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Monday, July 9, 2018

• Synopsys and IMECAS Collaborate to Offer Silicon Photonics in China
• Reconfigurable AI Building Blocks For SoCs And MCUs
• Drop-In Security for IoT Edge Devices
• Maxim Works With Qualcomm Automotive Solutions on Infotainment Applications for the Smart, Connected Car
• TSMC's June sales disappoint
• Terminus Circuits Brings Complete ASIC Solutions to DesignShare
• Stratix 10 SoC: REFLEX CES is releasing to market its new version of the COM Express module based on Stratix 10 SoC technology from Intel PSG
• Arteris IP Ncore and FlexNoC Interconnects and Resilience Packages Licensed by Mobileye for AI-Powered EyeQ Chips
• Inside Secure Technology Chosen to Secure Kalray's Intelligent Processors for Autonomous Vehicles and Next-Generation Data Centers
• TSMC June 2018 Revenue Report
• GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology

Sunday, July 8, 2018

• Samsung Electronics Wins at Two Top Global AI Machine Reading Comprehension Challenges
• Renode 1.4 released: 64-bit RISC-V HiFive Unleashed support, multiple Silicon Labs targets, and more
• Hardware: Golden Age or Golden Ager?
• Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements
• UMC Reports Sales for June 2018
• Baidu Accelerator Rises in AI
• EDA Takes to the Cloud (Sort of)

Friday, July 6, 2018

• Faraday Monthly Consolidated Sales Report - June 2018

Thursday, July 5, 2018

• Silex Inside eSecure Root-of-Trust Security IP Is Excellent Fit with RISC-V Cores

Wednesday, July 4, 2018

• GUC Monthly Sales Report - June 2018
• SMIC vice chairman Tzu-Yin Chiu resigns
• Topco Scientific expects silicon wafer supply to stay tight till 2025
• Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions

Tuesday, July 3, 2018

• Intel to Push AI at Baidu Create 2018
• Baidu cloud-to-edge AI chip can handle large-scale workloads
• Cadence teams with Google, Microsoft, Amazon, on cloud-based EDA
• Tower, Soitec, Maxscend ramp RFSOI

Monday, July 2, 2018

• Chip Industry Posts Another Monthly Sales Record
• ZTE given temporary reprieve from U.S.; removes more executives
• Machine Learning's Limits
• Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration
• RISC-V ISA Wins Prestigious Electrons d'Or Award, Validating Industry's Commitment to the RISC-V Ecosystem
• Chinese Court Said to Block Sale of Some Micron Chips
• Taiwan Semiconductor Manufacturing Company - It's Not About Crypto, It's About Blockchain
• Silex Inside releases a secure connection engine
• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology

Sunday, July 1, 2018

• RISC-V Foundation Announces Security Standing Committee, Calls Industry to Join in Efforts
• Siemens-Mentor: How's It Working Out?
• L&T Technology Services launches new NB-IoT Protocol Stack IP, collaborates with Cadence to facilitate smart connectivity
• Inomize joins Arm Approved Design Partner program
• Global Semiconductor Sales in May Increase 21 Percent Year-to-Year
• Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs
• EDA Startup Rises From Ashes of ATopTech
• Blu Wireless HYDRA 1.X mmWave IP validated in successful real-world trial
• GLOBALFOUNDRIES to Deliver Socionext's Next Generation Graphics Controller for Advanced In-Vehicle Display Applications
• CAST Releases TSN Ethernet Subsystem for Automotive and Industrial Applications
• UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor

Friday, June 29, 2018

• Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO

Wednesday, June 27, 2018

• Automotive, technology players join forces on in-car Multi-Gig-networking
• Inside Secure and Andes join forces to deliver secure IoT solutions to chipmakers for greater China and Asia markets
• A Path to Broad AI: 5 Challenges
• Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
• Eta Compute and ROHM Semiconductor Collaborate to Create Low Power Wi-SUN Compatible Sensor Nodes
• BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC
• Siemens acquires Austemper Design Systems for breakthrough IC functional safety technology