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Monday, October 15, 2018
Agnisys at DVCON Europe 2018: Presenting End-to-End Solution for Specification to Design and Verification of the Hardware/Software Interface
Hortonworks Collaborates with Huawei's Next-Generation Taishan Series Arm Servers
L&T Technology Services announces completion of Graphene Semiconductor Services acquisition
A View from Above - Aldec Adds 'Bird's Eye View' Function to Growing Portfolio of ADAS FPGA-based Reference Designs for TySOM™-3-ZU7EV Embedded Development Kit
Synopsys Enables Tapeout Success for Early Adopters of Arm Neoverse IP
Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices
Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing
OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller
UltraSoC announces integrated multi-core debug, visualization and data science / analytics suite
Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors for STMicroelectronics
Cadence Verification Suite Enabled on Arm-Based HPC Datacenters
SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
ALTEN Calsoft Labs Acquires Si2Chip, a VLSI Chip Design Company
Eta Compute Launches Machine Learning Platform with Ultra-Low-Power Consumption for Edge Devices
Sunday, October 14, 2018
Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips
Advanced Technology Key to Strong Foundry Revenue per Wafer
Synopsys Delivers Platform Architect Ultra to Enable the Next Wave of AI SoCs
CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan
Flex Logix to Demonstrate Modular eFPGA at ARM TechCon
Power Regulation IPs from Dolphin Integration, now Silicon Proven on GLOBALFOUNDRIES 22FDX Technology Platform
Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem
JPEG-XS standard preview by intoPIX at SMPTE ATC 2018
Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China
Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose
Allegro DVT Introduces High Dynamic Range and High Frame Rate System Compliance Streams for DVB UHDTV
Achronix to Demonstrate Speedcore eFPGA's Flexibility at Arm TechCon
Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada
Wednesday, October 10, 2018
GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G
Dialog Semiconductor and Apple enter agreement
Xylon Unveils New Panoramic Multi-Sensor Camera Demo at Xilinx Developer Forum
Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications
Arasan to demonstrate its MIPI DSI, CSI, C-PHY and D-PHY IP Cores at the 2018 MIPI Member Meeting Asia
Silvaco to Showcase Octal SPI in Presentation at ARM TechCon
IntelliProp to Exhibit at SC18 in Dallas, TX
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Synaptics VXR7200 IC Enabling Next Generation VR Headsets
Tuesday, October 9, 2018
Global chip market up 15% in August
Intel blames production shortfall on strong demand
NVIDIA Launches GPU-Acceleration Platform for Data Science, Volvo Selects NVIDIA DRIVE
NVIDIA Introduces RAPIDS Open-Source GPU-Acceleration Platform for Large-Scale Data Analytics and Machine Learning
Nvidia boosts AI in medical instruments with graphic compute power
Gowin Semiconductor's GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist For Design Innovation of the Year
Cadence Recognized with Four 2018 TSMC Partner of the Year Awards
Sankalp Semiconductor Opens Second Design Centre in Bangalore
Rambus and Phison Sign Patent License
Truechip Successfully hosted TrueConnect 2018 - The 2nd Annual Technical Conference
Cadence to Demonstrate System and Automotive Solutions at Arm TechCon 2018
Monday, October 8, 2018
Everest Group Positions L&T Technology Services as a global 'Leader' in Embedded System Engineering Services
Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator
Arm awarded TSMC Partner of the Year award for Processor IP
Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution
Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process
UMC Reports Sales for September 2018
QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process
Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips
TSMC September 2018 Revenue Report
Inside Secure Selected by Norway's Nationwide Debit Card System to Secure Mobile Contactless Payments
Synopsys to Showcase Optimized Solutions and Expert Services for Arm-based Designs at Arm TechCon 2018
Sunday, October 7, 2018
RISC-V Design Contest Calls On Embedded Designers To Push The Limits Of Innovation
Samsung expects a $58bn revenue Q3
Live webinar by Dolphin Integration: how to design an energy-efficient SoC in advanced nodes for increasing battery lifetime for IoT applications
Andes Announces over 1.2 GHz RISC-V Cores Series at 28nm: A25/AX25 and N25F/NX25F
Arasan Chip Systems Relocates it's Corporate Headquarters to accommodate future growth
Rambus Renews Patent License with NVIDIA
Friday, October 5, 2018
Vidatronic Selects Redtree Solutions as Its Sales Representative for European and Middle-Eastern Markets
Thursday, October 4, 2018
TSMC to Start 5nm Production in April
GUC Monthly Sales Report - Sep 2018
Apple, Amazon Refute China Chip Hacking Story
Wednesday, October 3, 2018
Meet grandmaÂ’s new friend: her robot
TSMC Goes Photon to Cloud
DRAM Market Braces For Slower Growth
Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA
eMemory Receives 2018 TSMC IP Partner Award
M31 Receives TSMC's 2018 Partner of the Year Award for Specialty Process IP
Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies
Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator
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