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Thursday, February 27, 2020
Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
Wednesday, February 26, 2020
Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones
GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform
PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs
Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights
Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020
Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process
ESD Alliance Welcomes Avery Design Systems to Member Community
VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide
Tuesday, February 25, 2020
Artificial Intelligence Innovation in Taiwan
All Processing Bends Toward AI
SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs
Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols
UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP
Menta and Secure-IC partner to optimize embedded cybersecurity
Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity
Monday, February 24, 2020
Record shipments of Arm-based chips in previous quarter
Safety in cars: Infineon's AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018
Optimizing Automotive Augmented Reality Applications
RISC-V reference models support processor verification
RISC-V gaining ground
BrainChip Featured in ActualTech Media's Emerging AI/ML and Data Science EcoCast
Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps
Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution
SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing
OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch
Sunday, February 23, 2020
Why you should care about Bluetooth LE Audio
Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors
GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
Imperas announce first reference model with UVM encapsulation for RISC-V verification
Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications
Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis
NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning
North American Semiconductor Equipment Industry Posts January 2020 Billings
Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer
Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things
Hex Five Announces MultiZone Security for Arm Cortex?M Series Processors
Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference
Intel Announces Unmatched Portfolio for 5G Network Infrastructure
Arasan Announces immediate availability of its SUREBOOT xSPI Host IP
UltraSoC launches CAN Sentinel to boost automotive cybersecurity
Wednesday, February 19, 2020
Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom
Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)
Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes
Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing
Synopsys Posts Financial Results for First Quarter Fiscal Year 2020
STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration
Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption
Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team
Tuesday, February 18, 2020
Adapting the Microcontroller for AI in the Endpoint
Aldec and Codasip at Embedded World: Showcasing an Integrated UVM Simulation Environment for Verifying Custom Instructions with RISC-V Cores
Adesto's EcoXiP™ Octal xSPI Memory Delivers Exceptional System Operation with STMicroelectronics' New STM32H7A3/7B3 and STM32H7B0 MCUs
Accelerating Innovation for Safety Systems with Arm Flexible Access
Car to Cloud: Vehicles Are Getting Connected
Renesas Electronics and Hitachi Develop High-Speed, High-Precision Automotive A/D Converter Circuit With Stable Operation Under Harsh Conditions
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay
Synopsys' Fusion Compiler Adopted by AMD
Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP
CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz
Imagination's RF IP included in Autotalks' PLUTON2 Chipset
Monday, February 17, 2020
Securing Low-Cost Embedded IoT Devices
The US wants TSMC to stop manufacturing chips for Huawei
Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development
Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle
OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor
CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results
CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer
SMIC Reports 2019 Fourth Quarter Result
SmartDV Offers New Design IP for DDR5 and LPDDR5
SiPearl launches its development with 6.2m euros of European funds
Covid-19 Is Crimping the Electronics Industry
Sunday, February 16, 2020
Medical AI: Automate the Important Stuff
RVSoC Offers a Lightweight Linux-Capable RISC-V Core in Just 5,000 Lines of Verilog
The FD-SOI Chip Design Book: Yes, It's Finally Here!
Gen-Z Core Specification 1.1 now available for public download
Launch of SiPearl, designing the microprocessor for the European exascale supercomputer
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