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Monday, September 3, 2018

• Automotive ultra-low On-resistance MOSFET in thermal-improved package
• Bringing Artificial Intelligence to the Edge of the IoT
• Huawei Launches Kirin 980, the World's First Commercial 7nm SoC
• China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020
• NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks
• Palma Ceia SemiDesign Announces Silicon-Proven LTE NB-IOT Transceiver for IoT Applications
• Credo to Demonstrate 100G Mixed-Signal DSP for 100G DR1 & 400G DR4 Optical Modules at CIOE
• Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor

Sunday, September 2, 2018

• Tiannengbo optimises their latest Mining Chip using Moortec's Embedded Temperature Sensor
• Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer
• ADAS SoC: Show Me Your Benchmark

Friday, August 31, 2018

• Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC China 2018

Thursday, August 30, 2018

• Intel Cautious on EUV
• Socionext Establishes "ForteArt" to Enhance Sound Quality in Wide Range of Applications

Wednesday, August 29, 2018

• Variation In Low-Power FinFET Designs
• Yocto Project Welcomes New Members, Advances Open Source Embedded Systems Through Momentum
• SMIC Announces Unaudited 2018 Interim Results
• Variation In Low-Power FinFET Designs
• Jon Peddie Research reports the Q2'2018 GPU shipments

Tuesday, August 28, 2018

• Radiation-tolerant FPGAs take high speed signal processing to space
• Apple Goes Vertical & Why It Matters
• Rambus and Infineon Renew Patent License Agreement
• GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region
• Memory ICs to Account for 53% of Total 2018 Semi Capex
• Frontier collaborates with NXP on new Smart IoT software licensing business

Monday, August 27, 2018

• Allegro signs UMC as primary foundry
• Murata to build second Finnish MEMS fab
• Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications
• RoodMicrotec selected as key partner for EnSilica automotive ASIC project
• GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings
• Analysis: Outpaced by TSMC, GloFo cuts its cloth
• Lattice Semiconductor Appoints Jim Anderson as CEO
• Gartner Says Huawei Secured No. 2 Worldwide Smartphone Vendor Spot, Surpassing Apple in Second Quarter 2018
• Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification

Monday, August 27, 2018

• VeriSilicon Shipping ZSP Based ASIC for SyChip's Voice Over WLAN Module

Monday, August 27, 2018

• VeriSilicon Licenses ZSP(R) G2 Processor Family to Yamaha for Advanced Multimedia Applications

Monday, August 27, 2018

• ARM and Synopsys Announce Industry-First and Recommended Flow For ARM11 Family With Intelligent Energy Manager Technology

Sunday, August 26, 2018

• Drone.io Announces Official Support for Arm Architectures
• Synopsys Delivers 10X Performance in Formal Property Verification with Breakthrough Machine Learning Technology

Friday, August 24, 2018

• North American Semiconductor Equipment Industry Posts July 2018 Billings

Thursday, August 23, 2018

• Memory Does not Come Cheap... Or Does It?
• Worldwide Semiconductor Revenue Hit Record $120.8 Billion in Q2 2018, IHS Markit Says

Wednesday, August 22, 2018

• An inside look: Innovation, automotive test, and what's next
• Gaps In Verification Metrics
• Verification Trends Enabling A 5G Future
• Apple, Intel Good Partners, For Now
• Fujitsu Presents Post-K CPU Specifications
• TSMC to start making Qualcomm Snapdragon chips in 4Q18, says report
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2018
• Intellectual property in an AI world
• Cost of designing an SoC creeps up