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Wednesday, June 19, 2019
Western Digital Extends Openness of PlatformIO and Enhances its RISC-V Portfolio to Accelerate Data-Centric Innovation
ON Semiconductor Completes Acquisition of Quantenna Communications
"Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
Purdue & TSMC Partner to Enhance Chip Security
Attopsemi Technology's Notification of Office Relocation
eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar
Tuesday, June 18, 2019
Arm joins Trusted Computing Group, driving towards secure devices everywhere
China sees Taiwan supply chain as alternative to IDMs for power IC devices
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller
Acacia Communications Adopts Cadence Palladium Z1 Enterprise Emulation Platform to Accelerate Optical Networking Development
Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC
U.S. Companies Dominate Worldwide IC Marketshare
PCI-SIG Announces Upcoming PCI Express 6.0 Specification to Reach 64 GT/s
Monday, June 17, 2019
Samsung Electronics to Strengthen its Neural Processing Capabilities for Future AI Applications
"Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth
Can Huawei Survive?
SiFive Enhances Silicon Hills Operations with Office in Austin, Texas
Xilinx Hits Milestone with First Customer Shipments of Versal ACAP
Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Arteris IP FlexNoC Interconnect Licensed by Achronix for New Speedster7t FPGA family
Astera Labs Verifies Its System-Aware PCI Express 5.0 Smart Retimer Using Avery Design Systems PCIe 5.0 Verification IP
Telechips selects PowerVR GPU for Automotive
NVIDIA Brings CUDA to Arm, Enabling New Path to Exascale Supercomputing
Chiplet Ecosystem Slowly Picks up Steam
Sunday, June 16, 2019
At the Paris Air Show 2019 Cobham will be showcasing its unique role in the world.
Introducing Intel's New Network and Custom Logic Group
Global Top Ten Foundries for 2Q19 Perform Less-than-expected Due to Sliding Demand and High Inventories, Says TrendForce
Moortec to Showcase its PVT Monitoring IP at TSMC China Technology Symposium
UltraSoC joins GSA IoT Security Working Group
Can We Believe The Hype About China's Domestic IC Production Plans?
Wednesday, June 12, 2019
Why do Enterprises favor private or hybrid IoT deployments over public clouds?
Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip
UltraSoC strengthens management team with appointment of CFO
X-FAB and Efabless Announce Successful First Silicon of Raven, An Open-Source RISC-V Microcontroller
Mythic Secures $30M in New Financing and Strengthens Leadership Team
Wednesday, June 12, 2019
IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks
Tuesday, June 11, 2019
Media Alert: Cadence to Showcase Aerospace and Defense Solutions at the 2019 International Paris Air Show
Gartner Identifies Five Challenges to Growth and Adoption for Virtual Customers
Report: Apple Still Eyes Intel's Modem Business
AI: Friend or Foe?
Everspin Enters Pilot Production Phase for the World's First 28 nm 1 Gb STT-MRAM Component
Synopsys Achieves ISO 9001 Certification for IP Quality Management System
Global Fab Equipment Spending to Rebound in 2020 with 20 Percent Growth
Magewell Selects Lattice Semiconductor ECP FPGA Family For Video Capture Devices
Monday, June 10, 2019
India's IC Imports Grew Dramatically in 2018, and U.S.-China Trade Tensions Could be a Reason
RISC-V Foundation Announces Call For Papers For The 2nd Annual RISC-V Summit
The Point Where IoT, AI & Quantum Computing Intersect
Cobham Releases New Instruction Simulator for Radiation Hardened Processors
intoPIX Presents the Smart Path for AV Over IP at InfoComm 2019
Intel to Acquire Barefoot Networks, Accelerating Delivery of Ethernet-Based Fabrics
Dream Chip opened new ASIC Design Center in Eindhoven, Netherlands
Silicon-Proven Arteris IP Ncore Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip
Logic Design Solutions Introduces the first NVMe Host IP on PolarFire FPGA
HDL Design House Adds New Representative in Europe
Gyrfalcon's 2803 Plai Plug Development Hardware Delivers 24 TOPS/W for AI From Edge to Cloud
Sunday, June 9, 2019
Andes Technology Launches RISC-V FreeStart Program with its Commercial-Grade CPU N22
UMC Reports Sales for May 2019
Imperas and Metrics Collaborate to Jump Start RISC-V Core Design Verification Using Open Source Instruction Stream Generator
TSMC May 2019 Revenue Report
CEVA Collaborates with Ellisys to Achieve SIG Qualification for its Bluetooth 5.1 Low Energy IP
Space Codesign Systems Announces Support of Zynq UltraScale+ MPSoC
SingMai offer universal encoding and decoding of analogue video
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