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Wednesday, April 3, 2019

• PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric
• V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding
• SIA calls for more government support for semiconductor industry
• Autonomous challenges

Tuesday, April 2, 2019

• China's Share of Fabless Market Grows but U.S Dominant
• Using neural networks to predict failure on hard disk drives
• Silvaco CTO, Babak Taheri, to Present at IP-SoC Santa Clara, April 9
• Renesas Electronics Simplifies Development of USB PD and USB-C™ Battery Charging Applications with New Reference Designs
• SMIC to sell stake in LFoundry
• TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology
• Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family
• Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design
• Menta and Mentor Partner for High-Level Synthesis of Embedded FPGA IP

Monday, April 1, 2019

• How the global IP market looks from the heart of China's high-tech industry
• AI: Market Trader and Market Cop
• New high-speed GigE Vision cameras enable smooth transition from CCD to CMOS imaging
• Chip Firms Expect IoT to Be Key Revenue Driver
• SiFive To Present At Leading IP, Processor Conferences
• Cadence Eyes System Analysis Market
• Global Semiconductor Materials Sales Hit New High of $51.9 Billion
• Silex Insight expands into North America with opening of Silicon Valley office
• Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips
• Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
• Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February
• proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
• Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform
• Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners

Sunday, March 31, 2019

• Processors, Sensors Drive Embedded Vision
• SMIC Rift: Rare Peek into China IC Industry
• Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
• Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology
• Renesas Completes Acquisition of Integrated Device Technology
• Omnitek Releases Highly Optimised 3D LUT IP for FPGAs
• SMIC Announces 2018 Annual Results
• Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara
• The MOST Ultimate OTP Technology - AGIC Particle Momentum

Thursday, March 28, 2019

• Wave Computing Releases First MIPS Open Program Components to Accelerate Innovation for Next-Generation System on Chip Designs

Thursday, March 28, 2019

• Cadence Collaborates with Northrop Grumman on Chip Design

Thursday, March 28, 2019

• Efinix Transitions Trion T20 FPGAs to High-Volume Production

Wednesday, March 27, 2019

• PathPartner Technology Opens New European Office in Frankfurt
• SMIC Rift: Who's in Charge of China's Chip Industry?
• nnMAX™ Inference Acceleration Architecture presented by Flex Logic at the Autonomous Vehicle Hardware Summit
• Visit D&R at IP SoC 19
• EnSilica at IoT Tech Expo - Global London, 2019
• Top court's new IP tribunal upholds French firm's patent
• Top 10 China's most innovative companies
• Tsinghua Poaches Talent to Aid China's Faltering DRAM Industry

Tuesday, March 26, 2019

• ON Semiconductor Reaches Key Milestones in Roznov Facility Expansion
• ON Semiconductor to Acquire Quantenna Communications
• MIPI Alliance Announces Annual Membership Award Recipients
• Q1 Forecast Disappointing for Foundry Sales
• Synopsys Announces Collaboration with Samsung Foundry to Offer Secure and Scalable Environment on the Cloud for IC Design and Verification
• CyberX Capitalizes on IIoT Security Momentum with Additional $18 Million in Strategic Funding
• Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes
• Nextera Video Announces NMOS IS-08 as the Latest Addition to their Industry-Leading 2110 Video Over IP FPGA Core Set
• Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity
• U.S. Companies Continue to Represent Largest Share of Fabless IC Sales
• Arm Pelion IoT platform provides foundation for comprehensive IoT utility deployments
• Moore's Law Ending? No Problem

Monday, March 25, 2019

• KT and Samsung Achieve 1Gbps Speed Over the Air on the 5G Commercial Network in Seoul
• A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging
• Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market
• UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development
• Apple v. Q'comm Cases and Impacts
• Intrinsic ID's Hardware Root of Trust IP Selected by Tyrion Integration for Industry 4.0 IoT Security in Oil & Gas Deployment
• REALSEC includes Silex Insight high performance crypto IP for all their HSM solutions
• China Lures SMIC Co-CEO Zhao
• Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research