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Sunday, January 20, 2019

• Samsung Launches Exynos 7 Series 7904 Mobile Processor, Tailored for Indian Consumers
• Smart Battery for EV Even When Cell Fails
• Semiconductor Engineering on RISC-V, FOSSi's Growing Potential
• MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process

Saturday, January 19, 2019

• TSMC and Apple Aftermath

Friday, January 18, 2019

• Q'comm Exec: "Automotive Changed Our DNA"

Friday, January 18, 2019

• Value of Semiconductor Mergers and Acquisitions Falls Considerably

Thursday, January 17, 2019

• The Dilemma of Robocar Testing...
• Updated HBM Standard Geared for HPC, Networking

Thursday, January 17, 2019

• TSMC Reports Fourth Quarter EPS of NT$3.86

Wednesday, January 16, 2019

• New DRAM Architecture Targets Edge AI
• Rambus Acquires Memory Technology Assets of Diablo Technologies
• First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF

Tuesday, January 15, 2019

• Huawei Overtakes Apple to Become No.2 Smartphone Maker
• EU Approves $2 Billion for IoT, Connected Car Research
• SF Technology's Xiaofeng Smart Bluetooth Headset Reduces Order Processing Time by 70% with QuickLogic EOS S3 Platform
• Xilinx Technology to Power Baidu Brain Edge AI Applications
• Mentor's Catapult HLS enables Chips&Media to deliver deep learning hardware accelerator IP in half the time

Monday, January 14, 2019

• Intel Wants Lisa Su?
• Synopsys Unveils Coverity Enhancements to Extend Breadth, Depth, and Scalability of Enterprise Application Security Testing
• Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center
• UltraSoC appoints new VP of Global Sales as demand surges for embedded analytics solutions
• Arasan Announces availability of its Total UFS 3.0 IP Solution for Xilinx FPGA's
• HDL Design House Webinar: Reducing Integration and Verification Effort in SoC Design
• Silvaco Inc. Achieves Fourth Consecutive Year of Double-Digit Growth in Sales Bookings and GAAP Revenue
• Semiconductor Leaders' Marketshares Swell Over the Past 10 Years

Sunday, January 13, 2019

• TSMC climbs US patents top ten
• Aldec shortens time of ASIC design prototype bring-up in FPGA with HES-DVM Proto mode
• A New DSP Approach to Accelerate 5G and AI Design Development
• CEVA Celebrates 10 Billion CEVA-powered Devices Shipped by Ringing the Nasdaq Opening Bell
• zGlue Takes Moore's Law Beyond the Possibilities of System-on-Chips with Custom Chips on Demand
• Apple Testifies in Q'comm Patent Case
• New Generation OTP/MTP/NVM from UK Artificial General Intelligence Cosmos IP total solution
• UMC retreats from China DRAM venture, Report says
• Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP
• Apple's $1 Billion Baseband Deal
• Flash Memory Remains Primary Target for Capex Spending
• IDT Licenses Intrinsic ID's QuiddiKey Hardware Root of Trust for IoT Security
• CEVA Opens New Research and Development Center in Bristol, U.K.
• New Generation OTP/MTP/NVM from UK Artificial General Intelligence Cosmos IP total solution.

Thursday, January 10, 2019

• Qualcomm Expands Chip Lineup Targeting Car Dashboards
• UMC retreats from China DRAM venture, Report says

Wednesday, January 9, 2019

• USB Type-C Controller Targets Fast Charging of Portables in Vehicles
• Launch of first European Artificial Intelligence platform coordinated by Thales
• Semis Hope for Soft Landing
• IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
• Secure SOC for Security Aware Applications
• Silicon Valley Company unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol
• Innovium Selects Synopsys' IC Validator for Physical Signoff
• Faraday Unveils ASIC Success in Factory Automation
• Weebit Nano and Silvaco Form Development Program Partnership to Create ReRAM Models and Design Tools
• TSMC December 2018 Revenue Report

Tuesday, January 8, 2019

• CES 2019: 5 Things to Look Out for in 'Samsung City'
• CES 2019 Roundup
• Baidu unveils open source edge computing platform and AI boards
• STMicro adds AI features to the STM32 toolbox
• UMC Reports Sales for December 2018
• Imagination Technologies delivers new AI, graphics and connectivity technology for 2019
• Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples
• OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan
• China Market Drives Essentially All Pure-Play Foundry Growth in 2018
• NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving