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Sunday, July 7, 2019

• Tessolve's 15th Anniversary Lunch Panel At The GSA Silicon Summit Brings Out New Perspective On Ethical Issues Concerning IoT Proliferation
• ESD Alliance Reports EDA Industry Revenue Increase for Q1 2019
• InAccel releases open-source Logistic Regression IP core for FPGAs
• Omni Design Technologies opens design center in Bangalore, India
• GUC Monthly Sales Report - June 2019

Thursday, July 4, 2019

• EU AI Will Rely on Emerging Memory Technologies
• Europe votes against EU's plan to use WiFi over 5G for connected cars
• Global AI Race Divided Over Data Privacy

Wednesday, July 3, 2019

• AGIC Tape Out First Silicon at 14nm FinFET Technology

Tuesday, July 2, 2019

• Blog: Where Security Meets Privacy
• Taiwan forms alliance to develop AI chips
• Vidatronic Announces New Silicon-Proven Power Management Unit Intellectual Property Core for Samsung Foundry
• Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology

Tuesday, July 2, 2019

• Cirrus to integrate Silicon Wave's Bluetooth technology in processors

Monday, July 1, 2019

• Automotive and Mobility Industry Leaders Publish First-of-its-Kind Framework for Safe Automated Driving Systems
• Private 5G Networks Expected to Support IIoT
• Edge Complexity To Grow For 5G
• Samsung Electronics Introduces A High-Speed, Low-Power NPU Solution for AI Deep Learning
• Samsung Accelerates New Product Ramp for 7nm Technology Node Using Synopsys' Yield Explorer
• Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in May
• Ambiq Micro Achieves World-Leading Power Consumption Performance with TSMC 40ULP Technology

Sunday, June 30, 2019

• Samsung Electronics and SK Telecom Advance in Bringing Korea Closer to 5G Standalone Commercialization
• Longtime X11/Linux Developer Joins SiFive To Work On RISC-V Processors
• Building an AI Platform for Medical Imaging System
• Inside Secure Announces Group Company Name, New Identity and New Trading Symbol
• Andes Technology and Silex Insight Announce Strategic Partnership for RISC-V Based Root-of-Trust IP Solutions
• Avery Design Systems Announces SimRegress and SimCompare
• SiFive Expands DesignShare IP Ecosystem to 20 Partner Companies
• Semiconductor Industry Capex Forecast to Slump in 2019 and 2020
• PLDA Reaches Key Milestone in Gen-Z IP Development
• GOWIN Semiconductor Introduces Their latest FPGA Product Line with Built-In Security
• AI Startup Preps Inference Chip

Wednesday, June 26, 2019

• Micron Cuts Capex, Wafer Starts
• Renesas Appoint New CEO
• Rambus Expands Family of CryptoManager Root of Trust Secure Silicon IP Cores
• BrainChip and Socionext Sign a Definitive Agreement to Develop the Akida Neuromorphic System-on-Chip

Tuesday, June 25, 2019

• Cadence Announces First-to-Market DisplayPort 2.0 Verification IP
• VESA Publishes DisplayPort 2.0 Video Standard Enabling Support for Beyond-8K Resolutions, Higher Refresh Rates for 4K/HDR and Virtual Reality Applications
• Mentor's Veloce Strato emulation platform selected by Iluvatar CoreX for verification of AI chips and software
• Aspinity Enables 10x Less Power for Always-on Sensing
• MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
• NanoSemi Relies on OneSpin Automated Formal Verification Tools to Verify SystemC Designs for 5G ASICs
• Real Intent Announces 10X+ Speedup & 5X Capacity Improvement for Ascent AutoFormal Automatic RTL Verification
• InAccel release world's first FPGA orchestrator