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Saturday, March 23, 2019
Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry
Friday, March 22, 2019
SCALINX expansion continues with ASIC design center in Caen, France
Friday, March 22, 2019
Wave Computing Appoints Michael Schroeder as Chief People Officer To Help Drive Company's Global Expansion Plans
Friday, March 22, 2019
North American Semiconductor Equipment Industry Posts February 2019 Billings
Wednesday, March 20, 2019
Synopsys Introduces New embARC Machine Learning Inference Software Library for Power-Efficient Neural Networks
DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia
Sonics and Arteris IP Agree to Dismiss Litigation
sureCore Delivers Customised Low Power SRAM for Data Intensive Designs
WIPO 2018 IP Services: Innovators File Record Number of International Patent Applications, With Asia Now Leading
Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications
InSync Technology Ltd Adopts the Adeas/Nextera ST2110 IP Core Set
Tuesday, March 19, 2019
Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry
Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges
Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses 100-Tapeout Milestone in First Year
Monday, March 18, 2019
Standardizing the ADAS Lexicon
Automotive Industry Steers European Patent Growth
ON Semiconductor Collaborates with NVIDIA on Cloud-Based Autonomous Vehicle Simulation
Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI
TSMC seeing chip orders for Android devices ramp up
Mine Cryptocurrencies Sooner (Part 3)
Imagination delivers new and enhanced developer tools for Android
Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems
Nvidia Mum on 7nm GPU
U.S. Court Finds Apple Infringed Qualcomm IP
Sunday, March 17, 2019
Boeing's B737 Max and Automotive 'Autopilot'
Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X
Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce
Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners
Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019
Thursday, March 14, 2019
Data Centers Open Source Silicon
Imagination in UK's top ten for European Patent Filing
Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification
Wednesday, March 13, 2019
Cadence Announces Industry's First Verification IP for USB4
Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs
Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture
GlobalFoundries Says Neither the Company Nor Its Fab 7 Are Up for Sale
Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories
Andes and SEGGER Partner to Deliver Professional Development Solutions for RISC-V
The RISC-V Foundation Appoints Calista Redmond As Chief Executive Officer
GOWIN Semiconductor Corporation Appoints Pan-European Representative
Chips-as-a-Service on Startup's Menu
Tuesday, March 12, 2019
China to spend $134-220 billion on 5G between 2020 and 2025
Success with IoT requires the right organizational culture
Is Analog Signal Processing the Future of AI?
OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
Facebook Buys Interconnect IP Vendor Sonics
Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability
Monday, March 11, 2019
Mine Cryptocurrencies Sooner (Part 2)
GSMA bets on IoT as biggest market for the mobile industry in coming years
eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC
CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones
Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU
Global Fab Spending to See 2019 Decline, New Highs in 2020
Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set
Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
News waiting for approval
Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance
Linux Foundation to Host CHIPS Alliance Project to Propel Industry Innovation Through Open Source Chip and SoC Design
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