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Tuesday, February 19, 2019

• Arm announces Neoverse N1 platform & Neoverse E1 platform built for cloud to edge infrastructure
• Globalfoundries sees success for its diversification strategy
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP
• CEA-Leti & Stanford Target Edge-AI Apps with Breakthrough NVM Memory Cell
• Synopsys Fusion Design Platform Enables Successful Tapeout of Samsung Foundry's Industry-first Gate-All-Around Transistor SoC
• Intel Says FinFET-based Embedded MRAM is Production Ready
• GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology
• Samsung, Toshiba Detail AI Chips
• CoreHW launches a highly accurate indoor positioning solution
• UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing
• Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market
• JEDEC Updates Standard for Low Power Memory Devices: LPDDR5
• Cadence Reports Fourth Quarter and Fiscal Year 2018 Financial Results
• Xpeedic's IRIS Qualified on GLOBALFOUNDRIES 12LP Process for High-Performance Applications
• 25 Gigabit Ethernet Consortium Offers Low Latency Specification for 50GbE, 100GbE and 200GbE HPC, Financial and Other Performance-Critical Networks

Monday, February 18, 2019

• Alphawave IP Launched in Canada to Revolutionize Multi-Standard Connectivity for the Digital World
• Huawei Enters into MPEG LA's AVC Patent Portfolio License
• AccelerComm introduces software only 5G NR channel coding IP at MWC Barcelona 2019
• Open Source Hardware Benefits Procurement Practices
• Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout
• Autotalks and CEVA Collaborate on World's First Global V2X Solution
• Moving AI Processing to the Edge Will Shake Up the Semiconductor Industry
• SiFive Sees Big Year for RISC-V
• Wave Computing Creates MIPS Open Advisory Board
• GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
• Cadence and Green Hills Software Announce Strategic Partnership to Accelerate Embedded System Safety and Security
• UltraSoC selects Redtree for expanding European market opportunity
• Intel Buys Indian SoC Designer Ineda Systems
• Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures
• eMemory Receives ISSCC Award for Breakthrough Security Technology

Sunday, February 17, 2019

• RISC-V: The Road Ahead
• Palma Ceia SemiDesign Announces Silicon-Proven Dual Band LTE NB-IoT Transceiver for IoT Applications
• TSMC January 2019 Revenue Report
• Chips&Media paving new road towards 8K with launch of Dual-CORE HEVC+H.264 combined codec IP

Friday, February 15, 2019

• Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES

Thursday, February 14, 2019

• Using Energy Harvesting to power wireless sensors in production environment

Thursday, February 14, 2019

• Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator

Wednesday, February 13, 2019

• Can MIPS Leapfrog RISC-V?
• SMIC Reports 2018 Fourth Quarter Results
• Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
• Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices
• Aerospace Companies Look to Utilize AI & Analytics
• The Future of the Cars and ADAS
• Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity
• Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features
• eSilicon builds momentum as a strong tier one FinFET ASIC supplier
• SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms
• UMC Reports Sales for January 2019
• Sital Technology Announces the World's First Secured 1553 Component

Tuesday, February 12, 2019

• Trump Prioritises Artificial Intelligence
• CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results
• Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip
• ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications

Monday, February 11, 2019

• Eighth Annual "Leadership in Automation" Award Recognizes Teledyne DALSA as "First Team" Honoree
• Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family
• Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem
• 200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports
• Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019
• Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML
• ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
• AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP

Sunday, February 10, 2019

• AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost
• TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs
• GUC Monthly Sales Report - Jan 2019

Thursday, February 7, 2019

• China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR
• SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks