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Monday, August 24, 2026

• Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
• SEMICON India 2026 targets full chip value chain
• Chips Act 2.0, Part 2: From Brussels to the Bench: What Chips Act 2.0 Means for Engineers
• Can Vietnam's SOEs Manufacture a Semiconductor Industry?
• Samsung Raises Advanced Chip Prices by 15% as AI Boom Gives Foundry Business New Leverage
• Keysight Technologies Reports Third Quarter 2026 Results
• BOS Semiconductors to Present Eagle-N at Hot Chips 2026
• Aion Silicon Participating in Five Global Semiconductor and AI Events
• TIER IV and Renesas target AI-native SDV platform
• Arteris: High Premium For AI Chip IP
• Alibaba’s RISC-V Chip Runs 27B AI Model Without a GPU
• Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity
• proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
• Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030
• TSMC Completes Development of 1.6nm A16 Process; Mass Production Set for Q4

Thursday, August 20, 2026

• Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
• Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
• Success of three megaprojects hinges on execution
• India’s C2S Program Pushes Semiconductor Design Training Toward Silicon
• SMIC lifts prices due to AI demand
• Samsung Electronics raises advanced foundry prices up to 15%, 4nm line at full capacity: Reuters
• Samsung reportedly considers converting R&D facility into 2nm HBM production line
• M31 Reports Nearly Fourfold Growth in Advanced-Node Royalties as Long-Term Investments Begin to Bear Fruit
• VeriSilicon's H1 revenue doubles but losses widen to 612 million yuan; monetizing billions in AI orders will take time
• High-Performance Standalone MJPEG IP ‘WAVE-J’ by Chips&Media Widely Adopted Across Diverse Applications
• Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips
• BOS Semiconductors Tapes Out Automotive AI Accelerator 'Eagle-N'... Begins Evaluation with German and Chinese Automakers
• SkyeChip's AI expansion to yield meaningful earnings from 2029
• BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community
• StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
• Andes Technology’s D23-SE RISC-V Processor Achieves ISO 26262 ASIL‑B and ASIL‑D Certification for Functional Safety Applications
• Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
• The changing role of the foundry

Tuesday, August 18, 2026

• Advanced Analog IP Cores Licensed by Multiple Global Customers for 12nm/22nm SoCs

Monday, August 17, 2026

• Korea Fabless Industry Association, Cadence Korea Partner to Strengthen Local Chip Design Firms
• India advances semiconductor, AI capabilities to strengthen technology leadership
• Korea vows to ease regulations to support 3 megaprojects
• Semiconductor development: Lessons from France and path forward for Vietnam
• SEMIFIVE Accelerates Growth with 97% YoY Revenue Surge in H1 2026, Powered by ASIC Turnkey, Mass Production, and IP
• Qualitas Semiconductor Reports 870 Million Won Operating Loss in Second Quarter
• "The Ecosystem Will Be Healthy Only If the Semiconductor Design IP Industry Grows"
• Industry coalition announces Open Silicon Photonics Initiative within Open Compute Project
• European AI factories everywhere, still Nvidia
• BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection
• Spain Unveils BER10: Europe’s First RISC-V Chip for Supercomputing
• Condor flies no more
• Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
• Arteris: Interview With President And CEO K. Charles Janac About Semiconductor System IP And Network-On-Chip Technology
• Samsung accelerates SoC design in South Korea with Claude, narrowing Qualcomm gap
• Racyics and Cloudberry VC give European Fabless Startups a complete Path from Design to Silicon
• TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on 2nm Mass Production
• Intel 14A Design Ecosystem Gains Support from Major EDA Partners
• Samsung Foundry updates process roadmap to move 1.4nm node to 2029 — high-NA EUV will enable 1nm-class and smaller nodes in 2030 and beyond

Thursday, August 13, 2026

• Comcores brings small-footprint MACsec and Root of Trust Security to Europe’s RIGOLETTO RISC-V Automotive Platform
• QuickLogic Reports Fiscal Second Quarter 2026 Financial Results
• Ceva, Inc. Announces Second Quarter 2026 Financial Results
• Nordic certification milestone aims to accelerate satellite IoT deployment
• Next-gen components power safer, smarter vehicles
• BrainChip CEO Sean Hehir Talks Edge AI and the Future of Autonomous Drones
• Eight Companies Shaping India’s Semiconductor Design Ecosystem
• Siemens EDA Says AI Can Cut Chip Design Time by Up to 10x
• Siemens Automates Chip Design with AI Agents: "Verification and Fixes While Engineers Sleep"
• Joinsilicon's AI ASIC Chip Design Platform Rated as Internationally Advanced Level
• Movellus Brings Power Optimization IP to Samsung Electronics’ Advanced Nodes
• Samsung Delays High-NA EUV Adoption Until 2030 for 1 nm Node
• Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors
• PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026

Wednesday, August 12, 2026

• Poland in the European semiconductor ecosystem
• TSMC Earnings Jump 77%, Capex Hits $64B [2026]
• AI Chip Demand Is Driving ASML Stock And 2 Semiconductor Picks