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Friday, November 16, 2018

• Xilinx and Mipsology Release Integrated Solution for High-Performance Inference in Data Center

Thursday, November 15, 2018

• Thwarting LED cost erosion, high-value automotive sector is driving revenue growth

Wednesday, November 14, 2018

• QuickLogic Announces eFPGA Now Available on TSMC 40nm Process
• Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio
• Achronix Unveils New "eFPGA Accelerator" Programs for Researchers and Test-Chip Developers
• Q&A with ST CEO: Who He Is, What He's Done
• Why RISC-V Lags in China
• GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications
• Verne Global introduces Arm architecture via Marvell ThunderX2 processor-based servers to hpcDIRECT
• RISC-V Momentum Seen Growing in China

Tuesday, November 13, 2018

• IBM blockchain momentum growing in EU
• TSMC drops one place to fourth-biggest chipmaker
• TSMC approves new capex spending for capacity expansion
• GloFo launches ASIC design subsidiary
• IntelliProp to Demo PCIe to Gen-Z Bridge at SC18
• Xilinx Extends Data Center Leadership with New Alveo U280 HBM2 Accelerator Card; Dell EMC First to Qualify Alveo U200
• Achronix Unveils New "eFPGA Accelerator" Programs for Researchers and Test-Chip Developers
• Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers
• Achronix Finalist for the Global Semiconductor Alliance's 2018 Most Respected Private Semiconductor Company Award
• Cortus S.A.S Appoints Mr. Gordon Yang Guo-dong as Vice President of Business Development
• Micron and Achronix Deliver Next-Generation FPGAs Powered by High-Performance GDDR6 Memory for Machine Learning Applications
• Nexell Licenses Intrinsic ID Hardware Root of Trust for AI Application Processor

Monday, November 12, 2018

• Nine Top-15 2018 Semi Suppliers Forecast to Post Double-Digit Gains
• Arasan completes its Total IP Solution for the UFS 3.0 Standard with immediate availability of its MIPI M-PHY 4.1 IP Core
• Imagination reveals next step in PowerVR automotive strategy

Sunday, November 11, 2018

• Andes Technology and INVECAS Announce Partnership to Win RISC-V-Based SoC Designs for Advanced Processes
• HPC Systems Inc. Expands the Science Cloud Offering with the Latest Arm-based HPC
• Spin Memory Announces $52 Million Series B Funding Round
• Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution
• Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip
• Open-Silicon, SiFive and Credo Showcase End-to-End Solutions for HPC and Networking Applications at SC18 in Dallas
• Nextera and Adeas Announce Village Island as Distributor for IP Cores in Japan
• Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm
• Hex Five adds MultiZone Security to the Andes RISC-V Cores on GOWIN FPGAs
• DINI Group announces immediate availability of the DNVUPF4A - Prototyping for 5G

Thursday, November 8, 2018

• UMC Issues Follow-up Statement Regarding Recent Legal Developments
• TSMC October 2018 Revenue Report
• UMC Reports Sales for October 2018

Wednesday, November 7, 2018

• What NXP Lost and Regained Post-Qualcomm
• CEVA, Inc. Announces Third Quarter 2018 Financial Results
• NSCore Inc. Addresses the IoT Market Need for an NVM IP Solution in Advanced Process Technology Nodes
• Dr. Jesse Zhixi Fang Appointed as Chair of the RISC-V Foundation China Advisory Committee to Accelerate Adoption of the RISC-V ISA in China
• SDC18: Samsung Reveals Breakthroughs in Intelligence, IoT and Mobile UX
• Global heavyweight clients touting adoption of TSMC 7nm node

Tuesday, November 6, 2018

• UltraSoc hosts Bristol RISC-V meetup as it looks to expand
• New Mentor Symphony platform addresses nanometer-scale SoC mixed-signal verification challenges
• Third Quarter Silicon Wafer Shipments Increase, Set New Quarterly Record
• SMIC Reports 2018 Third Quarter Results
• IEDM: Samsung makes 3nm gate-all-around CMOS
• US ban set to thwart Chinese DRAM entry
• China keeps global semiconductor market going strong
• Microsoft, Alexa, Bosch join Intel by investing in Syntiant
• Vidatronic Announces ACCUREF Series of Ultra-Precise, Extremely Low-Power Voltage and Current Reference IP Cores
• Judge Rules Qualcomm Must License Modem Patents
• Perceptia Devices Strengthens Europe Sales Network
• AMD Unveils World's First 7nm Datacenter GPUs
• Pinnacle Imaging Systems and ON Semiconductor Collaborate on New HDR Surveillance Solution Using Xilinx Technology to Push the Boundaries of High Dynamic Range Video

Monday, November 5, 2018

• Imperas Empowers RISC-V Community with riscvOVPsim
• Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler
• Dr. John Zhuang Appointed as CEO of Brite Semiconductor
• Synopsys Unveils Fusion Compiler, Enabling 20 Percent Higher Quality-of-Results and 2X Faster Time-to-Results
• sureCore names Roger Bailey VP Worldwide Sales
• Arm Kigen solutions see further adoption and achieve GSMA accreditation
• Everspin and SilTerra join forces to create new manufacturing center for MRAM
• Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers