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Saturday, July 28, 2018

• ARM to Buy Treasure Data
• Samsung Memory is easy come easy go but for how low?
• Chipus Brings Ultra-Low-Power IP to SiFive's DesignShare Ecosystem
• PLDA and HPE collaborate to develop Gen-Z semiconductor IP

Friday, July 27, 2018

• Sankalp Semiconductor Appoints Sathish Kumar Ganesan as Vice President Engineering

Thursday, July 26, 2018

• Pros, Cons Of ML-Specific Chips
• Chinese IoT firm raises $200m

Wednesday, July 25, 2018

• Efinix Expands Executive Leadership Team and Board of Directors
• Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
• ADASMark Autonomous Driving Benchmark Suite Is Now Available for Licensing From EEMBC
• Applied, ARM to develop CeRAM for neuromorphic applications
• Qualcomm-NXP deal off
• NXP acquisition by Qualcomm about to collapse

Tuesday, July 24, 2018

• Kandou Bus Closes Series B Investment Round
• BrainChip Unveils the Akida Development Environment
• Silicon Industry Veteran Joins SiFive Executive Team
• North American Semiconductor Equipment Industry Posts June 2018 Billings
• emPack OS addresses all 8-/16-/32-bit IoT and non-IoT systems
• X-Ware IoT Platform to support Xilinx' Zynq UltraScale+ MPSoCs
• Customizing FPGA-based DisplayPort 1.4a designs
• UltraSoC's Alibaba design win underlines China's significance
• C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC

Monday, July 23, 2018

• Bluespec, Inc. Releases a New Family of Open-Source RISC-V Processors
• Intel processors: Researchers discover new vulnerabilities
• IMEC, Soitec stack device layers
• SMIC preps the world's largest 200mm wafer fab
• Synopsys Targets 400G Hyperscale Data Centers with High-Performance Ethernet IP
• Samsung developing new GPU
• Dolphin Integration announces a new release of its innovative IDE for the RISC-V ecosystem
• AI, China Dominate Semiconductor Funding
• Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation
• Gowin Semiconductor Corp. announces LittleBee Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available
• ESD Alliance Reports EDA Industry Revenue Increase For Q1 2018
• Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec
• NXP and Dover Microsystems Join Forces to Deliver Unprecedented Network Security, Safety, and Privacy for Processors

Monday, July 23, 2018

• Vatics Standardizes on Synopsys' Fusion Technology for its Next-Generation Multimedia SoC Design

Sunday, July 22, 2018

• Data Center Scaling at Breakneck Pace
• Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes
• Will Robocars Need More than Ethernet?
• Android Wants to Be Truly Free

Saturday, July 21, 2018

• SEMICON West - Soitec is becoming a key enabler

Thursday, July 19, 2018

• EASii IC (France) becomes Arm Approved Design Partner

Wednesday, July 18, 2018

• Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam
• Credo Demonstrates Industry Leading SerDes on TSMC's 7nm Process at TSMC 2018 OIP Forum and Technology Symposium in Amsterdam
• Semi Content in Electronic Systems Forecast to Reach 31.4% in 2018
• Lattice Semiconductor Takes Additional Action to Reduce Operating Expenses; Company to Discontinue Millimeter Wave Business to Focus on Core Business Opportunities
• Texas Instruments: Brian Crutcher resigned as CEO
• Stratix 10 FPGA: REFLEX CES launches an 800G acceleration card
• Ferroelectric Memory Company receives growth financing from eCAPITAL and HTGF
• SWIM.AI Secures $10M in Series B Funding
• TSMC Reports Second Quarter EPS of NT$2.79
• Fabs Meet Machine Learning
• FD-SOI Going Mainstream
• ASML to Ship 20 EUV Systems in 2018

Tuesday, July 17, 2018

• Microsemi's PolarFire FPGAs Ideal for Portable Design with Latest Release of Libero SoC PolarFire Design Suite
• San Diego ML startup gets more Chinese backing
• AMD Will Drive AI to the Edge
• Flex Logix: Machine Learning and Embedded FPGA IP
• Leti: Pilot Program to Characterize Lidar Sensors
• SEMICON West Intel 10nm and GF 7nm Update

Monday, July 16, 2018

• Intel to Acquire eASIC
• ArcSoft and Cadence Partner to Develop AI and Vision Applications
• Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification
• Global Micro-LED market to reach $10.7 billion in 2022, says n-tech Research
• Xilinx Announces the Acquisition of DeePhi Tech
• Rambus and Socionext Sign Broad Patent License Agreement
• 5nm Design Progress
• TSMC to post revenue growth through 4Q18
• HDL Design House Greece Joins HETIA
• Is This the Moment for RISC-V?