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Monday, May 28, 2018

• DAC explores the role of AI and ML across the markets
• Why IoT Security Is So Difficult
• EUV in Final Push into Fabs
• TSMC and GloFo may compete to produce the most overclockable AMD Zen 2 CPUs
• Kandou Announces Availability of Glasswing USR SerDes IP
• GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications
• IP Cores, Inc. Announces Additional Shipments of its Reed-Solomon Codec for 400G Ethernet
• Resurgence in 8051 Microcontroller Applications Drives New IP Cores Sales for CAST

Sunday, May 27, 2018

• Inuitive licenses Inside Secure's Root-of-Trust to Secure Mobile and XR Virtual Augmented Reality solutions
• Dolphin Integration announces the availability of its RISC-V subsystem: RV32 Tornado

Saturday, May 26, 2018

• Tencent wants to bolster China's chip and semiconductor industr

Thursday, May 24, 2018

• China chips grow 21%
• ARM's next bet for plastic chips: Neural networks Hot3

Wednesday, May 23, 2018

• IP-Maker to launch new NVMe host IP Family For NVMe host acceleration in data center applications
• Agnisys to Present Functional Safety, Machine Learning, IoT Solutions, and More at the Design Automation Conference in San Francisco
• Intel to Spend $5 Billion on 10nm Fab in Israel
• Andes Technology Corporation and XtremeEDA Corporation Cooperate to Develop Joint Design Wins on Emerging RISC-V Designs
• North American Semiconductor Equipment Industry Posts April 2018 Billings
• Chip Industry Maps Heterogeneous Integration
• Samsung Plans 3nm Gate-All-Around FETs in 2021
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2018

Tuesday, May 22, 2018

• Foundries encouraging fabless chipmakers to switch to 12-inch wafers
• Imagination appoints PowerVR veteran to lead business unit
• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology
• IP Cores, Inc. Announces Shipment of a 32-bit Version of its Ultra Low Power FFT IP Core
• Synopsys Design Platform Certified for Samsung 8LPP Process Technology
• Can Mobileye Validate 'True Redundancy'?
• GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology
• SmartDV Announces OpenCAPI Verification IP (VIP)
• Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation
• ST's New CEO Not Ruling Out Acquisitions in Quest for Growth
• HDL Design House and Mentor Workshop at Aviation Electronics Europe 2018
• Arasan and Test Evolution announce Industry's first C-PHY / D-PHY Combo Compliance Analyzer with Arasan's Total MIPI IP Solution
• Chipus grows its battery charger IP family

Monday, May 21, 2018

• Microsoft acquires conversational AI startup
• Sony buys EMI as part of transition strategy
• Block RAM integration for an Embedded FPGA
• Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design Leveraging its Leading SiC Diodes and MOSFETs Offers High Ruggedness and Performance
• Rising 8-inch foundry quotes putting pressure on IC designers
• Apple partner TSMC begins mass production of 7-nanometer 'A12' processors for this year's iPhones
• Brite Semiconductor Joins SiFive's DesignShare Program
• Open-Silicon Achieves ISO 9001:2015 Certification
• Arm Gives Glimpse of AI Core
• Semi Capex Forecast to Exceed $100B for the First Time in 2018

Sunday, May 20, 2018

• Samsung reportedly started an R&D division for its foundry business
• Rambus takes aim at ARM in IoT security
• Microsemi Deal May Spur Broader ReRAM Adoption
• Ultra-Low Power Lattice sensAI Leads Mass Market Enablement of Artificial Intelligence in Edge Devices
• Dolphin Integration introduces new Dual Port memory compilers in TSMC 40 nm

Friday, May 18, 2018

• Open-Silicon to Demonstrate its HBM2 IP Subsystem Solution for High Performance Computing Applications, and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at TSMC Technology Symposium 2018

Wednesday, May 16, 2018

• Arm Drives Smart Utilities for KEPCO's Behind the Meter Project
• SiFive Inc. and Andes Technology Corporation Join Forces to Promote RISC-V
• Synopsys Introduces Industry's First ASIL D Ready Embedded Vision Processor IP for ADAS Applications and Self-Driving Vehicles
• Startup Maps AI into Flash Array
• Arm TechCon 2018
• RF SOI Wars Begin
• Stars of IP Party Returns to San Francisco
• CTAccel Joins Accelize Ecosystem to Make FPGA-Based Image Transcoding Acceleration Available on AccelStore
• Crossbar Announces Licensing Relationship Agreement With Microsemi