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Thursday, September 26, 2019
GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy
Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards
Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology
Multiple Mentor product lines now certified on TSMC's most advanced processes
GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
Wednesday, September 25, 2019
New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness
Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing
Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
SiFive Announces Key Enablement Of Trace And Debug
Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available
Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices
Truechip Announces First Customer Shipment of CXL Verification IP
Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process
TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools
Tuesday, September 24, 2019
Alibaba unveils new AI chip aimed at speeding up e-commerce and cloud computing tasks
No-Shows Blight AI Hardware Summit
Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform® Ecosystem Forum in Santa Clara
Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies
Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V
Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform
Breker Verification Systems Unveils Intelligent Regression Optimization Solution to Accelerate Simulation, Emulation Execution
M31 Technology Develops Optimized IP Solutions on Multiple TSMC Specialty Processes
Kandou Secures $56 Million in Series C Funding
UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor
European Space Agency Selects AdaCore's Qualified Multitasking Solution for Spacecraft Software Development
Achronix Joins TSMC IP Alliance Program
Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs
CEO Leaves Wave, Putting MIPS' Future in Doubt
Veriest announces opening of Budapest office
Monday, September 23, 2019
Tessolve Proudly Announces The Launch Of 'Qubo' By It's Parent Company Hero Electronix
Synergy between the Arm ecosystem and OCP communities to support the growth of compute infrastructure
Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions
GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications
eMemory Wins 2019 TSMC IP Partner of the Year Award
Andes Technology Features 32-bit A25MP and 64-bit AX25MP RISC-V Multicore Processors With Andes Custom Extension at TSMC 2019 Open Innovation Platform Ecosystem Forum
CSEM joins GLOBALFOUNDRIES' FDXcelerator Program bringing ultra-lowPower IP to 22FDX process
Sunday, September 22, 2019
North American Semiconductor Equipment Industry Posts August 2019 Billings
Dolphin Integration becomes Dolphin Design
Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem
eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum
Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
IAR Systems launches functional safety tools for STMicroelectronics' 8-bit MCUs
Spectral Design and Test Inc., Announces a New Family of MemoryIP Targeted at the 5G Market
Cambridge Consultants Becomes Arm Approved Design Partner
Avery Design Partners with Marquee Semiconductor to Provide Sales, Support in India, and Deepens its Relationship to Prime Marquee's SoC Solution Platform
Avery Design Introduces CXL VIP
Thursday, September 19, 2019
CAST CAN 2.0/FD Bus IP is Safety-Ready with ISO 26262 Certification
Attopsemi Technology Presented "I-fuse: Dream OTP Finally Comes True" and won the best Innovative IP award on IP SoC 2019 China
Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Sutardja Has Joined Its Board of Directors
Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners
Xilinx Announces Chief Financial Officer Transition
Wednesday, September 18, 2019
Intensivate Engages SiFive's RISC-V Expertise to Develop Leading Accelerator
5G和电动汽车市场快速发展,SOI晶圆会缺货吗?
Semiconductor Acquisitions Regain Momentum in 2019
SEGGER Makes Its Entire Ecosystem of Tools Available for AndesCores
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies
Tuesday, September 17, 2019
5倍产能爬坡,FD-SOI的体量又庞大了一圈
Compute Express Link Consortium (CXL) Officially Incorporates; Announces Expanded Board of Directors
Faraday's SoC Projects Doubled for Three Consecutive Years
Veriest kick-starts Formal Verification methodology at Valens
Monday, September 16, 2019
Intrinsic ID Security Summit 2019
LIWEST Becomes Latest Austrian Operator to Evolve IPTV Security with Verimatrix and Ocilion
ESD Alliance Reports EDA Industry Revenue Increase for Q2 2019
SmartDV Announces Availability of Ethernet TSN Design IP
CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines
Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Saturdja Has Joined Its Board of Directors
Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications
Notes from 7th Shanghai FD-SOI Forum held on September 16, 2019
Mixel's MIPI D-PHY IP Integrated into Microsoft's Azure Kinect DK Depth Camera
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