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Thursday, February 27, 2020

• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement

Wednesday, February 26, 2020

• Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones
• GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
• Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform
• PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs
• Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights
• Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020
• Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process
• ESD Alliance Welcomes Avery Design Systems to Member Community
• VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide

Tuesday, February 25, 2020

• Artificial Intelligence Innovation in Taiwan
• All Processing Bends Toward AI
• SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs
• Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols
• UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP
• Menta and Secure-IC partner to optimize embedded cybersecurity
• Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity

Monday, February 24, 2020

• Record shipments of Arm-based chips in previous quarter
• Safety in cars: Infineon's AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018
• Optimizing Automotive Augmented Reality Applications
• RISC-V reference models support processor verification
• RISC-V gaining ground
• BrainChip Featured in ActualTech Media's Emerging AI/ML and Data Science EcoCast
• Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps
• Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution
• SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing
• OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch

Sunday, February 23, 2020

• Why you should care about Bluetooth LE Audio
• Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors
• GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
• Imperas announce first reference model with UVM encapsulation for RISC-V verification
• Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications
• Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis
• NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning
• North American Semiconductor Equipment Industry Posts January 2020 Billings
• Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer
• Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things
• Hex Five Announces MultiZone Security for Arm Cortex?M Series Processors
• Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference
• Intel Announces Unmatched Portfolio for 5G Network Infrastructure
• Arasan Announces immediate availability of its SUREBOOT xSPI Host IP
• UltraSoC launches CAN Sentinel to boost automotive cybersecurity

Wednesday, February 19, 2020

• Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom
• Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)
• Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes
• Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2020
• STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
• Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration
• Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption
• Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team

Tuesday, February 18, 2020

• Adapting the Microcontroller for AI in the Endpoint
• Aldec and Codasip at Embedded World: Showcasing an Integrated UVM Simulation Environment for Verifying Custom Instructions with RISC-V Cores
• Adesto's EcoXiP™ Octal xSPI Memory Delivers Exceptional System Operation with STMicroelectronics' New STM32H7A3/7B3 and STM32H7B0 MCUs
• Accelerating Innovation for Safety Systems with Arm Flexible Access
• Car to Cloud: Vehicles Are Getting Connected
• Renesas Electronics and Hitachi Develop High-Speed, High-Precision Automotive A/D Converter Circuit With Stable Operation Under Harsh Conditions
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay
• Synopsys' Fusion Compiler Adopted by AMD
• Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP
• CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz
• Imagination's RF IP included in Autotalks' PLUTON2 Chipset

Monday, February 17, 2020

• Securing Low-Cost Embedded IoT Devices
• The US wants TSMC to stop manufacturing chips for Huawei
• Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development
• Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle
• OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor
• CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results
• CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
• Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer
• SMIC Reports 2019 Fourth Quarter Result
• SmartDV Offers New Design IP for DDR5 and LPDDR5
• SiPearl launches its development with 6.2m euros of European funds
• Covid-19 Is Crimping the Electronics Industry

Sunday, February 16, 2020

• Medical AI: Automate the Important Stuff
• RVSoC Offers a Lightweight Linux-Capable RISC-V Core in Just 5,000 Lines of Verilog
• The FD-SOI Chip Design Book: Yes, It's Finally Here!
• Gen-Z Core Specification 1.1 now available for public download
• Launch of SiPearl, designing the microprocessor for the European exascale supercomputer