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Sunday, February 17, 2019
RISC-V: The Road Ahead
Palma Ceia SemiDesign Announces Silicon-Proven Dual Band LTE NB-IoT Transceiver for IoT Applications
TSMC January 2019 Revenue Report
Chips&Media paving new road towards 8K with launch of Dual-CORE HEVC+H.264 combined codec IP
Friday, February 15, 2019
Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
Thursday, February 14, 2019
Using Energy Harvesting to power wireless sensors in production environment
Thursday, February 14, 2019
Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator
Wednesday, February 13, 2019
Can MIPS Leapfrog RISC-V?
SMIC Reports 2018 Fourth Quarter Results
Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices
Aerospace Companies Look to Utilize AI & Analytics
The Future of the Cars and ADAS
Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity
Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features
eSilicon builds momentum as a strong tier one FinFET ASIC supplier
SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms
UMC Reports Sales for January 2019
Sital Technology Announces the World's First Secured 1553 Component
Tuesday, February 12, 2019
Trump Prioritises Artificial Intelligence
CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results
Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip
ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications
Monday, February 11, 2019
Eighth Annual "Leadership in Automation" Award Recognizes Teledyne DALSA as "First Team" Honoree
Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family
Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem
200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports
Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019
Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP
Sunday, February 10, 2019
AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost
TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs
GUC Monthly Sales Report - Jan 2019
Thursday, February 7, 2019
China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR
SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks
Wednesday, February 6, 2019
Governor Cuomo Announces IBM Investment To Create Artificial Intelligence Hardware Center At SUNY Poly Albany Campus
The Race To Multi-Domain SoCs
NVMe Over TCP Will Take Time to Eclipse RDMA
Apple, Q'comm Fight Over Engineers
Eclipse Ventures Adds Mike McNamara and Sanjay Jha As General Partners
Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip
Tuesday, February 5, 2019
Sital Technology Announces the World's First Secured 1553 Component
Huawei's Media Mess
Huawei Was No. 3 Chip Buyer in 2018
Synopsys and SAE International Release New Study Highlighting Critical Cybersecurity Risks in the Automotive Industry
AMD Updates Wafer Supply Agreement with Globalfoundries
Logic Design Solutions Introduces the first member of NVMe HOST RECORDER IPs
New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV
SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems
AdaCore Enhances Security-Critical Firmware With NVIDIA
Arm takes centre stage at Mobile World Congress 2019
Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite
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