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Thursday, January 10, 2019

• Qualcomm Expands Chip Lineup Targeting Car Dashboards
• UMC retreats from China DRAM venture, Report says

Wednesday, January 9, 2019

• USB Type-C Controller Targets Fast Charging of Portables in Vehicles
• Launch of first European Artificial Intelligence platform coordinated by Thales
• Semis Hope for Soft Landing
• IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
• Secure SOC for Security Aware Applications
• Silicon Valley Company unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol
• Innovium Selects Synopsys' IC Validator for Physical Signoff
• Faraday Unveils ASIC Success in Factory Automation
• Weebit Nano and Silvaco Form Development Program Partnership to Create ReRAM Models and Design Tools
• TSMC December 2018 Revenue Report

Tuesday, January 8, 2019

• CES 2019: 5 Things to Look Out for in 'Samsung City'
• CES 2019 Roundup
• Baidu unveils open source edge computing platform and AI boards
• STMicro adds AI features to the STM32 toolbox
• UMC Reports Sales for December 2018
• Imagination Technologies delivers new AI, graphics and connectivity technology for 2019
• Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples
• OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan
• China Market Drives Essentially All Pure-Play Foundry Growth in 2018
• NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving

Monday, January 7, 2019

• Samsung Showcases the Future of Connected Living at CES 2019
• Advanced ATSC 3.0 Chip Launched for Mobile and Broadcast Applications
• Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC
• Inside Secure Debuts Industry's First Software-Only Solution for High-Bandwidth Digital Content Protection (HDCP) 2.3
• Arm unveils new image signal processors to meet higher image quality requirements
• VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices
• VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC)
• China Wafer Production Capacity Growth Fastest in World
• CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
• Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution

Sunday, January 6, 2019

• 5G: The most powerful letter and number this year
• Cisco Announces Intent to Acquire Silicon Photonics Leader, Luxtera
• ESD Alliance Reports EDA Industry Revenue Increase For Q3 2018
• SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
• QuickLogic Acquires SensiML SaaS AI Company
• GUC Monthly Sales Report - Dec 2018
• Gartner Says Worldwide Semiconductor Revenue Grew 13.4 Percent in 2018; Increase Driven by Memory Market
• Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
• INVECAS Announces World's First HDMI 2.1 with HDCP2.3 Chip & IP Solutions for TV, AVR, Soundbar and STB
• Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level
• Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
• Gowin Semiconductor Corp.'s Cumulative Shipments Reach 10 Million Pieces
• intoPIX introduces the new JPEG XS standard at CES
• Xilinx and ZF to Jointly Enable AI Innovation and Autonomous Driving Development
• CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices

Thursday, January 3, 2019

• VESA Introduces DisplayHDR True Black High Dynamic Range Standard for Organic Light Emitting Diode (OLED) and other Emissive Displays

Wednesday, January 2, 2019

• Israel Approves $185 Million Grant for Intel Fab
• Apple's Dim Outlook Expected to Have Wide Implications
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms
• Wi-Fi Startups Polish HaLow for IoT
• Samsung to Showcase Next Evolutions of AI and IoT Technologies at CES 2019
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
• Samsung's Exynos Auto V9 to Power Next-generation Platform for Audi's In-vehicle Infotainment System

Tuesday, January 1, 2019

• Chip Sales Slipped Sequentially in November
• India Next in iPhone Production Plan
• Apple slashes Q1 2019 forecast, blaming China and low iPhone upgrades
• USB-IF Launches USB Type-C Authentication Program
• Taiwanese startup to fuel 5G era with 2228ppi AMOLED displays
• Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform
• QuickLogic to Showcase Latest Voice-Enabled and AI Endpoint IoT Solutions at CES 2019
• Robocar Tech Faces 'Major Pain' in 2019
• SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform