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Wednesday, June 26, 2019
Micron Cuts Capex, Wafer Starts
Renesas Appoint New CEO
Rambus Expands Family of CryptoManager Root of Trust Secure Silicon IP Cores
BrainChip and Socionext Sign a Definitive Agreement to Develop the Akida Neuromorphic System-on-Chip
Tuesday, June 25, 2019
Cadence Announces First-to-Market DisplayPort 2.0 Verification IP
VESA Publishes DisplayPort 2.0 Video Standard Enabling Support for Beyond-8K Resolutions, Higher Refresh Rates for 4K/HDR and Virtual Reality Applications
Mentor's Veloce Strato emulation platform selected by Iluvatar CoreX for verification of AI chips and software
Aspinity Enables 10x Less Power for Always-on Sensing
MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
NanoSemi Relies on OneSpin Automated Formal Verification Tools to Verify SystemC Designs for 5G ASICs
Real Intent Announces 10X+ Speedup & 5X Capacity Improvement for Ascent AutoFormal Automatic RTL Verification
InAccel release world's first FPGA orchestrator
Monday, June 24, 2019
Qualcomm Snapdragon 855 Becomes First Mobile SoC to Receive Smart Card Equivalent Security Certification
Is Your AV Safe? Prove It
Aspinity Puts Neural Networks Back to Analog
SmartDV Adds New Verification IP to Support OpenCAPI Standard
CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect IoT Devices to the Alibaba Cloud
Synopsys Expands Center of Excellence with Infineon to Deliver Virtualizer Development Kit for AURIX TC4x Automotive Microcontroller
Visa to Acquire Rambus Payments Portfolio
eMemory's NeoFuse Qualified on Winbond 25nm DRAM Process
Arteris IP FlexNoC Interconnect Implemented in Uhnder Digital Automotive Radar-on-Chip
Sunday, June 23, 2019
UltraSoC secures £5m investment to target safety and security applications with its embedded analytics
Vidatronic Licenses Power Management Unit and Analog IP to Leading Semiconductor IP Company, Arm
Friday, June 21, 2019
North American Semiconductor Equipment Industry Posts May 2019 Billings
Wednesday, June 19, 2019
Western Digital Extends Openness of PlatformIO and Enhances its RISC-V Portfolio to Accelerate Data-Centric Innovation
ON Semiconductor Completes Acquisition of Quantenna Communications
"Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
Purdue & TSMC Partner to Enhance Chip Security
Attopsemi Technology's Notification of Office Relocation
eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar
Tuesday, June 18, 2019
Arm joins Trusted Computing Group, driving towards secure devices everywhere
China sees Taiwan supply chain as alternative to IDMs for power IC devices
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller
Acacia Communications Adopts Cadence Palladium Z1 Enterprise Emulation Platform to Accelerate Optical Networking Development
Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC
U.S. Companies Dominate Worldwide IC Marketshare
PCI-SIG Announces Upcoming PCI Express 6.0 Specification to Reach 64 GT/s
Monday, June 17, 2019
Samsung Electronics to Strengthen its Neural Processing Capabilities for Future AI Applications
"Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth
Can Huawei Survive?
SiFive Enhances Silicon Hills Operations with Office in Austin, Texas
Xilinx Hits Milestone with First Customer Shipments of Versal ACAP
Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Arteris IP FlexNoC Interconnect Licensed by Achronix for New Speedster7t FPGA family
Astera Labs Verifies Its System-Aware PCI Express 5.0 Smart Retimer Using Avery Design Systems PCIe 5.0 Verification IP
Telechips selects PowerVR GPU for Automotive
NVIDIA Brings CUDA to Arm, Enabling New Path to Exascale Supercomputing
Chiplet Ecosystem Slowly Picks up Steam
Sunday, June 16, 2019
At the Paris Air Show 2019 Cobham will be showcasing its unique role in the world.
Introducing Intel's New Network and Custom Logic Group
Global Top Ten Foundries for 2Q19 Perform Less-than-expected Due to Sliding Demand and High Inventories, Says TrendForce
Moortec to Showcase its PVT Monitoring IP at TSMC China Technology Symposium
UltraSoC joins GSA IoT Security Working Group
Can We Believe The Hype About China's Domestic IC Production Plans?
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