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Thursday, October 10, 2024

• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors

Thursday, October 10, 2024

• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices

Wednesday, October 9, 2024

• Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
• Bosch, Tenstorrent to collaborate on standardizing automotive chips
• Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors
• SensiML Expands Platform Support to Include the RISC-V Architecture
• TSMC September 2024 Revenue Report
• Why Chiplets Are the Next Big Innovation in Silicon

Wednesday, October 9, 2024

• LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
• Intel Architects Start RISC-V Business with AheadComputing
• Rambus to Announce Third Quarter Fiscal Year 2024 Results
• Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
• How Poland became key to Europe's semiconductor sovereignty
• MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification

Tuesday, October 8, 2024

• Secure-IC unveils its Securyzrâ„¢ neo Core Platform at Embedded World North America 2024

Tuesday, October 8, 2024

• Silicon Labs Series 3 Platform Guides the IoT Evolution
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
• Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
• OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
• Intel, TSMC to detail 2nm processes at IEDM
• Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets
• Debug and Trace Support for Synopsys ARC-V Processor IP
• Efabless Unveils New Custom Chip Platform Designed for Edge ML Products
• MosChip Reaches Embedded World North America 2024 With its DigitalSky
• Quantum Tunneling and PUFs: The Future of IoT Security

Monday, October 7, 2024

• A New Phase for Quantum Competition in Europe
• Global Semiconductor Sales Increase 20.6% Year-to-Year in August
• UMC Reports Sales for September 2024
• GUC Monthly Sales Report - September 2024
• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
• NVMe Updates Expand Discoverability, Security
• intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
• Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
• PQShield achieves first FIPS 140-3 certification
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
• Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
• Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
• Accelerating Europe's Photonics Lab-to-Fab Journey
• UK announces sustainable electronics centre

Saturday, October 5, 2024

• Samsung ports Tizen OS to RISC-V

Friday, October 4, 2024

• Murata opens silicon capacitor production line at French manufacturing site

Thursday, October 3, 2024

• South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC
• Uncovering Silent Data Errors with AI
• Significant EU funding for VTT's semiconductor development - supporting the growth of the semiconductor industry

Wednesday, October 2, 2024

• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
• Launching MosChip DigitalSkyâ„¢ for Building Connected Intelligent Enterprises
• Xiphera Partners with IPro for the Israeli Chip Design Market

Wednesday, October 2, 2024

• ST and Qualcomm announce strategic wireless/IoT collaboration

Tuesday, October 1, 2024

• Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications
• EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
• Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes

Monday, September 30, 2024

• BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
• Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
• First IBM Quantum Data Centre opens in Europe
• MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
• Samsung's New 3nm GAA Technology Has Failed To Attract New Customers Because Of Unstable Yields, With Industry Watchers Forecasting A $385 Million Loss
• STMicroelectronics and Qualcomm Expand Collaboration to Drive Wireless IoT Solutions
• Synopsys Software Integrity Group Rebrands as Black Duck ‐ A New Era in Application Security
• Will Intel's restructuring affect Samsung's foundry business?

Monday, September 30, 2024

• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIeâ„¢ IP Subsystem with TSMC CoWoS® Technology

Monday, September 30, 2024

• A Q&A with Quantum Systems Accelerator Director Bert de Jong
• M31 Honored with MSCI ESG 'A' Rating ‐ Advancing Toward a New Milestone in Sustainability

Sunday, September 29, 2024

• Breakthrough in lithium-metal solid-state battery technology
• Flexible RISC-V processor offers prospect of low-cost smart objects
• Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
• Paul Williamson on Edge AI, Llama 3.2 on Arm
• Qualcomm and Sequans Complete Sale of 4G IoT Technology
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service
• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology