Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
Silicon on Chip design resources
Catalog of SIP Cores
Silicon on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Thursday, November 1, 2018
Chipmaker Results Point Toward Correction
Cortus will be exhibiting at Electronica in Munich from 13 to 16 November 2018
SoC designers now have more choice from Arm with its secure foundation and Corstone IP
Discover Arm's new board for the development of PSA-ready IoT subsystems for Cortex-M processors.
U.S. Charges UMC, Fujian Jinhua With Technology Theft
Samsung Warns of Slow Growth Ahead
VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications
Quarterly Year-over-Year Growth Slows Substantially for IC Market
Montage LZ Technologies Selects Rambus CryptoMedia Core to Secure Set-Top Box Chips
UMC Issues Statement in Response to Recent Indictment and Civil Complaint
Wednesday, October 31, 2018
GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions
UMC Halts R&D Project with China Chipmaker
Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth
Tuesday, October 30, 2018
Imagination delivers industry's first visually lossless image compression for GPUs with a guaranteed reduction in memory footprint
Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing
Imagination introduces industry's most comprehensive GNSS IP core as part of its Ensigma wireless communications portfolio
Silex Insight releases IPsec as a hardware block to accelerate IoT, cloud, or edge servers
Silicon Valley company unveils the first Artificial Intelligence-based Power Exploration platform for electronics systems and semiconductors
GE Power Management licenses SoC-e wire-speed Cryptography IP for GOOSE&Sampled Values Security
SiFive Core IP 7 Series Creates New Class of Embedded Intelligent Devices Powered by RISC-V
Arteris IP Announces New FlexNoC 4 Interconnect IP with Artificial Intelligence (AI) Package
AImotive's aiWare3 Hardware IP Helps Drive Autonomous Vehicles To Production
Monday, October 29, 2018
Micron to buy Intel out from manufacturing venture
IEDM: Intel embeds MRAM in FinFET process
ASML, IMEC to take EUV lithography to high-NA
Samsung launches 7nm EUV process, SAFE partnership
Rambus Reports Third Quarter 2018 Financial Results
Rambus Appoints Luc Seraphin as President and Chief Executive Officer
Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM
Credo First to Publicly Demonstrate 112G SerDes in 7nm at TSMC's 2018 China OIP Forum
Sunday, October 28, 2018
SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC
Moortec To Showcase Its PVT Monitoring IP At the TSMC China OIP Ecosystem Forum in Nanjing
Synopsys Advances Test Fusion Technology with Test Points to Reduce Manufacturing Costs and Boost Quality
Real Intent Provides Comprehensive Reset Analysis with Meridian RXV
Intel Reports Tepid Progress on 10 nm
Global Semiconductor Sales in September Up 13.8 Percent Year-to-Year
Silicon Creations' Fractional-N PLL Technology Leveraged at Israel's Bar-Ilan University SoC Lab
Gowin Semiconductor Brings Ultra Low Power Programmable Logic Devices To Market
PLDA and MegaChips announce a cooperation to design PCIe controllers and PCIe PHY IP on TSMC's 16nm Process Technology
GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
Kazan Networks Announces NVMe-oF ASIC Production Release
Synopsys Improves Automotive Functional Safety with Fast Soft-Error Analysis
Chinese Firm to Buy NXP Spinoff
Thursday, October 25, 2018
Atmosic Technologies Introduces Innovative Wireless Platforms to Drive Battery-Free Internet of Things
Thursday, October 25, 2018
NovuMind's AI Chip Sparks Controversy
Thursday, October 25, 2018
Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance
Wednesday, October 24, 2018
Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
eSilicon 56G long-reach 7nm DSP SerDes is now available for licensing
UltraSoC and ResilTech partner to further functional safety in automotive systems
DVB-RCS2 Satellite Modulator IP Core from Creonic Now Available
NovuMind Releases Details of Breakthrough AI Chip
Tuesday, October 23, 2018
NEC and Samsung Announce 5G Partnership Agreement
American Express and Rambus Join Forces on Secure Global E-commerce Tokenization
CEVA Adds ONNX Support to CDNN Neural Network Compiler
Analysis: Dialog finds a better way out from under Apple
Cypress Delivers Smart, Fail-Safe Storage Platform Leveraging Arm Processor for Enhanced Safety and Reliability
Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology
OneSpin Puts Verification on the Move with New PortableCoverage Solution
Synopsys Announces Fastest, Most Power Efficient DDR5 and LPDDR5 IP Solutions
North American Semiconductor Equipment Industry Posts September 2018 Billings
Monday, October 22, 2018
Attopsemi Published I-fuse™ Technology with the Smallest Size, Lowest Power, and Full Testability on 22nm FD-SOI at IEEE S3S Conference, 2018.
Synopsys Custom Compiler Doubles New Customer Adoptions, Introduces New Release
Synopsys FineSim SPICE Cuts Analog Simulation Time by 3X
Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry's First Silicon-Proven, Long-Reach 7nm 112G SerDes IP
Synopsys Custom Design Platform Delivers Breakthrough Analog Simulation and Fusion Technologies
Cadence Reports Third Quarter 2018 Financial Results
Previous
|
Next
Did you miss last D&R News Alerts ?