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Sunday, November 24, 2024

• GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform
• US backs GlobalFoundries' semiconductor growth with $1.5 billion
• Role of FD-SOI in Powering AI-Driven IoT Applications
• Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP

Friday, November 22, 2024

• Redefining Hearing Aids with Cadence DSPs

Thursday, November 21, 2024

• HPC customer engages Sondrel for high end chip design
• EU looks to change rules on technology transfer, patent pools

Wednesday, November 20, 2024

• Universal AI RISC-V processor does it all - CPU, GPU, DSP, FPGA
• Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
• TSMC drives A16, 3D process technology
• Solid Sands and VyperCore Collaborate to Ensure C/C++ Compliance in New Accelerator Chip Design
• SC24 Observations: China, Politics, RISC-V and CXL
• Optical Transmission Modulation Methods Advance
• GlobalFoundries awarded $1.5bn subsidy
• Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
• China's Huawei, SMIC 'to Ramp Production' of Newest AI Chip
• Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy

Tuesday, November 19, 2024

• Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
• Nordic Simplifies Wireless Integration With New Low-Power SoCs
• Japan proposes $1.3bn investment in Rapidus
• GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing
• Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
• CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
• Capgemini, Mistral AI and Microsoft collaborate to further accelerate adoption of generative AI technologies
• Cadence Unveils Arm-Based System Chiplet

Monday, November 18, 2024

• Infineon and Siemens collaborate to bring AURIX TC4x to next generation software-defined vehicles
• Dnotitia Unveils the World's First Hardware-Accelerated Vector Database, Seahorse, at Super Computing 2024
• CAST Adds New SafeSPI Controller to its Functional Safety IP Core Product Line
• Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards

Sunday, November 17, 2024

• SLS Launches Industry-First USB 20Gbps Device IP Core
• QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
• NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders
• Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
• Credo Completes First GHG Emissions Calculation, Strengthens Commitment to Environmental Sustainability
• Climate-friendly electricity is derived from ammonia

Friday, November 15, 2024

• Siemens Launches TIA Portal Version 20 Focused on Improved Performance
• RISC-V for HPC at SC24

Thursday, November 14, 2024

• TSMC grabs US$11 billion for Arizona fabs from US Chips Act
• Siemens presents next-generation AI-supported software for electronic system design
• QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
• Imec Chipset Alliance Aims to Expand AI to Cars
• Imec Chiplet Alliance Aims to Expand AI to Cars
• Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production
• Alphawave Semi Partners with PCISig, CXL Consortium, UCIe Consortium, Samtec and Lessengers to Showcase Advances in AI Connectivity at Supercomputing 2024
• AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market

Wednesday, November 13, 2024

• Renesas' New R-Car SoC Supports Centralized Car Compute
• Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology

Tuesday, November 12, 2024

• What RISC-V Means for the Future of Chip Development