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Thursday, January 10, 2019
Qualcomm Expands Chip Lineup Targeting Car Dashboards
UMC retreats from China DRAM venture, Report says
Wednesday, January 9, 2019
USB Type-C Controller Targets Fast Charging of Portables in Vehicles
Launch of first European Artificial Intelligence platform coordinated by Thales
Semis Hope for Soft Landing
IFI CLAIMS Announces 2018's Top U.S. Patent Recipients
Secure SOC for Security Aware Applications
Silicon Valley Company unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol
Innovium Selects Synopsys' IC Validator for Physical Signoff
Faraday Unveils ASIC Success in Factory Automation
Weebit Nano and Silvaco Form Development Program Partnership to Create ReRAM Models and Design Tools
TSMC December 2018 Revenue Report
Tuesday, January 8, 2019
CES 2019: 5 Things to Look Out for in 'Samsung City'
CES 2019 Roundup
Baidu unveils open source edge computing platform and AI boards
STMicro adds AI features to the STM32 toolbox
UMC Reports Sales for December 2018
Imagination Technologies delivers new AI, graphics and connectivity technology for 2019
Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples
OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan
China Market Drives Essentially All Pure-Play Foundry Growth in 2018
NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving
Monday, January 7, 2019
Samsung Showcases the Future of Connected Living at CES 2019
Advanced ATSC 3.0 Chip Launched for Mobile and Broadcast Applications
Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC
Inside Secure Debuts Industry's First Software-Only Solution for High-Bandwidth Digital Content Protection (HDCP) 2.3
Arm unveils new image signal processors to meet higher image quality requirements
VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices
VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC)
China Wafer Production Capacity Growth Fastest in World
CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution
Sunday, January 6, 2019
5G: The most powerful letter and number this year
Cisco Announces Intent to Acquire Silicon Photonics Leader, Luxtera
ESD Alliance Reports EDA Industry Revenue Increase For Q3 2018
SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
QuickLogic Acquires SensiML SaaS AI Company
GUC Monthly Sales Report - Dec 2018
Gartner Says Worldwide Semiconductor Revenue Grew 13.4 Percent in 2018; Increase Driven by Memory Market
Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
INVECAS Announces World's First HDMI 2.1 with HDCP2.3 Chip & IP Solutions for TV, AVR, Soundbar and STB
Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level
Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
Gowin Semiconductor Corp.'s Cumulative Shipments Reach 10 Million Pieces
intoPIX introduces the new JPEG XS standard at CES
Xilinx and ZF to Jointly Enable AI Innovation and Autonomous Driving Development
CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices
Thursday, January 3, 2019
VESA Introduces DisplayHDR True Black High Dynamic Range Standard for Organic Light Emitting Diode (OLED) and other Emissive Displays
Wednesday, January 2, 2019
Israel Approves $185 Million Grant for Intel Fab
Apple's Dim Outlook Expected to Have Wide Implications
Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms
Wi-Fi Startups Polish HaLow for IoT
Samsung to Showcase Next Evolutions of AI and IoT Technologies at CES 2019
Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
Samsung's Exynos Auto V9 to Power Next-generation Platform for Audi's In-vehicle Infotainment System
Tuesday, January 1, 2019
Chip Sales Slipped Sequentially in November
India Next in iPhone Production Plan
Apple slashes Q1 2019 forecast, blaming China and low iPhone upgrades
USB-IF Launches USB Type-C Authentication Program
Taiwanese startup to fuel 5G era with 2228ppi AMOLED displays
Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform
QuickLogic to Showcase Latest Voice-Enabled and AI Endpoint IoT Solutions at CES 2019
Robocar Tech Faces 'Major Pain' in 2019
SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform
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