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Wednesday, July 8, 2026

• Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
• TAKUMI starts licensing new Warping IPs "TW270" and "TW290"
• »Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices
• Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company

Tuesday, July 7, 2026

• SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms
• CAST Licenses TCP/IP Hardware Stack Core for Keysight FieldFox Handheld Spectrum Analyzers
• Discuss Silicon-Ready UCIe IP at DAC 2026, Long Beach, California

Monday, July 6, 2026

• In the AI-native era, what exactly are autonomous vehicles competing on?
• Malaysia launches program to accelerate next generation of homegrown semiconductor firms
• China's semiconductor companies speed up IPOs in 2026, as A-share market fuels bid for chip self-reliance
• Vietnam advised to prioritize Edge AI, IoT and chiplet technologies
• SemiFive Records First Overseas Mass Production Revenue
• KSIA Welcomes New Domestic Semiconductor Investment Plan
• Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
• Qualcomm's Tenstorrent Deal Looks Less Likely
• Imec extends auto chiplet program to edge computing
• Allegro DVT contributes to European automotive chiplet
• Chips&Media to Supply APV IP for Future Google Smartphones
• VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
• RISC-V Accelerates Physical AI Chips
• Rambus Targets AI PCs With 9,600 MT/s Client Memory Chipset
• TES Electronic Solutions Introduces a Split‑Pi Boost‑Buck DC‑DC Converter IP for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
• Nordic expands nRF Cloud with firmware vulnerability scanning
• Keysight and WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components
• Electronics Digital Twin platform from Synopsys for accelerating physical AI development
• Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology
• US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging
• Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node

Thursday, July 2, 2026

• Vietnam advised to prioritize Edge AI, IoT and chiplet technologies
• Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
• Allegro DVT plays a pivotal role in groundbreaking CHASSIS Automotive Base Die development
• Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
• Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck
• Perforce Intelligence Advances Control and Trust for AI Workflows
• BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors
• StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
• Wave Photonics Announces Synopsys OptoCompiler Compatibility for PDKs hosted on its PDK Management Platform
• Chiplets past, present, and future: how advanced packaging is shaping silicon
• Samsung Unveils AI Foundry Ecosystem Push
• Samsung resumes 1.4nm chip development, targets 2029 mass production

Wednesday, July 1, 2026

• Xiphera Selected for ESA ARTES Project to Advance Secure High-Speed Satellite Communications
• Xiphera Strengthens Its Presence in Japan with the Appointment of Yasuhiro Okumura as Country Manager
• Real Intent Meridian CDC with Microarchitectural Analysis (MA) Transforms Clock Domain Crossing Sign-Off

Tuesday, June 30, 2026

• CAST Introduces PSI5-HOST IP Core for Automotive Sensor Interfaces

Monday, June 29, 2026

• Soitec and ZenSemi Partner to Scale 300mm BCD-on-SOI Production for Next-Generation Power Electronics
• Floadia Releases High-Performance Automotive Embedded Flash IP on Leading Foundry’s 90BCD Platform
• South Korea nears announcement on new semiconductor production cluster outside Greater Seoul
• Synaptics Acquisition by Onsemi Affirms Edge AI Is for Real
• SkyeChip profit forecast to grow at 48% CAGR from FY26 to FY29
• Renesas Promotes Gaurang Shah to Senior Vice President
• EnSilica set to post record results after "very successful year"
• M31 Joins "2026 TALENT, in Taiwan – Talent Sustainability Action Alliance"
• Ceva CEO Amir Panush Named "Artificial Intelligence Company CEO of the Year" in 2026 AI Breakthrough Awards Program
• Cellular IoT Market Growth to Reach 5.9 Billion Connections by 2035, Says Omdia
• NVIDIA Vera Rubin Delivers World-Class Supercomputers for Science
• PREVAIL: A Unique European Testing Platform for Edge AI
• Jim Keller: ‘AI Still Obeys the Old Laws of Compute’
• EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
• Sovereign European chips could become a RISC-V-based reality
• M31 talks about 12 FFC Multi-Port Register Array
• Murata and Synopsys collaborate to streamline simulation workflows for electronics designers
• IBM Unveils Sub-1nm Chip Tech with 50% Performance Boost
• Global Foundry 2.0 Revenue Rises 23% YoY in Q1 2026 as AI Continues to Boost Demand
• TSMC (NYSE:TSM) Is Raising 7nm Chip Prices Up To 10% As Expansion Builds
• Advanced USB Connectivity IP Validated on N2P Process Technology