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Friday, January 25, 2019

• North American Semiconductor Equipment Industry Posts December 2018 Billings

Wednesday, January 23, 2019

• Eta Compute selects IAR Embedded Workbench as the Preferred Toolchain for new neural network-based AI SoCs
• GOWIN Semiconductor Licenses Intrinsic ID's BroadKey to Deliver Hardware Root of Trust for IoT Security
• Synopsys' New ARC EM Software Development Platform Accelerates Software Development for IoT, Sensor Fusion, and Voice Recognition Applications
• Multicore Association Releases Version 2 Specification for Advanced Tool Support with Multicore Processors
• Xilinx Reports Record Revenues And EPS In Fiscal Third Quarter
• Imagination's New CEO Plots Turnaround Strategy

Tuesday, January 22, 2019

• Teledyne Technologies Reports Fourth Quarter Results
• Intel Announces New Class of RealSense Stand-Alone Inside-Out Tracking Camera
• TSMC to tape out first 5nm chip design in 1H19
• Hailo Expands Series A Round to $21M and Launches Hailo-8 Fast Track Program for Select Customers
• DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly
• NXP's Reger Re-defines CTO's Role
• Global GDP Growth Increasingly Important Driver of IC Market Growth
• Inomize is selected to develop and supply HP Indigo next generation ASIC for Digital Press

Monday, January 21, 2019

• Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-screen Display Smartphones
• Toshiba Announces Latest Ethernet Bridge IC for Automotive and Industrial Applications
• Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers
• Soitec Expands Collaboration with Samsung Foundry on FD-SOI Wafer Supply
• TSMC's Outlook Underscores Foundry Market Challenges

Sunday, January 20, 2019

• Samsung Launches Exynos 7 Series 7904 Mobile Processor, Tailored for Indian Consumers
• Smart Battery for EV Even When Cell Fails
• Semiconductor Engineering on RISC-V, FOSSi's Growing Potential
• MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process

Saturday, January 19, 2019

• TSMC and Apple Aftermath

Friday, January 18, 2019

• Q'comm Exec: "Automotive Changed Our DNA"

Friday, January 18, 2019

• Value of Semiconductor Mergers and Acquisitions Falls Considerably

Thursday, January 17, 2019

• The Dilemma of Robocar Testing...
• Updated HBM Standard Geared for HPC, Networking

Thursday, January 17, 2019

• TSMC Reports Fourth Quarter EPS of NT$3.86

Wednesday, January 16, 2019

• New DRAM Architecture Targets Edge AI
• Rambus Acquires Memory Technology Assets of Diablo Technologies
• First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF

Tuesday, January 15, 2019

• Huawei Overtakes Apple to Become No.2 Smartphone Maker
• EU Approves $2 Billion for IoT, Connected Car Research
• SF Technology's Xiaofeng Smart Bluetooth Headset Reduces Order Processing Time by 70% with QuickLogic EOS S3 Platform
• Xilinx Technology to Power Baidu Brain Edge AI Applications
• Mentor's Catapult HLS enables Chips&Media to deliver deep learning hardware accelerator IP in half the time

Monday, January 14, 2019

• Intel Wants Lisa Su?
• Synopsys Unveils Coverity Enhancements to Extend Breadth, Depth, and Scalability of Enterprise Application Security Testing
• Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center
• UltraSoC appoints new VP of Global Sales as demand surges for embedded analytics solutions
• Arasan Announces availability of its Total UFS 3.0 IP Solution for Xilinx FPGA's
• HDL Design House Webinar: Reducing Integration and Verification Effort in SoC Design
• Silvaco Inc. Achieves Fourth Consecutive Year of Double-Digit Growth in Sales Bookings and GAAP Revenue
• Semiconductor Leaders' Marketshares Swell Over the Past 10 Years