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Sunday, March 17, 2019

• Boeing's B737 Max and Automotive 'Autopilot'
• Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X
• Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce
• Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners
• Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019

Thursday, March 14, 2019

• Data Centers Open Source Silicon
• Imagination in UK's top ten for European Patent Filing
• Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification

Wednesday, March 13, 2019

• Cadence Announces Industry's First Verification IP for USB4
• Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs
• Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture
• GlobalFoundries Says Neither the Company Nor Its Fab 7 Are Up for Sale
• Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories
• Andes and SEGGER Partner to Deliver Professional Development Solutions for RISC-V
• The RISC-V Foundation Appoints Calista Redmond As Chief Executive Officer
• GOWIN Semiconductor Corporation Appoints Pan-European Representative
• Chips-as-a-Service on Startup's Menu

Tuesday, March 12, 2019

• China to spend $134-220 billion on 5G between 2020 and 2025
• Success with IoT requires the right organizational culture
• Is Analog Signal Processing the Future of AI?
• OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
• Facebook Buys Interconnect IP Vendor Sonics
• Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability

Monday, March 11, 2019

• Mine Cryptocurrencies Sooner (Part 2)
• GSMA bets on IoT as biggest market for the mobile industry in coming years
• eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC
• CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones
• Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
• Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU
• Global Fab Spending to See 2019 Decline, New Highs in 2020
• Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set
• Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
• News waiting for approval
• Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance
• Linux Foundation to Host CHIPS Alliance Project to Propel Industry Innovation Through Open Source Chip and SoC Design

Sunday, March 10, 2019

• NVIDIA to Acquire Mellanox for $6.9 Billion
• Intel, RISC-V Rally Rival Groups
• UMC Reports Sales for February 2019
• Sonics: Our Next Chapter
• Intel Expected to Recapture #1 Semi Supplier Ranking in 2019
• Spectral Edge Fusion innovation brings RGB and Near Infrared light together for breakthrough, no-compromise performance in low lighting
• TSMC February 2019 Revenue Report

Wednesday, March 6, 2019

• Arasan announces the immediate availability of its MIPI D-PHY / C-PHY Combo IP for TSMC 22nm SoC Designs
• Codasip to Demonstrate Technology Leadership and Commitment to Open Standards at Taiwan RISC-V Workshop
• Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process
• Nuvoton Debuts Arm Cortex-M23 Based MCU
• Dialog Semiconductor to Acquire Silicon Motion's Mobile Communications Business Including Ultra-Low-Power Wi-Fi, Extending its Position in IoT Connectivity
• Edge Intelligence the Focus at Embedded World
• AV Safety Ventures Beyond ISO 26262
• Teledyne LeCroy Demonstrates First Protocol Analyzer Platform for Next-Generation USB4 and Thunderbolt 3 Systems

Tuesday, March 5, 2019

• Cryptographers See Danger in Encryption Laws
• New SK Hynix China fab nears completion
• Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment
• Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon
• Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC
• MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts