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Thursday, September 6, 2018

• UMC Reports Sales for August 2018

Thursday, September 6, 2018

• ST, Xilinx to launch embedded FPGA cores in early 2005, says analyst

Wednesday, September 5, 2018

• Accellera Forms IP Security Assurance Working Group
• Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round
• Cracking The Auto IC Market
• IIoT Edge Is A Moving Target
• Deal-shy chipmaker TSMC says it's open to memory acquisition
• Synopsys Announces Support for the Open Neural Network Exchange Format in ARC MetaWare EV Development Toolkit

Tuesday, September 4, 2018

• WSTS raises 2018 chip market forecast... again
• Indo-US startup preps agent-based AI processor
• UltraSoC embedded analytics selected by Kraftway for solid state disk controller products
• Artosyn Selects Synopsys DesignWare Security IP for Drone SoC
• GUC Monthly Sales Report - Aug 2018
• Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX Certification
• TSN Ethernet Subsystem Available from CAST Proven at IIC and LNI Plugfests
• Sankalp Semiconductor to present technical paper at CDNLive Bangalore
• Achronix Presentation at D&R IP SoC China will Detail Accelerating Computing at the Edge with Speedcore eFPGAs
• Imagination and Chips&Media deliver integrated GPU and Video Codec IP with advantages of system level compression
• Global Semiconductor Sales Increase 17.4 Percent Year-to-Year in July
• Lattice Semiconductor Appoints Steve Douglass as Corporate VP, R&D

Monday, September 3, 2018

• Automotive ultra-low On-resistance MOSFET in thermal-improved package
• Bringing Artificial Intelligence to the Edge of the IoT
• Huawei Launches Kirin 980, the World's First Commercial 7nm SoC
• China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020
• NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks
• Palma Ceia SemiDesign Announces Silicon-Proven LTE NB-IOT Transceiver for IoT Applications
• Credo to Demonstrate 100G Mixed-Signal DSP for 100G DR1 & 400G DR4 Optical Modules at CIOE
• Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor

Sunday, September 2, 2018

• Tiannengbo optimises their latest Mining Chip using Moortec's Embedded Temperature Sensor
• Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer
• ADAS SoC: Show Me Your Benchmark

Friday, August 31, 2018

• Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC China 2018

Thursday, August 30, 2018

• Intel Cautious on EUV
• Socionext Establishes "ForteArt" to Enhance Sound Quality in Wide Range of Applications

Wednesday, August 29, 2018

• Variation In Low-Power FinFET Designs
• Yocto Project Welcomes New Members, Advances Open Source Embedded Systems Through Momentum
• SMIC Announces Unaudited 2018 Interim Results
• Variation In Low-Power FinFET Designs
• Jon Peddie Research reports the Q2'2018 GPU shipments

Tuesday, August 28, 2018

• Radiation-tolerant FPGAs take high speed signal processing to space
• Apple Goes Vertical & Why It Matters
• Rambus and Infineon Renew Patent License Agreement
• GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region
• Memory ICs to Account for 53% of Total 2018 Semi Capex
• Frontier collaborates with NXP on new Smart IoT software licensing business

Monday, August 27, 2018

• Allegro signs UMC as primary foundry
• Murata to build second Finnish MEMS fab
• Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications
• RoodMicrotec selected as key partner for EnSilica automotive ASIC project
• GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings
• Analysis: Outpaced by TSMC, GloFo cuts its cloth
• Lattice Semiconductor Appoints Jim Anderson as CEO
• Gartner Says Huawei Secured No. 2 Worldwide Smartphone Vendor Spot, Surpassing Apple in Second Quarter 2018
• Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification