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Wednesday, February 6, 2019

• Governor Cuomo Announces IBM Investment To Create Artificial Intelligence Hardware Center At SUNY Poly Albany Campus
• The Race To Multi-Domain SoCs
• NVMe Over TCP Will Take Time to Eclipse RDMA
• Apple, Q'comm Fight Over Engineers
• Eclipse Ventures Adds Mike McNamara and Sanjay Jha As General Partners
• Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip

Tuesday, February 5, 2019

• Sital Technology Announces the World's First Secured 1553 Component
• Huawei's Media Mess
• Huawei Was No. 3 Chip Buyer in 2018
• Synopsys and SAE International Release New Study Highlighting Critical Cybersecurity Risks in the Automotive Industry
• AMD Updates Wafer Supply Agreement with Globalfoundries
• Logic Design Solutions Introduces the first member of NVMe HOST RECORDER IPs
• New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV
• SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems
• AdaCore Enhances Security-Critical Firmware With NVIDIA
• Arm takes centre stage at Mobile World Congress 2019
• Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite

Monday, February 4, 2019

• TSMC production mishap to drag down Q1 sales by 2%: brokerage
• EDN Names Achronix's Speedcore Gen4 eFPGA to its Hot 100 Products of 2018
• MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks
• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips
• Xilinx Introduces HDMI 2.1 IP Subsystem

Sunday, February 3, 2019

• STMicroelectronics and Hyundai Autron Launch Development Lab for Eco-Friendly Automotive Solutions
• RISC-V Foundation & Members At Embedded World 2019
• Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018
• FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs
• Mobile Semiconductor Introduces A New 55nm High Density Memory Compiler Especially Designed For IoT Devices
• intoPIX and Macnica Preview a 4K AV over 1GbE Module Powered by TICO-XS and ST 2110 IP Transport for Pro AV Market at ISE 2019
• Renesas to Cut 1,000 Jobs in Japan
• Gartner Says Four Chinese OEMs Were Among the Top 10 Global Semiconductor Customers in 2018

Friday, February 1, 2019

• Can Arm Survive RISC-V Challenge?

Thursday, January 31, 2019

• Europe Looks to the Future of Computing
• Semiconductor R&D Spending Will Step Up After Slowing

Wednesday, January 30, 2019

• Hardent and Xilinx Collaborate to Deliver Complete 8K Ready DisplayPort 1.4 IP Subsystem
• EU considers proposals to exclude Chinese firms, such as Huawei, from 5G networks
• Is AI Robustness the Cost of Accuracy?
• Bluespec Returns from Landmark RISC-V Summit; CTO Nikhil Leads Discussion on ISA Formal Spec
• Sital's Enhanced Reliability FPGA IP powers NASA's GEDI on board communications
• Feature-rich RISC-V IDE Available for Free Download
• VIS To Acquire GLOBALFOUNDRIES' Fab 3E In Singapore
• Annual Silicon Shipments Hit Record High, Market Exceeds $10 Billion for First Time Since 2008

Tuesday, January 29, 2019

• Apple Rallies on Services Growth
• Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry's First 1TB Embedded Universal Flash Storage
• Qualcomm Ruling Could Impact Industry Transition to 5G
• Key Metrics for Evaluating an Inferencing Engine
• eSilicon and Wild River Technology Announce Advanced SerDes Test System
• Sankalp Semiconductor Appoints Abhijit Dutta as Head of Mixed Signal Solutions
• Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology
• AdaCore Joins the RISC-V Foundation to Provide C and Ada Compilation Support

Monday, January 28, 2019

• Rambus Reports Fourth Quarter and Fiscal Year 2018 Financial Results
• eSilicon Announces Technical Advisory Board
• Arteris IP Adds 20 New Licensees and Releases Three New Products in 2018
• CEVA Locates More Success with Bluetooth 5.1 IP
• Zhuhai Chuangfeixin Announces Antifuse eFPGA IP

Sunday, January 27, 2019

• Supporting the UK in becoming a leading global player in cybersecurity
• TSMC production hit by sub-standard chemical
• TSMC gives low-growth warning for 2019
• MosChip announces acquisitions to strengthen Semiconductor Business Unit & CEO appointment
• Semiconductor Unit Shipments Exceeded 1 Trillion Devices in 2018
• China, Chips, and 2019 Still Unclear
• Dolphin Integration appoints Philippe Berger as Chief Executive Officer
• Silicon Creations Relies on Silvaco's Custom Design Flow for New Advanced FinFET Designs