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Tuesday, March 5, 2019

• Cryptographers See Danger in Encryption Laws
• New SK Hynix China fab nears completion
• Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment
• Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon
• Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC
• MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts

Monday, March 4, 2019

• Broadcom Ranked as No. 1 Fabless Chip Vendor
• Mine Cryptocurrencies Sooner (Part 1)
• Arteris IP FlexNoC Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips
• Esperanto Technologies Appoints Nick Aretakis as VP of Sales and Marketing
• GUC Monthly Sales Report - Feb 2019
• Synopsys to Showcase Design and IP Solutions for Optical Datacom and Hyperscale Data Centers at OFC 2019
• Global Semiconductor Sales Down 5.7 Percent Year-to-Year in January
• Crowded AI Chip Market Still Has Room for New Entrants According to New Linley Group Study

Sunday, March 3, 2019

• IoT Devices Need to be Smarter
• Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution
• Intrinsic ID's Scalable Hardware Root of Trust IP Delivers Device Authentication for IoT Security in NXP LPC Microcontroller Portfolio
• Advanced Nodes Face Edge Errors
• Global Top Ten IC Design Companies Ranked by Revenue; Only Qualcomm and MediaTek Suffered Decreases
• USB Promoter Group Announces USB4 Specification

Friday, March 1, 2019

• Comment: GloFo gets warm words, but for how long?

Friday, March 1, 2019

• Inside Secure Announces the Closing of the Acquisition of Verimatrix

Friday, March 1, 2019

• Wave Computing's MIPS Processors Power 80% of Today's ADAS-Enabled Automobiles

Friday, March 1, 2019

• Gen-Z ecosystem expands with new technology solutions

Thursday, February 28, 2019

• Thales and Telstra Join Forces to Unlock the Potential of Low-altitude Airspace

Wednesday, February 27, 2019

• SiFive Welcomes Former Intel Capital VP to Executive Team
• WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
• Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications
• 97 IC Wafer Fabs Closed or Repurposed During Past 10 Years
• Inside Secure Selected by ATsolutions to Provide Market-Leading Code Protection for its Banking and Credit Card Apps

Tuesday, February 26, 2019

• Synopsys' New Enhanced Security Package for ARC HS Processors Protects Embedded Systems Against Evolving Threats
• KEPCO Partners with Inside Secure to Further Bolster Protection for Latest Chips Used in IoT Devices
• Chips&Media announced licensing of Image Signal Processing (ISP) to one of leading SoC developer targeting advanced automotive applications such as ADAS and Autonomous Driving
• Inside Secure Selected by HiSilicon to Protect Device Secrets throughout Manufacturing Process
• OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
• Silvaco Opens Shenzhen Office to Support Company's Asian Expansion and Growing Demand for Semiconductor Design Solutions
• Arm and China Unicom Sign Partnership Agreement to Drive IoT Adoption in China
• Minima Processor and Arm Collaborate on Ultra-Low Power Solutions for Mobile and IoT

Monday, February 25, 2019

• Synopsys to Showcase its Leading Prototyping, IP, and Software Integrity Solutions at Embedded World 2019
• intoPIX previews JPEG XS technology for remote production and studio-over-IP applications at VidTrans 2019
• New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications
• CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab
• UltraSoC demonstrates advanced multicore debug at Embedded World 2019
• The Qt Company and Inside Secure to Offer Joint Integrated Solutions for Creating Secure IoT and Embedded Devices
• Cobham Joins RISC-V Foundation
• Faraday Reports 2018 Annual Revenues of NT$4.91 Billion, NRE NT$1.3 Billion, up 107% YoY; 2018 Gross Margin was 53.1%, a 11 Year High
• DinoplusAI Partners with SiFive to Develop Mission-Critical AI Processor Platform for High Performance Processing with Ultra-Low Latency
• Inside Secure launches Flexible Secure Provisioning to Easily Protect Connected Devices Secrets' During Manufacturing Process
• Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor
• Silvaco, Inc. and Avery Design Systems Partner to Deliver Complete CAN-FD Automotive and MIPI I3C IP and VIP Solutions
• AIStorm Introduces Real-Time AI-in-Sensor Solutions for Driver Assistance, Mobile Handsets, Cameras, and IoT
• Imagination and Andes collaborate to enable ultra-low power connected microprocessors for IoT

Sunday, February 24, 2019

• GOWIN Semiconductor Announces Release of the New GOWIN EDA Tools for Improved Performance on New FPGA Product Families
• Tiempo Secure lowers entry barriers to securing the Internet of Things with its CC EAL5+ grade Secure Element IP macro dedicated to secure Systems-on-Chip
• Racyics extends its Silicon Proven ABB IP Portfolio
• New SoC Security Platform Announced by CAST and Beyond Semiconductor
• Hex Five and wolfSSL Announce the First Secure IoT Stack for RISC-V
• North American Semiconductor Equipment Industry Posts January 2019 Billings
• PSA Certified: Building Trust in IoT
• TRUECHIP Introduces TruEYE -The Debug GUI - A Unique tool for design & verification
• Syntiant Brings Speech Interfaces to the Edge With New Ultra-Low-Power Neural Decision Processors
• GreenWaves Technologies Announces 7M Euros Series A Funding
• Synopsys and Palma Ceia SemiDesign Collaborate to Develop a Complete Hardware/Software NB-IoT IP Solution
• Infineon, Xilinx and Xylon team up for new microcontroller solutions in safety-critical applications
• Arm and Vodafone Commit to Work Together to Simplify Internet of Things (IoT) Deployment
• Arm and Leading Test Laboratories Unveil Independent Security Certification for IoT Devices
• Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
• Cadence Drives Release of Alternative EVS Codec Implementation in 3GPP