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Friday, August 24, 2018

• North American Semiconductor Equipment Industry Posts July 2018 Billings

Thursday, August 23, 2018

• Memory Does not Come Cheap... Or Does It?
• Worldwide Semiconductor Revenue Hit Record $120.8 Billion in Q2 2018, IHS Markit Says

Wednesday, August 22, 2018

• An inside look: Innovation, automotive test, and what's next
• Gaps In Verification Metrics
• Verification Trends Enabling A 5G Future
• Apple, Intel Good Partners, For Now
• Fujitsu Presents Post-K CPU Specifications
• TSMC to start making Qualcomm Snapdragon chips in 4Q18, says report
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2018
• Intellectual property in an AI world
• Cost of designing an SoC creeps up

Tuesday, August 21, 2018

• Apple, Qualcomm in Fatal Attraction
• Using AI In Chip Manufacturing
• Automotive grade optocoupler now available at TTI
• TSMC 7nm, 5nm to enjoy strong demand for AI chips
• Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America
• Apple-TSMC Sole-Source Embrace Holds Risk for iPhone Maker
• Imagination Technologies: Life after Apple

Tuesday, August 21, 2018

• Seven Top-15 1H18 Semi Suppliers Register ≥20% Gains

Monday, August 20, 2018

• nextLAP's AI Production-Process-Platform IP/1 Used Worldwide by Automotive and Other Manufacturers
• Security Era Sprouts in Silicon
• UMC stays focused on profitability
• IP Cores, Inc. Announces an Update for Its True Random IP Core
• Soitec and MBDA to Acquire Dolphin Integration Assets
• ASIC Design Services Adds Core Deep Learning IP to SiFive DesignShare Program

Sunday, August 19, 2018

• HfS Positions L&T Technology Services in 'Winner's Circle' for Automotive Engineering Services
• SiFive Announces First Open-Source RISC-V-Based SoC Platform With NVIDIA Deep Learning Accelerator Technology
• Gowin Announces RISC-V EAP and New distributor Alcom
• Xilinx Unveils its Vision for the Future of Computing, Details New Programmable Engine Fabric and Multiple AI Technologies
• Skyworks Closes Acquisition of Smart Interface Innovator Avnera Corporation
• Seven Top-15 1H18 Semi Suppliers Register ?20% Gains
• SiFive Announces First Open-Source RISC-V-Based SoC Platform With NVIDIA Deep Learning Accelerator Technology
• Esperanto Technologies Expands AI Engineering Leadership Team
• IBM and Synopsys Accelerate Post-FinFET Process Development with DTCO Innovations

Friday, August 17, 2018

• Accelerating mobile and laptop performance: Arm announces Client CPU roadmap

Wednesday, August 15, 2018

• MRAM Makes a Move into the Embedded Space
• Inspecting Unpatterned Wafers
• Toshiba expands line-up of Arm Cortex-M3-based MCUs
• Size of Semiconductor Acquisitions May Have Hit Limit
• SK Telecom Deploys Xilinx FPGAs for AI Acceleration, Achieves 5X Performance/16X Performance-per-watt over GPUs

Tuesday, August 14, 2018

• Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product
• Taiwan's TSMC board agree to NT$136 billion expansion
• Taiwan Relentless in Foundry Business
• Arasan Announces NAND Flash Controller PHY and I/O Pad IP compliant to ONFI 4.1 Specifications
• IBM and Synopsys Accelerate 3nm Process Development with DTCO Innovations
• Faraday Unveils the Industry's Smallest USB 2.0 OTG PHY IP

Monday, August 13, 2018

• China new fabs to join competition for foundry orders in late 2018
• Antmicro and SiFive join forces to propose complete RISC-V offering
• OPENEDGES Joins SiFive's DesignShare
• Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC to Accelerate SoC Design
• SEMI Integration of ESD Alliance Underway
• The Linley Group Microprocessor Report Details eSilicon 7nm IP
• UltraSoC selects MosChip to support its growth in India