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Monday, October 29, 2018

• Micron to buy Intel out from manufacturing venture
• IEDM: Intel embeds MRAM in FinFET process
• ASML, IMEC to take EUV lithography to high-NA
• Samsung launches 7nm EUV process, SAFE partnership
• Rambus Reports Third Quarter 2018 Financial Results
• Rambus Appoints Luc Seraphin as President and Chief Executive Officer
• Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM
• Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC's 2018 China OIP Forum

Sunday, October 28, 2018

• SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC
• Moortec To Showcase Its PVT Monitoring IP At the TSMC China OIP Ecosystem Forum in Nanjing
• Synopsys Advances Test Fusion Technology with Test Points to Reduce Manufacturing Costs and Boost Quality
• Real Intent Provides Comprehensive Reset Analysis with Meridian RXV
• Intel Reports Tepid Progress on 10 nm
• Global Semiconductor Sales in September Up 13.8 Percent Year-to-Year
• Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan University SoC Lab
• Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market
• PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology
• GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
• Kazan Networks Announces NVMe-oF ASIC Production Release
• Synopsys Improves Automotive Functional Safety with Fast Soft-Error Analysis
• Chinese Firm to Buy NXP Spinoff

Thursday, October 25, 2018

• Atmosic Technologies Introduces Innovative Wireless Platforms to Drive Battery-Free Internet of Things

Thursday, October 25, 2018

• NovuMind's AI Chip Sparks Controversy

Thursday, October 25, 2018

• Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance

Wednesday, October 24, 2018

• Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
• eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
• UltraSoC and ResilTech partner to further functional safety in automotive systems
• DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available
• NovuMind Releases Details of Breakthrough AI Chip

Tuesday, October 23, 2018

• NEC and Samsung Announce 5G Partnership Agreement
• American Express and Rambus Join Forces on Secure Global E-commerce Tokenization
• CEVA Adds ONNX Support to CDNN Neural Network Compiler
• Analysis: Dialog finds a better way out from under Apple
• Cypress Delivers Smart, Fail-Safe Storage Platform Leveraging Arm Processor for Enhanced Safety and Reliability
• Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology
• OneSpin Puts Verification on the Move with New PortableCoverage Solution
• Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions
• North American Semiconductor Equipment Industry Posts September 2018 Billings

Monday, October 22, 2018

• Attopsemi Published I-fuse™ Technology with the Smallest Size, Lowest Power, and Full Testability on 22nm FD-SOI at IEEE S3S Conference, 2018.
• Synopsys Custom Compiler Doubles New Customer Adoptions, Introduces New Release
• Synopsys FineSim SPICE Cuts Analog Simulation Time by 3X
• Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP
• Synopsys Custom Design Platform Delivers Breakthrough Analog Simulation and Fusion Technologies
• Cadence Reports Third Quarter 2018 Financial Results

Sunday, October 21, 2018

• An Era of Affordability for the Custom System-on-Chip (SoC)
• Designing a system-on-chip (SoC) with an Arm Cortex-M processor
• Arm Offers Lower Cost Cortex-A5 License
• Sankalp Semiconductor Expands its Design Centre in Hubli
• MIPI Alliance Enables First Wave of 5G Smartphones
• Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
• Percepio Announces Tracealyzer Support for STLINK-V3 Debug Probes
• Arm DesignStart program expands to accelerate Linux-based embedded design
• NEC collaborates with Arm to develop secure IoT solutions for Smart Cities using AI
• Stage Tec introduces HSR for Professional Audio Broadcasting using SoC-e Technology
• Silvaco Appoints Babak Taheri as Chief Technology Officer
• Rambus Unveils Vaultify Trade for Secure Transaction and Storage of Crypto Assets on Blockchain
• IEDM: Intel embeds MRAM in FinFET process

Thursday, October 18, 2018

• ISG Positions L&T Technology Services as Global Leader in the First Ever Service Provider Ranking on Product, Process and Platform Engineering

Wednesday, October 17, 2018

• Communications Rise To Represent Largest Portion of Foundry Sales
• NXP Secures the Edge with Two Industry-First Multi-Core Arm Cortex-M33 Solutions
• TSMC Reports Third Quarter EPS of NT$3.44
• STMicroelectronics Introduces STM32L5 Ultra-Low-Power Microcontrollers for a More Secured IoT
• Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions
• Samsung Debuts Semiconductor Innovations at Samsung Tech Day that Maximize Data Center Efficiencies and Enable AI, Enterprise and Emerging Technologies
• Samsung Electronics Starts Production of EUV-based 7nm LPP Process

Wednesday, October 17, 2018

• TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event