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Monday, October 14, 2024

• Weebit Nano expands global sales infrastructure to support increased demand
• Silvaco Announces Preliminary Unaudited Revenue for Q3 and Updates Full Year 2024
• Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs to Deliver Breakthrough Performance for Data Center and AI
• eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP
• Codasip unveils versatile automotive-grade embedded RISC-V core
• CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
• CAST Partners with KiviCore for Post-Quantum Cryptography
• Cadence Announces Fem.AI Alliance to Lead Gender Equity Revolution in the AI Workforce
• Axiomise 7th birthday - we are proud to be at DVCon Europe
• Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
• Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
• AI and Semiconductors: A Symbiotic Relationship
• Agile Analog announces MoU to support new Southern Taiwan IC Design Industry

Sunday, October 13, 2024

• TSMC "already planning" for more European fabs
• Supercharging Automotive Production Line With AI-Powered Manufacturing
• Siemens Updates Simcenter Testlab for Advanced Manufacturers
• SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
• Samsung's Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure
• Kernkonzept and Lauterbach Make Virtualized RISC-V Systems Possible
• Exclusive Interview: Antti Rauhala Discusses CoreHW's CHW3021 Radio Front-End IC
• DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs
• Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI Express Product Line at OCP Summit 2024

Friday, October 11, 2024

• September foundry sales: a tale of differing fortunes

Thursday, October 10, 2024

• Infineon intensifies collaboration on CO2 reduction targets with suppliers and honors top performers with Green Awards
• IEDM: CFETs make progress at 5nm and 7angstrom

Thursday, October 10, 2024

• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors

Thursday, October 10, 2024

• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices

Wednesday, October 9, 2024

• Why Chiplets Are the Next Big Innovation in Silicon
• TSMC September 2024 Revenue Report
• SensiML Expands Platform Support to Include the RISC-V Architecture
• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors
• Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
• Bosch, Tenstorrent to collaborate on standardizing automotive chips
• Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program

Wednesday, October 9, 2024

• MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
• How Poland became key to Europe's semiconductor sovereignty
• Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
• Rambus to Announce Third Quarter Fiscal Year 2024 Results
• Intel Architects Start RISC-V Business with AheadComputing
• LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications

Tuesday, October 8, 2024

• Secure-IC unveils its Securyzrâ„¢ neo Core Platform at Embedded World North America 2024

Tuesday, October 8, 2024

• Quantum Tunneling and PUFs: The Future of IoT Security
• MosChip Reaches Embedded World North America 2024 With its DigitalSky
• Efabless Unveils New Custom Chip Platform Designed for Edge ML Products
• Debug and Trace Support for Synopsys ARC-V Processor IP
• Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets
• Intel, TSMC to detail 2nm processes at IEDM
• OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
• Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
• Silicon Labs Series 3 Platform Guides the IoT Evolution

Monday, October 7, 2024

• UK announces sustainable electronics centre
• Accelerating Europe's Photonics Lab-to-Fab Journey
• Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
• Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
• PQShield achieves first FIPS 140-3 certification
• Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
• intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
• NVMe Updates Expand Discoverability, Security
• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
• GUC Monthly Sales Report - September 2024
• UMC Reports Sales for September 2024
• Global Semiconductor Sales Increase 20.6% Year-to-Year in August
• A New Phase for Quantum Competition in Europe

Saturday, October 5, 2024

• Samsung ports Tizen OS to RISC-V

Friday, October 4, 2024

• Murata opens silicon capacitor production line at French manufacturing site

Thursday, October 3, 2024

• Significant EU funding for VTT's semiconductor development - supporting the growth of the semiconductor industry
• Uncovering Silent Data Errors with AI
• South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC

Wednesday, October 2, 2024

• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
• Xiphera Partners with IPro for the Israeli Chip Design Market
• Launching MosChip DigitalSkyâ„¢ for Building Connected Intelligent Enterprises
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs