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Thursday, October 2, 2025

• Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform
• Dnotitia Releases "Dnotitia NIAH," an Open-Source Benchmark for Long-Context LLM Performance

Wednesday, October 1, 2025

• Northern Poland Emerging as Europe's Next Semiconductor Hub
• Photonics leaders call for a €2 bn EU program to 'keep Europe competitive'
• Taiwan will not agree to 50-50 chip production deal with US, negotiator says
• Soitec initiates succession process for chief executive officer Pierre Barnabé
• Synopsys Gives Its Major EDA Offerings a Gen-AI Facelift
• TSMC Price Hikes End the Era of Cheap Transistors
• Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP on TSMC 3DFabric Platform
• Codasip RISC-V processors certified up to ASIL-D
• Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner
• Analogue Insight IP Group Launches Analogue Insight SAFE in Portland, Oregon to Deliver Certification-Grade Security IP for Next-Gen SoCs and Chiplets.

Tuesday, September 30, 2025

• Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
• CAST Expands Security IP Portfolio with High‑Performance SM4 Cipher Core
• Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland
• Silicon Creations Receives 9th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
• Advanced 112G SerDes PAM4 IP core for Low-Power, Multi-Reach Connectivity Across Silicon-Proven 12/7/6/5nm Nodes

Monday, September 29, 2025

• Semiconductor coalition demands revamped EU Chips Act
• Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing
• Quantum eMotion and Jmem Technology Join Forces to Deliver the First-Ever Full-Stack Quantum-Resilient Security Chip
• GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity

Saturday, September 27, 2025

• French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference

Friday, September 26, 2025

• AI and Chiplets Prominent at TSMC OIP 2025
• Innosilicon to Showcase High-Speed Interface IP and Advanced SoC Solutions at the 2025 TSMC OIP Ecosystem Forum
• Weebit Nano Joins EDGE AI FOUNDATION to Advance Intelligent Systems at the Edge
• Xiphera and iWave Partner to deliver secure solutions on Altera FPGAs

Thursday, September 25, 2025

• Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI
• The Quantum Race: Finding Europe's Formula 1
• Tenstorrent Productizes RISC-V CPU And AI IP
• ARM unveils design office for advanced chips as India pushes chip growth
• Intel Reportedly Explores Investment Talks With Apple, Foundry Seen as Key
• Europe drives to dominate photonics
• Allegro DVT Supports AV2 Standard Ecosystem with the Launch of Comprehensive Compliance Test Tools
• Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening
• Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI
• Baya Systems Collaborates with Tenstorrent to demonstrate Optimized Subsystem for TT-Ascalon™ Processors, Joins OCA Ecosystem
• proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process
• M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6e Platform
• Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation
• Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
• Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric
• Perceptia Introduces pPLL08N: A Family of Compact Narrow-Band RF PLLs which Complement pPLL08W
• eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award

Wednesday, September 24, 2025

• Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025
• VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications
• Samsung's Share in HBM Market Projected to Surpass 30% in 2026
• TSMC, chip design software firms tap AI to help chips use less energy
• Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
• Siemens adds AI to Simcenter Testlab to reinvent modal testing and analysis processes
• GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric® and Advanced Process Technologies
• GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications
• Arteris Selected by NanoXplore for Space Applications

Tuesday, September 23, 2025

• Nordic Semiconductor launches full device observability and OTA capabilities via nRF Cloud powered by Memfault
• New Investments Flowing Into Photonics
• Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
• Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
• EnSilica and Codasip announce strategic partnership
• MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM

Monday, September 22, 2025

• TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC
• OpenAI and NVIDIA Announce Strategic Partnership
• NanoEdge AI Studio v5, 1st AutoML tool with Synthetic Data Generation
• Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum

Sunday, September 21, 2025

• BOS CEO, Jaehong Park, Introduces Eagle-N - Our Innovative AI Accelerator