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Monday, November 12, 2018

• Nine Top-15 2018 Semi Suppliers Forecast to Post Double-Digit Gains
• Arasan completes its Total IP Solution for the UFS 3.0 Standard with immediate availability of its MIPI M-PHY 4.1 IP Core
• Imagination reveals next step in PowerVR automotive strategy

Sunday, November 11, 2018

• Andes Technology and INVECAS Announce Partnership to Win RISC-V-Based SoC Designs for Advanced Processes
• HPC Systems Inc. Expands the Science Cloud Offering with the Latest Arm-based HPC
• Spin Memory Announces $52 Million Series B Funding Round
• Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution
• Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip
• Open-Silicon, SiFive and Credo Showcase End-to-End Solutions for HPC and Networking Applications at SC18 in Dallas
• Nextera and Adeas Announce Village Island as Distributor for IP Cores in Japan
• Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm
• Hex Five adds MultiZone Security to the Andes RISC-V Cores on GOWIN FPGAs
• DINI Group announces immediate availability of the DNVUPF4A - Prototyping for 5G

Thursday, November 8, 2018

• UMC Issues Follow-up Statement Regarding Recent Legal Developments
• TSMC October 2018 Revenue Report
• UMC Reports Sales for October 2018

Wednesday, November 7, 2018

• What NXP Lost and Regained Post-Qualcomm
• CEVA, Inc. Announces Third Quarter 2018 Financial Results
• NSCore Inc. Addresses the IoT Market Need for an NVM IP Solution in Advanced Process Technology Nodes
• Dr. Jesse Zhixi Fang Appointed as Chair of the RISC-V Foundation China Advisory Committee to Accelerate Adoption of the RISC-V ISA in China
• SDC18: Samsung Reveals Breakthroughs in Intelligence, IoT and Mobile UX
• Global heavyweight clients touting adoption of TSMC 7nm node

Tuesday, November 6, 2018

• UltraSoc hosts Bristol RISC-V meetup as it looks to expand
• New Mentor Symphony platform addresses nanometer-scale SoC mixed-signal verification challenges
• Third Quarter Silicon Wafer Shipments Increase, Set New Quarterly Record
• SMIC Reports 2018 Third Quarter Results
• IEDM: Samsung makes 3nm gate-all-around CMOS
• US ban set to thwart Chinese DRAM entry
• China keeps global semiconductor market going strong
• Microsoft, Alexa, Bosch join Intel by investing in Syntiant
• Vidatronic Announces ACCUREF Series of Ultra-Precise, Extremely Low-Power Voltage and Current Reference IP Cores
• Judge Rules Qualcomm Must License Modem Patents
• Perceptia Devices Strengthens Europe Sales Network
• AMD Unveils World's First 7nm Datacenter GPUs
• Pinnacle Imaging Systems and ON Semiconductor Collaborate on New HDR Surveillance Solution Using Xilinx Technology to Push the Boundaries of High Dynamic Range Video

Monday, November 5, 2018

• Imperas Empowers RISC-V Community with riscvOVPsim
• Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler
• Dr. John Zhuang Appointed as CEO of Brite Semiconductor
• Synopsys Unveils Fusion Compiler, Enabling 20 Percent Higher Quality-of-Results and 2X Faster Time-to-Results
• sureCore names Roger Bailey VP Worldwide Sales
• Arm Kigen solutions see further adoption and achieve GSMA accreditation
• Everspin and SilTerra join forces to create new manufacturing center for MRAM
• Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers

Sunday, November 4, 2018

• Microcontroller Runs Neural Networks That Train Themselves
• NSCore Inc. Addresses the IoT market need for an NVM IP Solution in advanced process nodes using Hi-k Metal Gate with their Multi-Time Programmable (MTP) Non-Volatile Memory (NVM) IP Solution
• Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption
• PathPartner to showcase a spectrum of innovations in Automotive ADAS and Internet of Things at Electronica 2018
• Knowledge Transfer, or IP Theft?
• Arm's Data Center Two Step
• FABU America, Developer of SoCs for Autonomous Driving, Selects Agnisys IDesignSpec to Create an Executable Design Specification
• SMIT Acquires S2C, a Hardware-based Verification Systems and Software Company
• Who's Who in AI SoCs
• New Architectures Bringing AI to the Edge
• GUC Monthly Sales Report - Oct 2018
• Samsung Still Spending Heavily on Capex
• Wave Computing Turbo Boosts "MIPS" with Licensable AI Subsystems, An Expanded Ecosystem & New Product Roadmap
• AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution
• Esperanto Technologies Secures $58 Million in Series B Investment for AI Chips

Thursday, November 1, 2018

• Chipmaker Results Point Toward Correction
• Cortus will be exhibiting at Electronica in Munich from 13 to 16 November 2018
• SoC designers now have more choice from Arm with its secure foundation and Corstone IP
• Discover Arm's new board for the development of PSA-ready IoT subsystems for Cortex-M processors.
• U.S. Charges UMC, Fujian Jinhua With Technology Theft
• Samsung Warns of Slow Growth Ahead
• VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications
• Quarterly Year-over-Year Growth Slows Substantially for IC Market
• Montage LZ Technologies Selects Rambus CryptoMedia Core to Secure Set-Top Box Chips
• UMC Issues Statement in Response to Recent Indictment and Civil Complaint

Wednesday, October 31, 2018

• GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions
• UMC Halts R&D Project with China Chipmaker
• Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth