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Wednesday, June 26, 2019

• Micron Cuts Capex, Wafer Starts
• Renesas Appoint New CEO
• Rambus Expands Family of CryptoManager Root of Trust Secure Silicon IP Cores
• BrainChip and Socionext Sign a Definitive Agreement to Develop the Akida Neuromorphic System-on-Chip

Tuesday, June 25, 2019

• Cadence Announces First-to-Market DisplayPort 2.0 Verification IP
• VESA Publishes DisplayPort 2.0 Video Standard Enabling Support for Beyond-8K Resolutions, Higher Refresh Rates for 4K/HDR and Virtual Reality Applications
• Mentor's Veloce Strato emulation platform selected by Iluvatar CoreX for verification of AI chips and software
• Aspinity Enables 10x Less Power for Always-on Sensing
• MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
• NanoSemi Relies on OneSpin Automated Formal Verification Tools to Verify SystemC Designs for 5G ASICs
• Real Intent Announces 10X+ Speedup & 5X Capacity Improvement for Ascent AutoFormal Automatic RTL Verification
• InAccel release world's first FPGA orchestrator

Monday, June 24, 2019

• Qualcomm Snapdragon 855 Becomes First Mobile SoC to Receive Smart Card Equivalent Security Certification
• Is Your AV Safe? Prove It
• Aspinity Puts Neural Networks Back to Analog
• SmartDV Adds New Verification IP to Support OpenCAPI Standard
• CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect IoT Devices to the Alibaba Cloud
• Synopsys Expands Center of Excellence with Infineon to Deliver Virtualizer Development Kit for AURIX TC4x Automotive Microcontroller
• Visa to Acquire Rambus Payments Portfolio
• eMemory's NeoFuse Qualified on Winbond 25nm DRAM Process
• Arteris IP FlexNoC Interconnect Implemented in Uhnder Digital Automotive Radar-on-Chip

Sunday, June 23, 2019

• UltraSoC secures £5m investment to target safety and security applications with its embedded analytics
• Vidatronic Licenses Power Management Unit and Analog IP to Leading Semiconductor IP Company, Arm

Friday, June 21, 2019

• North American Semiconductor Equipment Industry Posts May 2019 Billings

Wednesday, June 19, 2019

• Western Digital Extends Openness of PlatformIO and Enhances its RISC-V Portfolio to Accelerate Data-Centric Innovation
• ON Semiconductor Completes Acquisition of Quantenna Communications
• "Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
• Purdue & TSMC Partner to Enhance Chip Security
• Attopsemi Technology's Notification of Office Relocation
• eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar

Tuesday, June 18, 2019

• Arm joins Trusted Computing Group, driving towards secure devices everywhere
• China sees Taiwan supply chain as alternative to IDMs for power IC devices
• CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller
• Acacia Communications Adopts Cadence Palladium Z1 Enterprise Emulation Platform to Accelerate Optical Networking Development
• Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC
• U.S. Companies Dominate Worldwide IC Marketshare
• PCI-SIG Announces Upcoming PCI Express 6.0 Specification to Reach 64 GT/s

Monday, June 17, 2019

• Samsung Electronics to Strengthen its Neural Processing Capabilities for Future AI Applications
• "Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips
• GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth
• Can Huawei Survive?
• SiFive Enhances Silicon Hills Operations with Office in Austin, Texas
• Xilinx Hits Milestone with First Customer Shipments of Versal ACAP
• Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
• Arteris IP FlexNoC Interconnect Licensed by Achronix for New Speedster7t FPGA family
• Astera Labs Verifies Its System-Aware PCI Express 5.0 Smart Retimer Using Avery Design Systems PCIe 5.0 Verification IP
• Telechips selects PowerVR GPU for Automotive
• NVIDIA Brings CUDA to Arm, Enabling New Path to Exascale Supercomputing
• Chiplet Ecosystem Slowly Picks up Steam

Sunday, June 16, 2019

• At the Paris Air Show 2019 Cobham will be showcasing its unique role in the world.
• Introducing Intel's New Network and Custom Logic Group
• Global Top Ten Foundries for 2Q19 Perform Less-than-expected Due to Sliding Demand and High Inventories, Says TrendForce
• Moortec to Showcase its PVT Monitoring IP at TSMC China Technology Symposium
• UltraSoC joins GSA IoT Security Working Group
• Can We Believe The Hype About China's Domestic IC Production Plans?