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Saturday, March 23, 2019

• Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry

Friday, March 22, 2019

• SCALINX expansion continues with ASIC design center in Caen, France

Friday, March 22, 2019

• Wave Computing Appoints Michael Schroeder as Chief People Officer To Help Drive Company's Global Expansion Plans

Friday, March 22, 2019

• North American Semiconductor Equipment Industry Posts February 2019 Billings

Wednesday, March 20, 2019

• Synopsys Introduces New embARC Machine Learning Inference Software Library for Power-Efficient Neural Networks
• DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia
• Sonics and Arteris IP Agree to Dismiss Litigation
• sureCore Delivers Customised Low Power SRAM for Data Intensive Designs
• WIPO 2018 IP Services: Innovators File Record Number of International Patent Applications, With Asia Now Leading
• Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications
• InSync Technology Ltd Adopts the Adeas/Nextera ST2110 IP Core Set

Tuesday, March 19, 2019

• Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry
• Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges
• Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses 100-Tapeout Milestone in First Year

Monday, March 18, 2019

• Standardizing the ADAS Lexicon
• Automotive Industry Steers European Patent Growth
• ON Semiconductor Collaborates with NVIDIA on Cloud-Based Autonomous Vehicle Simulation
• Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI
• TSMC seeing chip orders for Android devices ramp up
• Mine Cryptocurrencies Sooner (Part 3)
• Imagination delivers new and enhanced developer tools for Android
• Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems
• Nvidia Mum on 7nm GPU
• U.S. Court Finds Apple Infringed Qualcomm IP

Sunday, March 17, 2019

• Boeing's B737 Max and Automotive 'Autopilot'
• Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X
• Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce
• Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners
• Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019

Thursday, March 14, 2019

• Data Centers Open Source Silicon
• Imagination in UK's top ten for European Patent Filing
• Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification

Wednesday, March 13, 2019

• Cadence Announces Industry's First Verification IP for USB4
• Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs
• Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture
• GlobalFoundries Says Neither the Company Nor Its Fab 7 Are Up for Sale
• Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories
• Andes and SEGGER Partner to Deliver Professional Development Solutions for RISC-V
• The RISC-V Foundation Appoints Calista Redmond As Chief Executive Officer
• GOWIN Semiconductor Corporation Appoints Pan-European Representative
• Chips-as-a-Service on Startup's Menu

Tuesday, March 12, 2019

• China to spend $134-220 billion on 5G between 2020 and 2025
• Success with IoT requires the right organizational culture
• Is Analog Signal Processing the Future of AI?
• OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
• Facebook Buys Interconnect IP Vendor Sonics
• Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability

Monday, March 11, 2019

• Mine Cryptocurrencies Sooner (Part 2)
• GSMA bets on IoT as biggest market for the mobile industry in coming years
• eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC
• CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones
• Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
• Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU
• Global Fab Spending to See 2019 Decline, New Highs in 2020
• Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set
• Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
• News waiting for approval
• Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance
• Linux Foundation to Host CHIPS Alliance Project to Propel Industry Innovation Through Open Source Chip and SoC Design