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Monday, April 29, 2019

• China Exodus as Tech Returns to Taiwan
• RISC-V Foundation Announces Agenda For RISC-V Workshop Zurich
• Synopsys Launches New VESA DSC IP for Visually Lossless Compression in Mobile, AR-VR, and Automotive SoCs
• Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop
• Survey: China's Fabless IC Firms Optimistic on Sales Growth
• Global Semiconductor Sales Down 15.5 Percent in First Quarter of 2019
• Multiple Arteris IP FlexNoC Interconnect Licenses Purchased by VeriSilicon for Multiple Chip Designs
• eSilicon Expands Technical Advisory Board
• GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing

Sunday, April 28, 2019

• 4 reasons to use RISC-V for aerospace and defense applications
• eSilicon Signs Multi-Year Agreement with Google Cloud
• SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Design
• ARM, MIPS, Imagination lose IP market share
• Intel Cuts 2019 Sales Forecast
• Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017
• Arm announces appointment of Inder Singh as Chief Financial Officer

Friday, April 26, 2019

• TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement

Thursday, April 25, 2019

• Intilop Delivers Their Enhanced One Thousand TCP/UDP Session Hardware Accelerator and Kernel Bypass Linux Driver for Hyper-Performance Networking Systems

Wednesday, April 24, 2019

• 60+ IoT statistics and facts
• UK to give Huawei limited role in building 5G network: Report
• TSMC Steps Through 7, 6, 5, Moore
• Xilinx to Acquire Solarflare
• Xilinx Reports Record Revenues Exceeding $3 Billion For Fiscal 2019
• Tamba Networks' IP Selected for Innovium's TERALYNX 12.8 Tbps Data-Center Optimized Switch

Tuesday, April 23, 2019

• Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud"
• UMC Reports First Quarter 2019 Results
• Samsung Electronics to Invest KRW 133 Trillion in Logic Chip Businesses by 2030
• US, China Heading Towards Tech Cold War
• Intel launches latest-generation CPUs for mobile
• Teledyne Imaging to showcase its advanced mapping, object recognition and tracking technology at AUVSI 2019
• Synopsys Design Platform Certified for TSMC's Innovative SoIC Chip Stacking Technology
• North American Semiconductor Equipment Industry Posts March 2019 Billings
• Docker and Arm Partner to Deliver Frictionless Cloud-native Software Development and Delivery Model for Cloud, Edge, and IoT
• Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology
• Mobiveil, Inc. today announced availability of its PCI Express 5 controller IP

Monday, April 22, 2019

• Infineon is outgrowing all other leading suppliers of automotive semiconductors
• Synopsys Named a Leader in the Gartner Magic Quadrant for Application Security Testing for Third Consecutive Year
• Mentor certified for latest TSMC 5nm FinFET process and innovative TSMC-SoIC 3D chip stacking technology
• Radiant 1.1 Lattice FPGA Design Tools Release Accelerates Design Reuse
• Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology
• Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process
• Analog Bits Showcases PCIe Gen2 / Gen3 / Gen4 Reference Clock PHY Design Kits Available on TSMC 7nm / 12nm / 16nm / 22nm process technology
• Mobiveil's GPEX IP with PCI Express 5.0 technology support to be made available in End Point, Root Complex, Dual mode and Switch configurations with Configurability, Reliability and Serviceability
• Tortuga Logic and Synopsys Collaborate to Deliver System-Level Security to SoCs Built with Synopsys DesignWare ARC Processor IP
• Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips
• Rambus Reports First Quarter 2019 Financial Results
• TSMC Celebrates 25th Anniversary of the North American Technology Symposium
• Silvaco Opens Chengdu Office to Support Company's China Expansion and Growing Demand for Power Semiconductor Design Solutions
• Cadence Reports First Quarter 2019 Financial Results
• Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Apr 2019)
• Alphawave Joins TSMC IP Alliance Program

Sunday, April 21, 2019

• Andes Launches First DSP Instruction Set for RISC-V Multi-Core Processors to Challenge the HPC Marke
• Machine Learning on DSPs: Enabling Audio AI at the Edge
• Graphcore CEO Touts 'Most Complex Processor' Ever
• Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
• Desay SV Standardizes on Synopsys Virtualizer Virtual Prototyping Solutions
• RISC-V, DARPA Advance Security
• TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm FinFET Process Technology
• ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility

Friday, April 19, 2019

• Mercury Systems Announces Acquisitions of The Athena Group and Syntonic Microwave

Friday, April 19, 2019

• Arm China selects Mentor's Questa Verification Solution to enhance power efficiency and speed development of MCU designs

Wednesday, April 17, 2019

• Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems
• Allegro DVT Introduces the Industry First Real-Time AV1 Video Encoder Hardware IP for 4K/UHD Video Encoding Applications
• Globalfoundries' Morgenstern: Diversity is key in Dresden
• TSMC Reports First Quarter EPS of NT$2.37
• Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers
• Safety, cybersecurity and cost delaying mass deployment of autonomous cars