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Thursday, December 27, 2018

• Researchers Explore Emerging Memories for AI

Thursday, December 27, 2018

• Foxconn Reportedly Readies Chip Fab in China

Wednesday, December 26, 2018

• Feel the Innovative Power of Taiwan at CES 2019
• InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
• CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth Mesh IP
• China's draft foreign investment law bans forced tech transfer, emphasizes reciprocity

Tuesday, December 25, 2018

• China Number One and Two in Download Speeds
• 8 key tech themes from 2018
• 7 Predictions for AI in 2019
• Samsung's C-Lab takes the wraps off 8 new products, including an AI-driven desk lamp

Sunday, December 23, 2018

• Apple Dealt Qualcomm Blow in German Courts
• Top 10 Robots of 2018
• 20 Realistic Tech Predictions for 2019 -- Part One

Saturday, December 22, 2018

• Samsung Electronics Expands Partnerships and Certification Centers, Building its HDR10+ Ecosystem

Thursday, December 20, 2018

• Micron to Cut Capital Expenses Next Year by $1.25 Billion
• 7 technology predictions for 2019
• Leap Towards the World! WHALECHAIN TECHNOLOGY to Introduce Its First 7 Nanometer SHA256 ASIC in CES 2019
• How to Power the Automotive TFT-LCD Displays of the (Not-so-Distant) Future
• intoPIX compression technologist Antonin Descampe receives NBN award for contribution to development and promotion of standards

Wednesday, December 19, 2018

• Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk "100% Testable OTP for Automotive"
• Apple's Wireless Industry War
• Ambarella Joins 'Open Vision' ADAS Club
• Dover Microsystems' Revolutionary Silicon IP Cybersecurity Approach Fuels Momentum
• Graphcore secures lead in global AI chip race with $200 million in new capital from BMW, Microsoft and leading financial investors
• Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk

Tuesday, December 18, 2018

• Fraunhofer IIS to present several CES debuts
• New Ethernet Protocol Keeps the Industrial IoT in Sync
• Qualcomm Trying to Connect the Cellular Internet of Things
• DRAM Sales Fest Nearing End
• 5G Networks Under Construction
• Industry Leaders Collaborate with Synopsys on Modeling Standards to Address Design Down to 2nm

Tuesday, December 18, 2018

• JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard

Monday, December 17, 2018

• Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences
• "Big Plans" for RISC-V
• Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences
• MIPS Goes Open Source
• Former Intel exec to lead Arm's automotive and embedded business
• Total Fab Equipment Spending Reverses Course, Growth Outlook Revised Downward
• Wave Computing Launches the MIPS Open Initiative To Accelerate Innovation for the Renowned MIPS Architecture
• JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard