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Thursday, November 7, 2019

• Are Smartphones Equipped to Control a Vehicle?
• UMC Reports Sales for October 2019
• TSMC October 2019 Revenue Report
• MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology

Wednesday, November 6, 2019

• Abaco Announces Industry's First 6U VPX Solution to Feature New Xilinx RF System-on-Chip Technology
• Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung
• CEVA, Inc. Announces Third Quarter 2019 Financial Results
• SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

Tuesday, November 5, 2019

• Applause's new AI solution helps tackle bias and sources data at scale
• Wireless 3D Integration – Making Stacking Silicon as Easy as Stacking Lego (1/2)
• Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis
• Announcing OpenTitan, the First Transparent Silicon Root of Trust
• Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
• Marvell Completes Acquisition of Avera Semi
• GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

Monday, November 4, 2019

• Wearable AI market to cross $180bn frontier by 2025
• 6 MEMS and Sensors Startups on Fast Track to Grow
• Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
• Rambus Reports Third Quarter 2019 Financial Results
• AdaCore Introduces Support for C++ Embedded Environments
• GUC Monthly Sales Report - Oct 2019
• IAR Systems delivers development from device to cloud through integration with Amazon Web Services
• Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program

Sunday, November 3, 2019

• TSMC adding 8,000 new jobs as it focuses on 3nm and beyond
• Faraday Reports Third Quarter 2019 Financial Results
• OPENEDGES unveils high performance & low power GDDR6 controller IP
• UltraSoC furthers academic support with Europractice partnership
• Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September
• Palma Ceia SemiDesign Establishes United Kingdom Center
• Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications
• Xilinx Alveo Accelerators Power SK Telecom's Real-Time AI-based Physical Intrusion and Theft Detection Service

Wednesday, October 30, 2019

• The Linley Group Microprocessor Report Highlights BrainChip's Akida™ Spiking-Neural-Network Processor
• China IC 'Big Fund' Phase II Aims Self-Sufficiency
• DMP adopted for NEDO project of "Survey of issues for finding ideas regarding Technology Development for AI Chip and Next-generation Computing for High-efficiency and High-speed Processing"
• China GDP and PMI Contraction A Risk Factor For Global Economy
• How to Choose Between AI Accelerators
• CEVA Appoints Bernadette Andrietti to its Board of Directors
• AI Takes Over Linley Fall Processor Conference
• Cadence Presented with Four 2019 TSMC Partner of the Year Awards
• Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps

Tuesday, October 29, 2019

• Synopsys and AMD Execute Multi-Year ZeBu Emulation Agreement
• Silex Insight Fast-track FIPS 140-2 Certification with NIST-Validated Crypto Coprocessor
• GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure Business

Monday, October 28, 2019

• David Zinsner Appointed to Credo Board of Directors
• Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers
• Pre-Silicon Security Assessment
• TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
• Synopsys Ships More Than 3,000 HAPS-80 Prototyping Systems
• Achronix and BittWare Launch VectorPath Accelerator Card with Speedster7t FPGAs
• 'The AI Inference Processor is Dead'
• Hex Five Adds MultiZone Security Isolation with Micron's Authenta Flash
• AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity
• Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools
• Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process
• Arm to Deliver CHERI-based Prototype to Tackle Security Threats