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Thursday, May 14, 2020
TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron
Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries
Wednesday, May 13, 2020
Veriest supports the development of Arbe's innovative automotive Radar device
CAST Releases 100Gbps UDP/IP Core
Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach
CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free
Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray
Tuesday, May 12, 2020
SMIC Reports 2020 First Quarter Results.
Associations collaborate on open standards in IoT security
Design Of An Ultra-Low-Power Current Steering DAC In A Modern SOI technology
TSMC Says it Still Won't Build a Fab in the US
Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge"
Arm hardware and software ecosystems will converge at virtual Arm DevSummit, formerly known as Arm TechCon
GigaDevice Announces a Patent Licensing Agreement with Rambus
OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement
Eta Compute Partners with Edge Impulse to Accelerate the Development and Deployment of Machine Learning at the Edge
Tuesday, May 12, 2020
TSMC Board of Directors Meeting Resolutions
Monday, May 11, 2020
Exploring the 5 WÂ’s of Full AV Stacks
Riedel adopts intoPIX TICO-XS FPGA IP-cores to empower broadcasts & events.
SmartDV Ships First Design and Verification IP for MIPI RFFE v3.0 Specification
Configurable Analog Semiconductor IP Enables Faster IoT Chip Design
SMIC Aims to Raise More Than $3B for Expansion
Perceptia Devices Offers Research License
Arteris IP FlexNoC Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoCs
Coherent Logix Selects Kandou's SerDes IP for its Low-Power, High-Performance C-Programmable Processors
VeriSilicon VIP9000 and ZSP are Adopted by iCatch Next Generation AI-powered Automotive Image Processing SoC
Sunday, May 10, 2020
RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices
AI Drives Data Centers to the Edge
TSMC Expects Strong Rebound in 2021
Dolphin Design Enables Next Generation Energy-Efficient Battery-Operated IoT Devices with New IP Platforms on TSMC 22ULL Process
Xylon's MPSoC Multi-Camera Vision Kit Updated
Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology
UMC Reports Sales for April 2020
TSMC Expected to Rebound in 2021 on AMD Gains
TSMC April 2020 Revenue Report
CEVA, Inc. Announces First Quarter 2020 Financial Results
Arasan Announces the Availability of MIPI D-PHY IP for TSMC 22nm Process Technology
RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices
Wednesday, May 6, 2020
MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Rollouts
Veridify Security's DOME Client Library Achieves PSA Certified Level 1 Accreditation
Imagination Technologies and BAIC Capital announce automotive joint venture
Silex Insight launches Public Key Engine supporting Chinese OSCCA SM9
Imagination Inquiry Exposes Wider Risk of IP Sales to China
Tuesday, May 5, 2020
Synopsys Announces Earnings Release Date for Second Quarter Fiscal Year 2020
SMIC Seeks to Raise More Capital, This Time on STAR Market
SynSense (formerly aiCTX) closes Series A Round and announces the opening of offices in China
SmartDV's LPDDR5 IP Clocks 612 MHz in FPGA Functional Test, 1.6GHz at 28nm
HiSilicon First China-Based Semi Supplier to be Ranked in Top-10
Omni Design Appoints Satris Group as Sales Representative in Israel
Monday, May 4, 2020
OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry's Best Low-Light Performance, Lowest Power and Smallest Size
TSMC Reportedly Gets Major Orders for NVIDIA's Next-Generation 7 Nm Ampere and 5 Nm Hopper GPUs
GUC Monthly Sales Report - Apr 2020
Rambus Reports First Quarter 2020 Financial Results
Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020
Xilinx Teams with Leading Universities Around the World to Establish Adaptive Compute Research Clusters
Imagination Previews Shifting Views Prior to UK Hearing
Faraday's SoCreative!V Platform Accelerates SoC Development in Edge Applications
Alphawave IP Announces Record FY2019, Record 1Q2020 and Dramatic Hiring Plans for Remainder of 2020 and beyond
Sunday, May 3, 2020
CMC Designates LetiÂ’s L-UTSOI Standard Model as Chip Industry FD-SOI Standard
Imagination Technologies: Evidence to the Foreign Affairs Committee
Wave Computing Files for Chapter 11 Protection
Covid-19 and America's Vulnerabilities - A Way Forward
Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds
PLDA Announce Complete Support for CXL and Gen-Z protocols
Dolphin Design unveils its innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs
NVE Introduces Noncontact ABZ TMR Magnetic Encoder Sensor
Arbe Launches Automotive Grade Imaging Radar Processor Chip
Is IPO in China Imagination's Only Possible Exit Path?
Aldec's New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the "Price/Performance" Sweet Spot
Palma Ceia SemiDesign Tapes Out 802.11ax Transceiver for Wi-Fi 6
New Wave Design and Verification Acquires FlightWire
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