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Thursday, October 18, 2018

• ISG Positions L&T Technology Services as Global Leader in the First Ever Service Provider Ranking on Product, Process and Platform Engineering

Wednesday, October 17, 2018

• Communications Rise To Represent Largest Portion of Foundry Sales
• NXP Secures the Edge with Two Industry-First Multi-Core Arm Cortex-M33 Solutions
• TSMC Reports Third Quarter EPS of NT$3.44
• STMicroelectronics Introduces STM32L5 Ultra-Low-Power Microcontrollers for a More Secured IoT
• Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions
• Samsung Debuts Semiconductor Innovations at Samsung Tech Day that Maximize Data Center Efficiencies and Enable AI, Enterprise and Emerging Technologies
• Samsung Electronics Starts Production of EUV-based 7nm LPP Process

Wednesday, October 17, 2018

• TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event

Tuesday, October 16, 2018

• MCUs Deliver Hardware-Based IoT Security
• Samsung to Acquire Zhilabs to Expand AI-Based Automation Portfolio in 5G Era
• IAR Systems leads the way for secure IoT development based on Arm TrustZone and Arm Cortex-M
• Rambus and Riscure Team Up to Deliver Best-in-class Security Testing Platform for Side-channel Analysis
• More than 100 Major IC vendors, OEMs and Broadcasters Already Adopted Allegro DVT Compliance Streams
• Arteris IP FlexNoC Interconnect Licensed by Iluvatar CoreX for Artificial Intelligence Application
• IBM, GLOBALFOUNDRIES Enhance Si2 Unified Power Model Standard
• Arm goes higher up the stack for device-to-data IoT security
• Synopsys Awarded DARPA Electronics Resurgence Initiative Contract for Advanced Emulation Technology
• Silicon Creations Named TSMC Partner of the Year 2018 for Analog / Mixed-Signal IP
• IAR Systems supports new secure, ultra-low-power Arm Cortex-M33 MCUs from STMicroelectronics
• Wafer Shipments Forecast to Set New Highs Through 2021
• eMemory's OTP IP Qualified on 22nm FD-SOI process
• Arasan to demonstrate its I3C Host and Device IP and participate at the I3C Interoperability Session at the 2018 MIPI Devcon in Seoul
• Inside Secure's Latest Whitebox Software Security Tool Brings Mobile Developers New Levels of Protection, Performance and Control

Monday, October 15, 2018

• Agnisys at DVCON Europe 2018: Presenting End-to-End Solution for Specification to Design and Verification of the Hardware/Software Interface
• Hortonworks Collaborates with Huawei's Next-Generation Taishan Series Arm Servers
• L&T Technology Services announces completion of Graphene Semiconductor Services acquisition
• A View from Above - Aldec Adds 'Bird's Eye View' Function to Growing Portfolio of ADAS FPGA-based Reference Designs for TySOM™-3-ZU7EV Embedded Development Kit
• Synopsys Enables Tapeout Success for Early Adopters of Arm Neoverse IP
• Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices
• Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing
• OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller
• UltraSoC announces integrated multi-core debug, visualization and data science / analytics suite
• Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors for STMicroelectronics
• Cadence Verification Suite Enabled on Arm-Based HPC Datacenters
• SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
• ALTEN Calsoft Labs Acquires Si2Chip, a VLSI Chip Design Company
• Eta Compute Launches Machine Learning Platform with Ultra-Low-Power Consumption for Edge Devices

Sunday, October 14, 2018

• Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips
• Advanced Technology Key to Strong Foundry Revenue per Wafer
• Synopsys Delivers Platform Architect Ultra to Enable the Next Wave of AI SoCs
• CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan
• Flex Logix to Demonstrate Modular eFPGA at ARM TechCon
• Power Regulation IPs from Dolphin Integration, now Silicon Proven on GLOBALFOUNDRIES 22FDX Technology Platform
• Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem
• JPEG-XS standard preview by intoPIX at SMPTE ATC 2018
• Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China
• Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose
• Allegro DVT Introduces High Dynamic Range and High Frame Rate System Compliance Streams for DVB UHDTV
• Achronix to Demonstrate Speedcore eFPGA's Flexibility at Arm TechCon
• Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada

Wednesday, October 10, 2018

• GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G
• Dialog Semiconductor and Apple enter agreement
• Xylon Unveils New Panoramic Multi-Sensor Camera Demo at Xilinx Developer Forum
• Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications
• Arasan to demonstrate its MIPI DSI, CSI, C-PHY and D-PHY IP Cores at the 2018 MIPI Member Meeting Asia
• Silvaco to Showcase Octal SPI in Presentation at ARM TechCon
• IntelliProp to Exhibit at SC18 in Dallas, TX
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Synaptics VXR7200 IC Enabling Next Generation VR Headsets

Tuesday, October 9, 2018

• Global chip market up 15% in August
• Intel blames production shortfall on strong demand
• NVIDIA Launches GPU-Acceleration Platform for Data Science, Volvo Selects NVIDIA DRIVE
• NVIDIA Introduces RAPIDS Open-Source GPU-Acceleration Platform for Large-Scale Data Analytics and Machine Learning
• Nvidia boosts AI in medical instruments with graphic compute power
• Gowin Semiconductor's GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist For Design Innovation of the Year
• Cadence Recognized with Four 2018 TSMC Partner of the Year Awards
• Sankalp Semiconductor Opens Second Design Centre in Bangalore
• Rambus and Phison Sign Patent License
• Truechip Successfully hosted TrueConnect 2018 - The 2nd Annual Technical Conference
• Cadence to Demonstrate System and Automotive Solutions at Arm TechCon 2018

Monday, October 8, 2018

• Everest Group Positions L&T Technology Services as a global 'Leader' in Embedded System Engineering Services
• Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator
• Arm awarded TSMC Partner of the Year award for Processor IP
• Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution
• Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process
• UMC Reports Sales for September 2018
• QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process
• Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips
• TSMC September 2018 Revenue Report
• Inside Secure Selected by Norway's Nationwide Debit Card System to Secure Mobile Contactless Payments
• Synopsys to Showcase Optimized Solutions and Expert Services for Arm-based Designs at Arm TechCon 2018