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Thursday, February 13, 2020

• Synopsys Completes Acquisition of Certain IP Assets from INVECAS
• Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand

Wednesday, February 12, 2020

• Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs
• UltraSoC collaborates with PDF Solutions to prevent in-life product failures using end-to-end analytics and advanced machine learning techniques
• XMOS announces world's lowest cost, most flexible AI processor
• Socionext Introduces Time-Sensitive Network (TSN) IP to Realize Smart Factories
• Faraday's AIoT Platform ASIC Solution Escalates System Accomplishment
• Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor
• Cadence Reports Fourth Quarter 2019 Financial Results
• Five Semiconductor Companies Hold 53% of Global Wafer Capacity

Wednesday, February 12, 2020

• TSMC Board of Directors Meeting Resolutions

Tuesday, February 11, 2020

• Mobile World Congress Cancelled
• GSMA Statement on MWC Barcelona 2020 from John Hoffman, CEO GSMA Limited
• Edge Intelligence Ticks Many Boxes For AI
• Full steam ahead for TSMC despite coronavirus
• Synopsys Announces First Application Security Testing Solution to Analyze Both Open Source and Proprietary Code on the Developer's Desktop
• BrainChip's Akida Development Environment Now Freely Available for Use
• Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design
• New Mathematically Lossless Video Compression IP Cores Announced by Hardent
• SmartDV Adds Support for MIPI I3C 1.1 Across Entire IP Portfolio
• UMC Reports Sales for January 2020

Monday, February 10, 2020

• Nokia and SoftBank team up to complete world's first 5G connected car test
• TSMC Board of Directors Meeting Resolutions
• Low-Latency Ethernet MAC IP Core from CAST now ASIL-D Certified

Sunday, February 9, 2020

• Arm Cortex-M55 and Ethos-U55 Processors: Extending the Performance of Arm's ML Portfolio for Endpoint Devices
• New AI technology from Arm delivers unprecedented on-device intelligence for IoT
• Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms
• SEGGER releases Floating-Point Library for RISC-V
• EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency
• TSMC January 2020 Revenue Report
• BrainChip Showcases Vision and Learning Capabilities of its Akida Neural Processing IP and Device at tinyML Summit 2020
• Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor

Thursday, February 6, 2020

• RISC-V Foundation Showcases Unprecedented Momentum and Growth at Embedded World 2020
• SMIC : Donation of RMB 10 million to support the frontline to fight the novel coronavirus epidemic
• Silex Insight launches True 4K Multiview using AV over IP

Wednesday, February 5, 2020

• Embedded controller Floating-Point Library supports RISC-V
• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow
• Acquisition Rebound Lifts 2019 to Third-Largest M&A Year
• Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology

Tuesday, February 4, 2020

• When ADAS Goes People-Blind
• GreenWaves GAP9 AI/IoT ULP app processor on GF's 22FDX to sample H1 2020; mass production 2021
• GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems
• GUC Monthly Sales Report - Jan 2020
• Gartner Says Worldwide Semiconductor Spending Declined in 2019 Due to Slowing Macroeconomy and Falling Memory Prices
• 2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion, SEMI Reports

Monday, February 3, 2020

• Making Kynisys: how we're building the future of AI
• TI's First Automotive SoC with an AI Accelerator Launches
• The First RISC-V Hackathon in Israel
• Synapse Design's Continued Fast Growth Drives Opening of Two Offshore Semiconductor Design Centers
• Worldwide Semiconductor Sales Decrease 12 Percent to $412 Billion in 2019
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems
• China Maintains Chip Output in Wake of Virus Outbreak
• SmartDV Achieves Record Revenue in 2019

Sunday, February 2, 2020

• University of Pittsburgh researchers explore enabling lag-free connections in massive IoT devices
• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow
• Supply Chain Poised for Coronavirus Disruption
• Qorvo Acquires UWB Chip Provider Decawave for $400m
• UltraSoC extends its commitment to Japanese market with appointment of Ryoden
• Semiconductor R&D To Nudge Higher Through 2024
• JEDEC Publishes Update to Universal Flash Storage (UFS) Standard
• Chips&Media Pioneering With The World's First Real-time Multi-Standard Decoder, including AV1, HW IP, WAVE517