Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
Friday, August 16, 2024
How Synopsys IP and TSMC's N12E Process Are Driving AIoT
Ferroelectric RAM looking rusty and stuck
Thursday, August 15, 2024
Welcome to Silicon-to-Systems Space (Where No One Can Hear You Scream)
European RISC-V firms support SignatureIP NoC Networks-on-Chip
Wednesday, August 14, 2024
Xiphera's xQlave® Product Family Enables Full Compliance with Finalised NIST PQC Standards
Wednesday, August 14, 2024
AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC
NIST Releases First 3 Finalized Post-Quantum Encryption Standards
CEO interview: Coby Hanoch, Weebit Nano on ReRAM for AI
Draper Aims to Provide DoD Advanced Chips by 2027
Intel Has Offloaded Stake in ARM, Reportedly Raising nearly USD 150 Million
Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem
SiFive Announces New High-performance RISC-V Datacenter Processor for Demanding AI Workloads
Xiphera's xQlave® Product Family Enables Full Compliance with Finalised NIST PQC Standards
Huawei Rumored to Launch New High-End AI Chip, Potentially Rivaling NVIDIAs H100
First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
Tuesday, August 13, 2024
Akeanaâ„¢ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo
Tuesday, August 13, 2024
Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance
Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
OPENEDGES Unveils UCIe Chiplet Controller IP, Expanding Design Portfolio
Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo
Intel 18A Advanced Packaging is Key to Tech Leadership
Efinix Topaz RISC-V SoC FPGA Family for High Volume and Mass Market Applications
Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo
Monday, August 12, 2024
EU project joins forces towards the era of scalable control technology for quantum processors
TSMC's Expansion beyond 2nm Taking Shape? Angstrom-Class Fabs Possibly in Southern Taiwan
Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company
16-Bit, 5MSPS SAR ADC IP Core Silicon-Proven: Delivers Superior Dynamic Performance with Flexible Resolution Modes for Next-Generation Applications
Secure-IC signs International Collaboration with Taiwan Quantum Safe Association and PQC-CIA
Rupert Baines joins Nanusens board
TSMC July 2024 Revenue Report
SMIC Reports 2024 Second Quarter Results
AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware
Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden
Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models
Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
Rapidus to Fully Automate 2nm Fab, Claiming Chip Delivery Times at One-Third of Its Competitors
Synopsys's Plans to Buy Ansys for $35B Falls on UK Regulatory Radar
Sunday, August 11, 2024
Korea's Memory Exports to Taiwan Surge 225% in 1H 2024 Driven by Strong HBM Demand
Thursday, August 8, 2024
Simplifying AI Deployment from the Cloud to Edge and Endpoint
Scaling sustainability impact
The Uberization of Engineering
Raspberry Pi Launch New RP2350 Microcontroller and Pico 2 Development Board with RISC-V Support
Wednesday, August 7, 2024
NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
Imec demonstrates logic and DRAM structures using High NA EUV Lithography
QuickLogic Announces Partnership with CTG to Strengthen Aerospace & Defense Supply Chain
UMC Reports Sales for July 2024
Ceva, Inc. Announces Second Quarter 2024 Financial Results
ZeroPoint Technologies introduces zstd Decompression Hardware IP
Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs
Femtosense Combines AI Chiplet with MCU for Audio SiP
Tuesday, August 6, 2024
Silvaco To Present at the Rosenblatt 4th Annual Technology Summit
NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
AI, 3D printing, electrification drive automotive supply chain
Consult Red Announces Strategic Partnership with CAST, Inc.
Intel Foundry Achieves Major Milestones
Samsung Electronics Begins Mass Production of Industry's Thinnest LPDDR5X DRAM Packages for On-Device AI
Monday, August 5, 2024
GUC Monthly Sales Report - July 2024
T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs
Crypto Quantique appoints ITEC to sell its IoT device security technology in Israel
Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala
Arteris Announces Financial Results for the Second Quarter 2024 and Third Quarter and Full Year 2024 Guidance
Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports
NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%
Imec: Getting High-Precision Sensors to Market
ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP
Previous
|
Next
Did you miss last D&R News Alerts ?