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Saturday, April 19, 2025

• BOS Joins Plug and Play NeoCity 2025

Friday, April 18, 2025

• New Breakthroughs in China's RISC-V Chip Industry

Thursday, April 17, 2025

• Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
• Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• BrainChip Gives the Edge to Search and Rescue Operations
• ASML targeted in latest round of US tariffs
• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC

Wednesday, April 16, 2025

• Intel Announces Strategic Investment by Silver Lake in Altera
• Cadence to Acquire Arm Artisan Foundation IP Business
• AMD Achieves First TSMC N2 Product Silicon Milestone
• Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading
• Secafy selects Siemens' EDA tools for innovative hardware security development
• How NoC architecture solves MCU design challenges
• VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables
• Smart and compact sensors with Edge-AI
• Silicon Photonics Enables Low-power AI Accelerator Platform
• Taiwan to focus on silicon photonics, build new economic shield
• Equal1 Validates CMOS-Compatible Silicon Spin Qubit Platform Using GlobalFoundries' 22FDX Process
• Samsung achieves 40%+ test yields with 4nm logic die
• Has AI Finally Destroyed the Need for Software Testing?

Tuesday, April 15, 2025

• Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024
• Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding
• eDP/DP 1.4 Tx PHY & Controller IP Cores Now Available to Meet Rising Demand for High-Performance Display Solutions with Next-Gen Visual Connectivity
• Vertex Growth commits €10M in Dolphin Semiconductor
• New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
• Vertex Growth commits €10M in Dolphin Semiconductor
• Korea unveils massive $23.2B semiconductor support plan

Monday, April 14, 2025

• Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs
• Beware of the Open-Source Licensing Gap
• Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems
• Why Do Hyperscalers Design Their Own CPUs?
• EnSilica - Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
• Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor
• BOS Semiconductors at Auto Shanghai 2025

Friday, April 11, 2025

• Semiconductor Companies Make Strategic Acquisitions to Bolster Portfolios

Thursday, April 10, 2025

• Samsung Reportedly Begins 1nm Process Development, Targets 2029 Mass Production

Wednesday, April 9, 2025

• Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
• Ubuntu developer images now available for OrangePi RV2: a low-cost RISC-V SBC
• EnSilica Signs MoU with European Satellite Operator
• VeriSilicon Unveils a High-Efficiency LCEVC Video Decoder Supporting 8K Ultra HD
• TSMC March 2025 Revenue Report

Wednesday, April 9, 2025

• Semiwise Completes the Development of the Virtual Reality Semiconductor Fabrication Training Facility
• Cadence Urges Tech Leaders to Push Data Centre Innovation
• Time-Sensitive Networking: the factory's traffic cop
• Cyient Announces the Launch of Semiconductor Subsidiary
• Blumind Secures Series A Funding to Accelerate Analog AI Revolution
• UMC Reports Sales for March 2025
• Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO

Tuesday, April 8, 2025

• Semiwise Completes the Development of the Virtual Reality Semiconductor Fabrication Training Facility
• Cadence Urges Tech Leaders to Push Data Centre Innovation
• Time-Sensitive Networking: the factory's traffic cop
• UMC Reports Sales for March 2025
• Cyient Announces the Launch of Semiconductor Subsidiary
• Blumind Secures Series A Funding to Accelerate Analog AI Revolution
• Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO

Tuesday, April 8, 2025

• GUC Monthly Sales Report - March 2025

Tuesday, April 8, 2025

• Dnotitia and Hanyang University Launch Open-Source Platform Benchmarking AI Quantization

Monday, April 7, 2025

• JPEG XS Technology Integrated by Cobalt Digital with intoPIX TicoXS FIP Codec, supporting High Profile and new TDC Profile
• Infineon further strengthens its number one position in automotive microcontrollers and boosts systems capabilities for software-defined vehicles with acquisition of Marvell's Automotive Ethernet business
• ZeroPoint and Rebellions Forge Strategic Alliance to Revolutionize AI Accelerator Performance and Efficiency
• Alliance Aims to Deliver Memory-Optimized AI for Inferencing
• Arm Powers Software-Defined Vehicle Revolution
• Call to boost energy security in Europe
• Siemens acquires DownStream Technologies to expand PCB design-to-manufacturing flow