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Monday, October 29, 2018
Micron to buy Intel out from manufacturing venture
IEDM: Intel embeds MRAM in FinFET process
ASML, IMEC to take EUV lithography to high-NA
Samsung launches 7nm EUV process, SAFE partnership
Rambus Reports Third Quarter 2018 Financial Results
Rambus Appoints Luc Seraphin as President and Chief Executive Officer
Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM
Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC's 2018 China OIP Forum
Sunday, October 28, 2018
SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC
Moortec To Showcase Its PVT Monitoring IP At the TSMC China OIP Ecosystem Forum in Nanjing
Synopsys Advances Test Fusion Technology with Test Points to Reduce Manufacturing Costs and Boost Quality
Real Intent Provides Comprehensive Reset Analysis with Meridian RXV
Intel Reports Tepid Progress on 10 nm
Global Semiconductor Sales in September Up 13.8 Percent Year-to-Year
Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan University SoC Lab
Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market
PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology
GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
Kazan Networks Announces NVMe-oF ASIC Production Release
Synopsys Improves Automotive Functional Safety with Fast Soft-Error Analysis
Chinese Firm to Buy NXP Spinoff
Thursday, October 25, 2018
Atmosic Technologies Introduces Innovative Wireless Platforms to Drive Battery-Free Internet of Things
Thursday, October 25, 2018
NovuMind's AI Chip Sparks Controversy
Thursday, October 25, 2018
Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance
Wednesday, October 24, 2018
Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
UltraSoC and ResilTech partner to further functional safety in automotive systems
DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available
NovuMind Releases Details of Breakthrough AI Chip
Tuesday, October 23, 2018
NEC and Samsung Announce 5G Partnership Agreement
American Express and Rambus Join Forces on Secure Global E-commerce Tokenization
CEVA Adds ONNX Support to CDNN Neural Network Compiler
Analysis: Dialog finds a better way out from under Apple
Cypress Delivers Smart, Fail-Safe Storage Platform Leveraging Arm Processor for Enhanced Safety and Reliability
Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology
OneSpin Puts Verification on the Move with New PortableCoverage Solution
Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions
North American Semiconductor Equipment Industry Posts September 2018 Billings
Monday, October 22, 2018
Attopsemi Published I-fuse™ Technology with the Smallest Size, Lowest Power, and Full Testability on 22nm FD-SOI at IEEE S3S Conference, 2018.
Synopsys Custom Compiler Doubles New Customer Adoptions, Introduces New Release
Synopsys FineSim SPICE Cuts Analog Simulation Time by 3X
Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP
Synopsys Custom Design Platform Delivers Breakthrough Analog Simulation and Fusion Technologies
Cadence Reports Third Quarter 2018 Financial Results
Sunday, October 21, 2018
An Era of Affordability for the Custom System-on-Chip (SoC)
Designing a system-on-chip (SoC) with an Arm Cortex-M processor
Arm Offers Lower Cost Cortex-A5 License
Sankalp Semiconductor Expands its Design Centre in Hubli
MIPI Alliance Enables First Wave of 5G Smartphones
Dolphin Integration unveils a new RAM dedicated to IoT and Low Power MCU applications in 55 nm, GLOBALFOUNDRIES LPx process
Percepio Announces Tracealyzer Support for STLINK-V3 Debug Probes
Arm DesignStart program expands to accelerate Linux-based embedded design
NEC collaborates with Arm to develop secure IoT solutions for Smart Cities using AI
Stage Tec introduces HSR for Professional Audio Broadcasting using SoC-e Technology
Silvaco Appoints Babak Taheri as Chief Technology Officer
Rambus Unveils Vaultify Trade for Secure Transaction and Storage of Crypto Assets on Blockchain
IEDM: Intel embeds MRAM in FinFET process
Thursday, October 18, 2018
ISG Positions L&T Technology Services as Global Leader in the First Ever Service Provider Ranking on Product, Process and Platform Engineering
Wednesday, October 17, 2018
Communications Rise To Represent Largest Portion of Foundry Sales
NXP Secures the Edge with Two Industry-First Multi-Core Arm Cortex-M33 Solutions
TSMC Reports Third Quarter EPS of NT$3.44
STMicroelectronics Introduces STM32L5 Ultra-Low-Power Microcontrollers for a More Secured IoT
Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions
Samsung Debuts Semiconductor Innovations at Samsung Tech Day that Maximize Data Center Efficiencies and Enable AI, Enterprise and Emerging Technologies
Samsung Electronics Starts Production of EUV-based 7nm LPP Process
Wednesday, October 17, 2018
TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
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