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Thursday, June 6, 2019
Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards
GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center
SiFive Celebrates Historic 100 Design Win Milestone
SiFive Secures $65.4 Million In Series D Funding
Imperas delivers first RISC-V Simulator for new Vector and Bit Manipulation specifications to Lead Customers
Wednesday, June 5, 2019
ARM gets a rival as AMD licenses graphics IP to Samsung
Achronix Chooses Rambus GDDR6 PHY IP for Next-Generation FPGA
Side-Channel Attacks on Embedded Processors
OpenHW Group created and announces CORE-V family of open-source cores for use in high volume production SoCs
Lattice Diamond 3.11 Software Adds Support for New MachXO3D FPGA
GUC Monthly Sales Report - May 2019
Communications IC Market to Again Surpass Computer IC Market
Tuesday, June 4, 2019
Marvell Extends Strategic Partnership with Arm
HBM2e Top Contender for AI Applications
First steps towards a made-in-Europe high-performance microprocessor
Faraday Adopts Synopsys SpyGlass Design Handoff Kit to Ensure High Design Quality
Avery Design Systems Announces SimCluster GLS to Accelerate Gate-Level Sign-Off Simulations
Inside Secure Releases Industry's First Tool to Quickly, Graphically Create Secure Crypto Architectures
Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in April; 12 Percent Decrease in Annual Sales Projected for 2019
Monday, June 3, 2019
NI, Tessolve, and Johnstech Collaborated To Develop A Quad-site mmWave 5G Packaged Test Solution
Efabless Collaborates with GLOBALFOUNDRIES to Enable New IP Development Models for Emerging Applications
Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP FinFET Process
Avery Design Systems Announces SymXprop for X Accurate RTL Simulation
Thalia DA attracts $2m investment to grow analog IP re-use platforms
Synopsys Fusion Design Platform First to be Certified by Samsung Foundry for 5LPE Process with EUV Technology
Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program
Cadence Introduces the Spectre X Simulator, a Massively Parallel Circuit Simulator Delivering Up to 10X Faster Simulation with the Same Golden Accuracy
Socionext Adopts the Cadence Full-Flow Digital and Signoff Tools for 7nm Designs
True Circuits Demonstrates Silicon Proven DDR 4/3 PHY at the Design Automation Conference
Wave Computing and Imperas Introduce New MIPS Open Simulator - MIPSOpenOVPsim
Analog Bits and GLOBALFOUNDRIES Deliver Differentiated Analog and Mixed Signal IP for High-Performance Mobile and Compute Applications
First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year
Truechip Offering complimentary licenses of PCIe Gen 3 Verification IP
ASPEED Technology adopts M31 Technology MIPI D-PHY IP to provide global 360-degree imaging SoC solution
Omni Design Demos Hyperon 14-bit 1.2Gsps ADC at the 2019 Design Automation Conference in Las Vegas
Sunday, June 2, 2019
SolidRun and Gyrfalcon Team Up to Accelerate On-Device AI Performance with Powerful New i.MX 8M Mini SOM
AMD and Samsung Announce Strategic Partnership in Ultra Low Power, High Performance Graphics Technologies
Fab Joint Venture Seen for 200 mm
Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure
UltraSoC embedded analytics selected to support Wave Computing's TritonAI 64 IP platform
Intel Says EUV Ready, Challenging
Avatar Integrated Systems Physical Implementation Tool Certified on TSMC 7nm FinFET Process
NXP to acquire Marvell's WiFi and Bluetooth Connectivity Assets
Gyrfalcon offers Automotive AI Chip Technology
Silvaco and Si2 Release Unique, Free 15nm Open-Source Digital Cell Library
Infineon to acquire Cypress, strengthening and accelerating its path of profitable growth
Wednesday, May 29, 2019
Synopsys Design and Verification Solutions Enable Astera Labs to Develop Industry's First PCIe 5.0 Retimer SoC
Synopsys Extends Leadership with Enhanced Verification Continuum Platform
Global top-3 memory vendors to see sales hit bottom in 2Q19, says Digitimes Research
SMIC Delisting Raises Question Mark Over China Tech
Moortec to Showcase its High Accuracy Embedded Sensing Fabric at DAC 2019 in Las Vegas
Efinix and M31 Technology Corporation Partner to Address Demand for Emerging AI Edge Computing Requirements
Pixilica Licenses SiFive's RISC-V Embedded Processor IP
PCI-SIG Achieves 32GT/s with New PCI Express 5.0 Specification
Tuesday, May 28, 2019
Q'comm Cites U.S. Security in Appeal
Functional Safety for Automotive HMI Systems
Renesas Electronics Offers Complete Automotive Integrated Cockpit Reference Solution Based on R-Car System on Chip
Arm portrays its strategy for machine learning at the edge
Edge AI Going Beyond Voice and Vision
Mentor's new Calibre Recon functionality methodically analyzes "early draft" IC designs for faster verification
Globalfoundries use AR Glasses in Fab
Mixel MIPI D-PHY IP Integrated into Teledyne e2v Snappy CMOS Image Sensors
Silvaco Announces Viola I0-X - 10X Faster I/O Pad Characterization for Nanometer Silicon
BrainChip Announces the Availability of Advanced AI Intellectual Property
MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices
Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible!
Monday, May 27, 2019
Companies Pushing Open Source RISC-V Silicon Out to the Edge
Arm unveils new solutions for premium smartphones in 2020
Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization
IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks
Cadence Launches Protium X1, the First Scalable, Data Center-Optimized Enterprise Prototyping System for Early Software Development
NVIDIA Deploys the New Cadence Protium X1 Platform to Accelerate Software Development of Large-Capacity GPUs
Sofics' clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces
Hex Five Adds MultiZone Security to the AdaCore Software Ecosystem
Monday, May 27, 2019
Sankalp Semiconductor Expands International Operations in Japan
Sunday, May 26, 2019
Faraday Showcases FinFET ASIC Solutions and SoCreative!V SoC Platform at DAC 2019
Thinci Deploys Full Cadence Verification Suite for AI Designs, Accelerating Project Schedule by Months
Credo First to Demonstrate 7nm, 112G XSR SerDes
Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors
eSilicon Technical Advisory Board Members Win Facebook Research Award
Delivering next-generation AI experiences for the 5G world
Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU
TSMC to Keep Supplying Chips to Huawei
OneSpin's Newest App Assures Quality of RISC-V Processor Cores for Safety-, Security-Critical Applications
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