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Monday, April 15, 2019

• China and its Pursuit for Chip Self-Sufficiency (Part 2)
• Life After Nokia
• Silvaco Joins SEMI, and Electronic System Design Alliance, a SEMI Strategic Association Partner
• Don't Worry, Be H(AI)ppy
• Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities
• Cobham Processor Technology Powers Commercial NanoSatellite
• Intel Acquires Omnitek, Strengthens FPGA Video and Vision Offering
• Omnitek achieves world-leading CNN performance per watt in a midrange programmable device.
• Arteris IP FlexNoC Interconnect Licensed by DisplayLink for Systems-on-Chip
• Fujitsu Begins Production of Post-K
• TSMC Unveils 6-nanometer Process
• Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits

Sunday, April 14, 2019

• EDA Industry Revenue Grows for Full Year 2018 but Slows for Fourth Quarter

Friday, April 12, 2019

• DynapCNN - the World's First 1M Neuron, Event-Driven Neuromorphic AI Processor for Vision Processing

Thursday, April 11, 2019

• Countdown: How Close is China to 40% Chip Self-Sufficiency?
• Ampere Computing raises new round of capital, including new investor Arm

Wednesday, April 10, 2019

• New sensor makes it easy for manufacturers to implement IIoT solutions
• Qorvo to Acquire Active-Semi International
• SiFive Tapes Out First in a Series of 7nm IP Enablement Platforms
• CEVA Wins 2018 CEM Editor's Choice Award for its NB-IoT IP Solution
• Gartner Says Worldwide Semiconductor Revenue Grew 12.5 Percent in 2018

Tuesday, April 9, 2019

• Qorvo to Acquire Active-Semi
• SmartDV's DVCon China Exhibit to Showcase Extensive Verification IP Portfolio
• TSMC March 2019 Revenue Report
• Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost
• 2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion
• SiFive Launches the World's Smallest Commercial 64-bit Embedded Core
• Wave Computing Unveils New Licensable 64-Bit AI IP Platform to Enable High-Speed Inferencing and Training in Edge Applications
• Creonic Shows 100 Gbps Polar Decoder in International SENDATE-TANDEM Research Project
• Michael Boukaya Promoted to Chief Operating Officer of CEVA, Inc.

Monday, April 8, 2019

• Synaptics Selects and Designs SiFive Custom E2 Series Core IP in Record Time
• First software-driven JPEG XS solutions demonstrated by intoPIX at NAB Show 2019.
• Numem Inc. Exhibits at IP-SoC Santa Clara 2019
• UMC Reports Sales for March 2019
• Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs
• Vidatronic Announces Series of 40 nm Integrated Power Management Unit (PMU) IP Cores Optimized for Wireless and NB-IoT Applications

Sunday, April 7, 2019

• intoPIX TICO-RAW technology to simplify and improve image signal processing of next-gen 4K & 8K cameras at NAB Show 2019
• Intrinsic ID's BroadKey Delivers Hardware Root-of-Trust Security at Core of Authentico's New Password Security System
• GUC Monthly Sales Report - March 2019
• Andes Records a Rapid Growth of Design Wins in 2018 For Its New Family of RISC-V Processor Cores
• Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC Santa Clara 2019
• Sofics Releases Analog IO's and ESD protection clamps for Advanced Applications using TSMC 7nm FinFET process
• intoPIX announces availability of TICO-XS IP-cores supporting HD and 4K with a low FPGA footprint at NAB 2019

Wednesday, April 3, 2019

• PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric
• V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding
• SIA calls for more government support for semiconductor industry
• Autonomous challenges