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Friday, December 12, 2025

• RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
• Silicon Creations and Chip Interfaces Announce Successful Interoperability for JESD204B/C, Interlaken, and CPRI
• BrainChip Announces $25 Million (USD) Funding Ahead of CES to Power Next-Gen Edge AI
• Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance

Thursday, December 11, 2025

• Nordic Semiconductor launches nRF9151 software and development kit combining satellite and cellular IoT connectivity
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2025
• CoMira Announces One of the Industry’s First Commercially Available UALink IP Solutions for Next-Generation AI Scale-Up Networks
• Semiconductor industry enters unprecedented ‘giga cycle’, says report — scale of artificial intelligence is rewriting compute, memory, networking, and storage economics all at once
• Korea unveils $534 bil. plan to lead global chip race in AI era
• Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise
• India Paves Dual RISC-V Tracks with C-DAC and Startup Silicon
• Tenstorrent Blackhole Support & Other New RISC-V + ARM64 Hardware In Linux 6.19
• CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
• TSMC November 2025 Revenue Report
• Developing high-performance compute and storage systems
• UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation Connectivity
• CAST Introduces Microsecond Channel Controller IP Core for Automotive Power and Sensor Interfaces

Wednesday, December 10, 2025

• Meeting the Demands of Next-Gen Client Computing with a High-Performance, High-Reliability SPD Hub
• Synopsys records record-breaking full-year revenue as it beats expectations again
• MEMTECH Unveils New LPDDR3 Memory Subsystem Family with Hyper-Bandwidth, Automotive Safety, and Ultra-Low Power Innovations
• Andes Announces First Customer Tape-Out Delivery of the AX46MPV for Cloud AI Acceleration
• HCLTech partners with Dolphin Semiconductor to develop energy-efficient chips for IoT and data center applications

Tuesday, December 9, 2025

• FortifyIQ Partners with Nexus-GT to Expand its Security Market Reach in Israel
• TES Launches 3.3 V CAN Transceiver IP for Single‑Chip Solutions
• Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT

Monday, December 8, 2025

• DVB-S2 Demodulator Available For Integration From Global IP Core
• Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX
• SoftBank's Arm plans to set up chip training facility in South Korea
• Silicon’s Green Revolution: How Cutting-Edge Innovations are Forging a Sustainable Future for Semiconductors
• Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC
• First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry
• Global cybersecurity agencies publish secure AI integration principles for OT
• Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables
• Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia
• Innatera and 42T join forces to power the next wave of intelligent product innovation
• Risc-v Cores and Neuromorphic Arrays Enable Scalable Digital Processors for EdgeAI Applications
• CXL Adds Port Bundling to Quench AI Thirst
• UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing
• TSMC Strengthening Foundry 2.0 Leadership Amid Strong AI and Packaging Demand

Thursday, December 4, 2025

• MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
• DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
• Germany Redirects Intel Funds Into New Wave of Semiconductor Projects
• Could an EU Chips Act 2.0 Bridge the Lab-to-Fab Gap?
• BOS Semiconductors at 2025 Korea Tech Festival
• Fraunhofer HHI advances indium phosphide photonics for high-speed data communication
• Imec strengthens its global presence with new regional research & development hub in Qatar
• VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification
• The AI Future is Now All About the Edge
• Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development
• Idaho Scientific Selects QuickLogic eFPGA Hard IP to Enable Crypto Agility
• Open Chiplet Design Moves Forward with Tenstorrent’s OCA Plan
• From Launch to Leadership: The Microservice Store Nominated for TechWorks Cybersecurity Award

Wednesday, December 3, 2025

• Synopsys launches AI exploration at AI Everywhere 2025
• Semidynamics Welcomes Iakovos Stamoulis as Chief Technology Officer
• Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels

Tuesday, December 2, 2025

• Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
• NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design

Monday, December 1, 2025

• SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation