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Tuesday, June 23, 2020

• IAR Systems delivers advanced trace for RISC-V based applications
• Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA
• AI-based cybersecurity: Hype or reality?
• TSMC invested 300 R&D teams to assist Apple in developing Mac chips
• UMC Recognized for Excellence by Texas Instruments
• TSMC has reportedly begun production of the Snapdragon 875 SoC using the 5nm process
• T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm.

Monday, June 22, 2020

• AIoT Chip Slashes Power Consumption for Person Detection
• Adesto Announces Completion of CFIUS Review for Proposed Acquisition of Adesto by Dialog Semiconductor
• Arm Technology Powers the World's Fastest Supercomputer
• Siemens acquires UltraSoC to drive design for silicon lifecycle management
• Rianta Releases 200G/400G Single Channel MAC IP Core

Sunday, June 21, 2020

• GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth
• Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator
• Synopsys Replenishes Repurchase Authorization to $500 Million
• QuickLogic Announces Pricing of $8.75 Million Public Offering of Common Stock
• intoPIX releases the FastTICO-XS SDK v1.2.4 for Nvidia GPU

Thursday, June 18, 2020

• Time to Think About the How and Where of Cryptography
• GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government
• North American Semiconductor Equipment Industry Posts May 2020 Billings

Wednesday, June 17, 2020

• Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization
• Intel's 10nm Node: Past, Present, and Future
• Automotive IC Market Forecast With Strongest CAGR Through 2024
• U.S. Chip Revival Gains Traction
• Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium)
• Intel's 10nm Node: Past, Present, and Future - Part 2
• Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform"
• Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab
• Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring
• Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform
• Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center
• NXP Teams with TSMC on 5nm for Next-Gen Auto Platform
• Where Innovation Is Happening in Geolocation: Signal Processing

Tuesday, June 16, 2020

• Samsung Provides One-Stop Foundry Design Environment with the Launch of 'SAFE™ Cloud Design Platform'
• Siemens extends Xcelerator portfolio to help transform electrical/electronic systems development
• Autonomous Vehicles in Covid Economy
• CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions
• Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC

Monday, June 15, 2020

• Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming
• QuickLogic Announces Open Reconfigurable Computing Initiative
• Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
• Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips

Sunday, June 14, 2020

• Intel's 10nm Node: Past, Present, and Future
• Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud
• Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem
• BrainChip Successfully Launches the Akida Early Access Program
• Embedded Hardware Security Heads to the Edge
• IAR Systems enables secure code with updated MISRA C compliance in leading development tools

Thursday, June 11, 2020

• A guide to accelerating applications with just-right RISC-V custom instructions
• NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform