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Monday, April 1, 2019

• How the global IP market looks from the heart of China's high-tech industry
• AI: Market Trader and Market Cop
• New high-speed GigE Vision cameras enable smooth transition from CCD to CMOS imaging
• Chip Firms Expect IoT to Be Key Revenue Driver
• SiFive To Present At Leading IP, Processor Conferences
• Cadence Eyes System Analysis Market
• Global Semiconductor Materials Sales Hit New High of $51.9 Billion
• Silex Insight expands into North America with opening of Silicon Valley office
• Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips
• Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
• Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February
• proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
• Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform
• Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners

Sunday, March 31, 2019

• Processors, Sensors Drive Embedded Vision
• SMIC Rift: Rare Peek into China IC Industry
• Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
• Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology
• Renesas Completes Acquisition of Integrated Device Technology
• Omnitek Releases Highly Optimised 3D LUT IP for FPGAs
• SMIC Announces 2018 Annual Results
• Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara
• The MOST Ultimate OTP Technology - AGIC Particle Momentum

Thursday, March 28, 2019

• Wave Computing Releases First MIPS Open Program Components to Accelerate Innovation for Next-Generation System on Chip Designs

Thursday, March 28, 2019

• Cadence Collaborates with Northrop Grumman on Chip Design

Thursday, March 28, 2019

• Efinix Transitions Trion T20 FPGAs to High-Volume Production

Wednesday, March 27, 2019

• PathPartner Technology Opens New European Office in Frankfurt
• SMIC Rift: Who's in Charge of China's Chip Industry?
• nnMAX™ Inference Acceleration Architecture presented by Flex Logic at the Autonomous Vehicle Hardware Summit
• Visit D&R at IP SoC 19
• EnSilica at IoT Tech Expo - Global London, 2019
• Top court's new IP tribunal upholds French firm's patent
• Top 10 China's most innovative companies
• Tsinghua Poaches Talent to Aid China's Faltering DRAM Industry

Tuesday, March 26, 2019

• ON Semiconductor Reaches Key Milestones in Roznov Facility Expansion
• ON Semiconductor to Acquire Quantenna Communications
• MIPI Alliance Announces Annual Membership Award Recipients
• Q1 Forecast Disappointing for Foundry Sales
• Synopsys Announces Collaboration with Samsung Foundry to Offer Secure and Scalable Environment on the Cloud for IC Design and Verification
• CyberX Capitalizes on IIoT Security Momentum with Additional $18 Million in Strategic Funding
• Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes
• Nextera Video Announces NMOS IS-08 as the Latest Addition to their Industry-Leading 2110 Video Over IP FPGA Core Set
• Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity
• U.S. Companies Continue to Represent Largest Share of Fabless IC Sales
• Arm Pelion IoT platform provides foundation for comprehensive IoT utility deployments
• Moore's Law Ending? No Problem

Monday, March 25, 2019

• KT and Samsung Achieve 1Gbps Speed Over the Air on the 5G Commercial Network in Seoul
• A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging
• Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market
• UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development
• Apple v. Q'comm Cases and Impacts
• Intrinsic ID's Hardware Root of Trust IP Selected by Tyrion Integration for Industry 4.0 IoT Security in Oil & Gas Deployment
• REALSEC includes Silex Insight high performance crypto IP for all their HSM solutions
• China Lures SMIC Co-CEO Zhao
• Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research

Sunday, March 24, 2019

• A Chinese Perspective: Is the U.S. Ahead in AI?
• New Merced EOS S3AI HDK from QuickLogic Enables Fast AI Endpoint Solution Development
• Cortus Announces the General Availability of a RISC-V Processor Family - from Low End Embedded Controller to 64 bit Processor with Floating Point.

Saturday, March 23, 2019

• Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry

Friday, March 22, 2019

• SCALINX expansion continues with ASIC design center in Caen, France

Friday, March 22, 2019

• Wave Computing Appoints Michael Schroeder as Chief People Officer To Help Drive Company's Global Expansion Plans

Friday, March 22, 2019

• North American Semiconductor Equipment Industry Posts February 2019 Billings

Wednesday, March 20, 2019

• Synopsys Introduces New embARC Machine Learning Inference Software Library for Power-Efficient Neural Networks
• DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia
• Sonics and Arteris IP Agree to Dismiss Litigation
• sureCore Delivers Customised Low Power SRAM for Data Intensive Designs
• WIPO 2018 IP Services: Innovators File Record Number of International Patent Applications, With Asia Now Leading
• Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications
• InSync Technology Ltd Adopts the Adeas/Nextera ST2110 IP Core Set