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Sunday, December 8, 2024

• Samsung foundry 'relief pitcher' Han Jin-man vows to improve 2-nm yields
• Arasan Announces immediate availability of its SPMI IP (System Power Management Interface)
• Sondrel now shipping chips as part of a complete turnkey project
• Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP
• UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application

Thursday, December 5, 2024

• Secure-IC wins KES Innovation Award 2024
• GlobalFoundries Receives Funding to Accelerate GaN Chip Manufacturing
• TSMC Achieves New Milestone With Its 2nm Process, As Trial Production Yields Exceed 60 Percent, Which Was Better Than Expected
• TSMC to Begin Mass Production of 2nm Chips Next Year
• CXL Consortium Announces Compute Express Link 3.2 Specification Release
• Alphawave IP - Announcement regarding leadership transition
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
• Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
• UMC Reports Sales for November 2024
• Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU

Thursday, December 5, 2024

• Samsung Press Conference at CES 2025 'AI for All: Everyday, Everywhere'

Wednesday, December 4, 2024

• Imagination PowerVR Driver Being Extended To Work On RISC-V
• Intel Foundry Fails To Impress Once Again, 18A Process "Yield Rates' Are Reported To Be Only 10% Making Mass-Production Impossible
• YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
• Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
• Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event
• GUC Monthly Sales Report - November 2024

Wednesday, December 4, 2024

• Alphawave Semi Joins UALinkâ„¢ Consortium to Accelerate High-Speed AI Connections

Tuesday, December 3, 2024

• TSMC's Role In Shaping the Global Semiconductor Landscape: Trends And Innovations for 2025
• SiFive Empowers AI at Scale with RISC-V Innovation
• Soitec and Globalfoundries Collaborate in the Production of High-Performance Rf-Soi Semiconductors
• Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program
• Now Gelsinger is gone, what is Intel's Plan B?
• Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
• Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
• AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network
• Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
• X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology

Tuesday, December 3, 2024

• SK Hynix to produce HBM4 on 3 nm foundry process in 2025

Monday, December 2, 2024

• Europe's chip market shrinks as WSTS trims forecasts for 2025
• SmartDV Licenses SDIO IP Family to Ranix for V2X Products
• Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
• Post-Quantum Cryptography: Moving Forward
• Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
• Allegro DVT Launches TV 3.0 Test Suite for Brazil's Next Generation Digital Terrestrial Television System
• Arteris Deployed by Menta for Edge AI Chiplet Platform
• Comprehensive ADC/DAC and AFE IP Solutions: Empowering Next-Gen Applications Across Diverse Technology Nodes

Sunday, December 1, 2024

• IP players prominent in chiplet's 2024 diary
• TSMC 2024 Supply Chain Management Forum Presents Awards to Outstanding Suppliers
• TSMC's Path to Semiconductor Foundry Leadership: Insights from Morris Chang's Memoir
• Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
• Intel Announces Retirement of CEO Pat Gelsinger

Friday, November 29, 2024

• Apple Orders M5 Chips from TSMC for Next-Gen Devices

Friday, November 29, 2024

• Advanced Packaging and Chiplets Can Be for Everyone

Thursday, November 28, 2024

• Interconnected devices and security: how to protect the Internet of Things?
• Advanced Packaging and Chiplets Can Be for Everyone
• VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond
• Germany budgets for extra euro-billions in chip subsidies
• At COP29, Leonardo's solutions to combat climate change
• Infineon wins German Sustainability Award 2025
• Leonardo in EECONE, for a sustainable electronics supply chain

Wednesday, November 27, 2024

• HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications
• Imagination DXS GPU IP recognised as game-changer for the car industry
• Silicon Creations Collaborates with Interex Semiconductor to Distribute High-Performance IPs in India
• Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes

Tuesday, November 26, 2024

• Samsung Electronics Restructures Leadership, Reinforces Focus on Semiconductor Innovation
• TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025
• Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure
• Think Silicon and LVGL Accelerate Graphics Libraries for Microcontrollers