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Wednesday, April 3, 2019
PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric
V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding
SIA calls for more government support for semiconductor industry
Autonomous challenges
Tuesday, April 2, 2019
China's Share of Fabless Market Grows but U.S Dominant
Using neural networks to predict failure on hard disk drives
Silvaco CTO, Babak Taheri, to Present at IP-SoC Santa Clara, April 9
Renesas Electronics Simplifies Development of USB PD and USB-C™ Battery Charging Applications with New Reference Designs
SMIC to sell stake in LFoundry
TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology
Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family
Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design
Menta and Mentor Partner for High-Level Synthesis of Embedded FPGA IP
Monday, April 1, 2019
How the global IP market looks from the heart of China's high-tech industry
AI: Market Trader and Market Cop
New high-speed GigE Vision cameras enable smooth transition from CCD to CMOS imaging
Chip Firms Expect IoT to Be Key Revenue Driver
SiFive To Present At Leading IP, Processor Conferences
Cadence Eyes System Analysis Market
Global Semiconductor Materials Sales Hit New High of $51.9 Billion
Silex Insight expands into North America with opening of Silicon Valley office
Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips
Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February
proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform
Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners
Sunday, March 31, 2019
Processors, Sensors Drive Embedded Vision
SMIC Rift: Rare Peek into China IC Industry
Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments
Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology
Renesas Completes Acquisition of Integrated Device Technology
Omnitek Releases Highly Optimised 3D LUT IP for FPGAs
SMIC Announces 2018 Annual Results
Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara
The MOST Ultimate OTP Technology - AGIC Particle Momentum
Thursday, March 28, 2019
Wave Computing Releases First MIPS Open Program Components to Accelerate Innovation for Next-Generation System on Chip Designs
Thursday, March 28, 2019
Cadence Collaborates with Northrop Grumman on Chip Design
Thursday, March 28, 2019
Efinix Transitions Trion T20 FPGAs to High-Volume Production
Wednesday, March 27, 2019
PathPartner Technology Opens New European Office in Frankfurt
SMIC Rift: Who's in Charge of China's Chip Industry?
nnMAX™ Inference Acceleration Architecture presented by Flex Logic at the Autonomous Vehicle Hardware Summit
Visit D&R at IP SoC 19
EnSilica at IoT Tech Expo - Global London, 2019
Top court's new IP tribunal upholds French firm's patent
Top 10 China's most innovative companies
Tsinghua Poaches Talent to Aid China's Faltering DRAM Industry
Tuesday, March 26, 2019
ON Semiconductor Reaches Key Milestones in Roznov Facility Expansion
ON Semiconductor to Acquire Quantenna Communications
MIPI Alliance Announces Annual Membership Award Recipients
Q1 Forecast Disappointing for Foundry Sales
Synopsys Announces Collaboration with Samsung Foundry to Offer Secure and Scalable Environment on the Cloud for IC Design and Verification
CyberX Capitalizes on IIoT Security Momentum with Additional $18 Million in Strategic Funding
Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes
Nextera Video Announces NMOS IS-08 as the Latest Addition to their Industry-Leading 2110 Video Over IP FPGA Core Set
Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity
U.S. Companies Continue to Represent Largest Share of Fabless IC Sales
Arm Pelion IoT platform provides foundation for comprehensive IoT utility deployments
Moore's Law Ending? No Problem
Monday, March 25, 2019
KT and Samsung Achieve 1Gbps Speed Over the Air on the 5G Commercial Network in Seoul
A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging
Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market
UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development
Apple v. Q'comm Cases and Impacts
Intrinsic ID's Hardware Root of Trust IP Selected by Tyrion Integration for Industry 4.0 IoT Security in Oil & Gas Deployment
REALSEC includes Silex Insight high performance crypto IP for all their HSM solutions
China Lures SMIC Co-CEO Zhao
Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research
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