Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP
• GlobalFoundries Abandons Chengdu Wafer Fab
• CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies

Sunday, May 24, 2020

• Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
• China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices
• Senators Seek Suspension of TSMC US Fab Project
• Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
• The TSMC and Huawei Announcements Are Not as Linked as You May Think

Thursday, May 21, 2020

• China chipmaker SMIC receives $2bn state help amid Huawei ban
• Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times
• Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products
• North American Semiconductor Equipment Industry Posts April 2020 Billings

Wednesday, May 20, 2020

• Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions
• Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC
• SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform
• eMemory Provides Intellectual Property for Secure NB-IoT Products
• CEO interview: The importance of being agile
• Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
• S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping
• Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA

Tuesday, May 19, 2020

• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020
• CEA-Leti Demos D-band RF Architecture for 6G Roadmap
• Design For Narrowband IoT
• Global IoT market to grow to $1.5trn annual revenue by 2030
• Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications
• SMIC Caught Between Huawei And A Hard Place
• TSMC US plant raises national security and competition questions, say senators
• GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility
• Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA
• Politics Haunts TSMC's US Fab Plan
• Mirabilis Design creates the first RISC-V system-level architecture exploration solution
• Mirabilis Design creates the first RISC-V system-level architecture exploration solution

Tuesday, May 19, 2020

• Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Monday, May 18, 2020

• Huawei responds
• Microsoft announces definitive agreement to acquire Metaswitch Networks, expanding approach to empower operators and partner with network equipment providers to deliver on promise of 5G
• Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications
• SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions
• CXL Protocol Adds Capabilities over PCIe
• Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips
• Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions
• Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications

Sunday, May 17, 2020

• Who Needs Autonomous Vehicles?
• TSMC Ariz Fab a Tangled Web
• UltraSoC appoints Jonathan Lucas as VP of Software
• LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP
• Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes
• Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes
• Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes