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Thursday, November 29, 2018

• Think Silicon Announces New NEMA | GUI-Builder to Empower Programmers of IoT, Embedded and Wearable Devices
• Samsung's Big Semi Capex Spending Keeps Pressure on Competition
• Arm Drops Cordio BLE IP
• Sankalp wins STPI Highest Exporter Award - ITES
• Truechip Announces First Customer Shipment of SD Express Verification IP
• Brite Semiconductor, Naneng Microelectronics and Corigine Collaborate to Release Complete USB 3.0 IP Solution

Wednesday, November 28, 2018

• UltraSoC launches "any processor" lockstep solution for safety-critical systems
• GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands
• IEEE Publishes IEEE 802.1CM-2018 Standard Addressing Time-Sensitive Networking for Fronthaul
• AI a Focus as U.S. Preps Export Controls
• Samsung Strengthens Number One Sales Position
• IAR Systems and Andes collaborate to boost performance for RISC-V users
• Wave Computing Raises $86M in Oversubscribed Series E Round To Fuel Global Expansion and Further Accelerate Wave's Cloud-to-Edge Strategy
• Perceptia Second-Generation Digital PLL IP Enters Mass Production
• MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC

Tuesday, November 27, 2018

• Memory Culprit as Semiconductor Sales Slow
• GUC Announces ShenZhen Office Opening
• Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation
• The Linux Foundation and RISC-V Foundation Announce Joint Collaboration to Enable a New Era of Open Architecture
• Argon Design licenses Argon Streams AV1 to Realtek Semiconductor
• Xilinx's New FPGAs Address Evolving Threats, Fake ICs
• Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds
• Arm and AWS: Working together to "Re:Invent" the cloud
• Allegro DVT Launches a new High-Performance, Multi-Format Video Encoder IP for 4K/UHD Video Resolutions and Beyond

Monday, November 26, 2018

• Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and SPI NOR Flash Qualified in 65nm Floating-Gate Flash Process
• Is IP SoC 2018 Still Alive? Better than Ever!
• Zhuhai Chuangfeixin Introduces eNOR Embedded Flash Memory IP Solution and SPI NOR Flash Products on 65nm Floating-Gate Flash Process
• Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids
• SureCore Joins the RISC-V Foundation
• PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cables Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost
• Thales joins RISC-V Foundation to help secure open-source microprocessors

Sunday, November 25, 2018

• Only Qualcomm Reported to Post Slight Decline Among Top Ten Fabless IC Design Houses by 3Q18 Revenue, Says TrendForce
• SiFive Appoints VP to Growing SoC IP Group
• There's More to The RISC-V China Story
• IAR Systems Expands Support for Arm DesignStart with High Performance Tools for Arm Cortex-A5
• Express Logic Provides Support for Infineon TriCore Microcontrollers
• PLDA Offers XpressRICH PCIe and CCIX Controller IP Through SiFive DesignShare Program

Wednesday, November 21, 2018

• Silex Insight joins RISC-V foundation
• Winbond and Tiempo Secure join forces to offer the world's first fully CC EAL5+ certifiable Secure Element IP for IoT

Tuesday, November 20, 2018

• AMS, Qualcomm partner on 3D biometrics
• Demand for 7nm ICs boosts TSMC in October, UMC flops
• UMC claims its DRAM is different to Microns
• TSN IP Core making devices fit for real-time Ethernet
• UMC and Gear Radio Introduce 55nm Bluetooth 5 IP Platform
• Gear Radio Introduces Complete Bluetooth 5 Low-Power IP Solution for IoT SoC Applications
• North American Semiconductor Equipment Industry Posts October 2018 Billings
• Xilinx Extends Functional Safety into AI-class Devices
• OPENEDGES' Memory Subsystem IP - DDR Controller & NoC interconnect licensed for high end 4K multimedia SoC

Monday, November 19, 2018

• Cadence Announces Tapeout of GDDR6 IP on Samsung's 7LPP Process, Enabling Complete GDDR6 IP Solution
• Outlook Remains Bright for Automotive Electronic Systems Growth
• Blu Wireless Technology announces the HYDRA 2.X family of System IP for 802.11ay mmWave applications
• Toshiba Unveils 130nm FFSA Development Platform Featuring High Performance, Low Power and Low Cost Structured Array
• Sankalp Semiconductor announces ARM Empowered Design Suite