Search News

Sunday, January 6, 2019

• 5G: The most powerful letter and number this year
• Cisco Announces Intent to Acquire Silicon Photonics Leader, Luxtera
• ESD Alliance Reports EDA Industry Revenue Increase For Q3 2018
• SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
• QuickLogic Acquires SensiML SaaS AI Company
• GUC Monthly Sales Report - Dec 2018
• Gartner Says Worldwide Semiconductor Revenue Grew 13.4 Percent in 2018; Increase Driven by Memory Market
• Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
• INVECAS Announces World's First HDMI 2.1 with HDCP2.3 Chip & IP Solutions for TV, AVR, Soundbar and STB
• Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level
• Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
• Gowin Semiconductor Corp.'s Cumulative Shipments Reach 10 Million Pieces
• intoPIX introduces the new JPEG XS standard at CES
• Xilinx and ZF to Jointly Enable AI Innovation and Autonomous Driving Development
• CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices

Thursday, January 3, 2019

• VESA Introduces DisplayHDR True Black High Dynamic Range Standard for Organic Light Emitting Diode (OLED) and other Emissive Displays

Wednesday, January 2, 2019

• Israel Approves $185 Million Grant for Intel Fab
• Apple's Dim Outlook Expected to Have Wide Implications
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms
• Wi-Fi Startups Polish HaLow for IoT
• Samsung to Showcase Next Evolutions of AI and IoT Technologies at CES 2019
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
• Samsung's Exynos Auto V9 to Power Next-generation Platform for Audi's In-vehicle Infotainment System

Tuesday, January 1, 2019

• Chip Sales Slipped Sequentially in November
• India Next in iPhone Production Plan
• Apple slashes Q1 2019 forecast, blaming China and low iPhone upgrades
• USB-IF Launches USB Type-C Authentication Program
• Taiwanese startup to fuel 5G era with 2228ppi AMOLED displays
• Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform
• QuickLogic to Showcase Latest Voice-Enabled and AI Endpoint IoT Solutions at CES 2019
• Robocar Tech Faces 'Major Pain' in 2019
• SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform

Sunday, December 30, 2018

• Global Semiconductor Sales Up 9.8 Percent Year-to-Year in November

Thursday, December 27, 2018

• Researchers Explore Emerging Memories for AI

Thursday, December 27, 2018

• Foxconn Reportedly Readies Chip Fab in China

Wednesday, December 26, 2018

• Feel the Innovative Power of Taiwan at CES 2019
• InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
• CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth Mesh IP
• China's draft foreign investment law bans forced tech transfer, emphasizes reciprocity

Tuesday, December 25, 2018

• China Number One and Two in Download Speeds
• 8 key tech themes from 2018
• 7 Predictions for AI in 2019
• Samsung's C-Lab takes the wraps off 8 new products, including an AI-driven desk lamp