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Sunday, December 23, 2018
Apple Dealt Qualcomm Blow in German Courts
Top 10 Robots of 2018
20 Realistic Tech Predictions for 2019 -- Part One
Saturday, December 22, 2018
Samsung Electronics Expands Partnerships and Certification Centers, Building its HDR10+ Ecosystem
Thursday, December 20, 2018
Micron to Cut Capital Expenses Next Year by $1.25 Billion
7 technology predictions for 2019
Leap Towards the World! WHALECHAIN TECHNOLOGY to Introduce Its First 7 Nanometer SHA256 ASIC in CES 2019
How to Power the Automotive TFT-LCD Displays of the (Not-so-Distant) Future
intoPIX compression technologist Antonin Descampe receives NBN award for contribution to development and promotion of standards
Wednesday, December 19, 2018
Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk "100% Testable OTP for Automotive"
Apple's Wireless Industry War
Ambarella Joins 'Open Vision' ADAS Club
Dover Microsystems' Revolutionary Silicon IP Cybersecurity Approach Fuels Momentum
Graphcore secures lead in global AI chip race with $200 million in new capital from BMW, Microsoft and leading financial investors
Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk
Tuesday, December 18, 2018
Fraunhofer IIS to present several CES debuts
New Ethernet Protocol Keeps the Industrial IoT in Sync
Qualcomm Trying to Connect the Cellular Internet of Things
DRAM Sales Fest Nearing End
5G Networks Under Construction
Industry Leaders Collaborate with Synopsys on Modeling Standards to Address Design Down to 2nm
Tuesday, December 18, 2018
JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
Monday, December 17, 2018
Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences
"Big Plans" for RISC-V
Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences
MIPS Goes Open Source
Former Intel exec to lead Arm's automotive and embedded business
Total Fab Equipment Spending Reverses Course, Growth Outlook Revised Downward
Wave Computing Launches the MIPS Open Initiative To Accelerate Innovation for the Renowned MIPS Architecture
JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
Sunday, December 16, 2018
Resolving AI Trust and Bias Issues on 2019 To-Do List
Arasan Announces availability of its Total I3C IP Solution for Xilinx FPGA's
Vidtoo Technology Licenses Codasip's Bk3 RISC-V Processor for High-Performance Computing SoC
Bluespec, Inc. Releases a Second Family of Open-Source RISC-V Processors to Spur Open Innovation
eMemory's Reprogrammable NeoMTP Qualified on GLOBALFOUNDRIES' 130nm BCDLite and BCD Technology Platforms for Automotive Applications
Thursday, December 13, 2018
Round-Table Discusses RISC-V, FOSSi Impact on Hardware Security
PCS Releases New 3GPP LTE Release 14-Compliant NB-IoT Transceiver IP Supporting High-Band and Low-Band Operation
DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
Wednesday, December 12, 2018
Western Digital Delivers New Innovations to Drive Open Standard Interfaces and RISC-V Processor Development
NSITEXE Develops Test Chip with Next-generation Semiconductor IP Core Called a DFP
Efinix Drives AI Edge Computing with Trion T20 FPGA Samples and Expansion of Product Offering to 200K LEs with T200 FPGA
Tuesday, December 11, 2018
NVIDIA Sets Six Records in AI Performance
CEVA's NeuPro Family of Edge AI Processors Wins "Digital Semiconductor Product of the Year" at Elektra Awards 2018
Fab Tool Sales Expected to Decline in 2019
Minima Processor and NXP Join Forces to Deliver Ultra-Low-Power DSP Solutions
AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications
Movellus Closes Second Round of Intel Capital Funding
CEVA's NeuPro Family of Edge AI Processors Wins
BitSim Demonstrates an Embedded Vision Platform
MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond
Semiconductor Equipment Sales Forecast: $62 Billion in 2018 A New Record, Market Reset in 2019 with New High in 2020
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