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Friday, June 29, 2018

• Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO

Wednesday, June 27, 2018

• Automotive, technology players join forces on in-car Multi-Gig-networking
• Inside Secure and Andes join forces to deliver secure IoT solutions to chipmakers for greater China and Asia markets
• A Path to Broad AI: 5 Challenges
• Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
• Eta Compute and ROHM Semiconductor Collaborate to Create Low Power Wi-SUN Compatible Sensor Nodes
• BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC
• Siemens acquires Austemper Design Systems for breakthrough IC functional safety technology

Tuesday, June 26, 2018

• Siemens buys expert for Functional Safety IP
• When Why and How Should You Use Embedded FPGA Technology
• How embedded FPGAs fit AI applications
• Eta Compute, Rohm team on IoT sensor nodes
• Apple iPhone 2018's chips hit production lines, to be built on 7 nm process by TSMC
• Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0
• China's Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018
• Mentor extends support of tools and solutions for Samsung Foundry's 8LPP and 7LPP process technologies
• Where Do FPGAs Stand in Auto IC Race?
• Rambus Renews License With IBM
• Arteris IP Achieves Major Milestone: 100th Customer
• Learn how Arm and partners can help you get a custom chip from concept to production

Monday, June 25, 2018

• Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles
• Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications
• Daimler AG Selects Xilinx to Drive Artificial Intelligence-Based Automotive Applications
• 7nm networking platform delivers unprecedented performance and configurability for data center ASICs
• Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV
• Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications
• General Processor Technologies Announces AI Accelerator and DSP for Digital and Image Processing
• Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE
• Optimum Semiconductor Unveils New Image Recognition SoC

Sunday, June 24, 2018

• 7nm, 5nm and 3nm Logic, current and projected processes
• NetSpeed launches SoCBuilder - AI-powered design and integration platform to accelerate SoC designs
• Gidel Launches Lossless Compression IP that Reduces Storage Needs by Over 50%, Utilizing Only 1% of the FPGA, with Low Power Consumption
• Synopsys RedHawk Analysis Fusion Certified for Samsung Foundry's 10LPE, 8LPP, 7LPP Advanced-Node Designs
• WiLAN Subsidiary Acquires Patent Portfolio from MagnaChip
• Synopsys' ASIP Designer Tools Enables RIKEN to Successfully Develop Application-Specific Instruction-Set Processor in Less Than Six Months
• Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution
• Arteris IP and Magillem Partner to Create Integrated System-on-Chip Architecture Environment
• Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud
• CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution
• Flex Logix Improves Deep Learning Performance By 10X With New EFLX4K AI eFPGA Core
• Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications
• 9 of the Top 12 Smartphone Suppliers Headquartered in China
• Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors
• Truechip Collaborates with Gowin Semi for Verification of USB Type C & PD
• SiFive Unveils E2 Core IP Series for Smallest, Lowest Power RISC-V Designs
• C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement
• Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform
• Synopsys Custom Design Platform Accelerates Robust Custom Design for Samsung Foundry's 7LPP Process Technology

Friday, June 22, 2018

• XTERCONNECT & GENIATECH Partner with CORTUS to enable Secure IoT Solutions based on Dash7 Technology

Friday, June 22, 2018

• True Circuits Attends Design Automation Conference, Celebrates 20 Years of Timing Excellence!

Friday, June 22, 2018

• Arm and Samsung Foundry push the possibilities of semiconductor manufacturing

Wednesday, June 20, 2018

• Intel CEO Brian Krzanich Resigns, Board Appoints Bob Swan as Interim CEO
• UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug
• Synopsys Delivers PrimePower Power Analysis to Accelerate Robust SoC Design
• NetSpeed unveils Orion AI - Delivering extreme performance and ultimate efficiency for next-gen AI SoCs
• Andes Certifies Imperas Models and Simulator as a Reference for Andes RISC-V Cores
• Industrial, automotive to drive IoT sales
• Network emulation solution adds cellular IoT testing
• Silexica raises $18m in Series B funding to advance software development solutions for autonomous driving
• Algorithm compares 3D medical images up to 1000x faster
• AI creates realistic slow motion from standard video
• SoftBank confirms sell-off of ARM China stake
• North American Semiconductor Equipment Industry Posts May 2018 Billings
• Taiwan's TSMC to Invest $25 Billion in 5 Nanometer Node Technology
• NetSpeed unveils Orion AI – Delivering extreme performance and ultimate efficiency for next-gen AI SoCs

Tuesday, June 19, 2018

• PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design
• TSMC's May sales show continued strength
• QuickLogic to Exhibit at DAC 2018
• GlobalFoundries' UHV 180nm Process Hits 700V
• Decipher the Meaning of Silicon-as-a-Service
• Achronix to Demonstrate Embedded FPGA Solutions at Design Automation Conference
• T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018
• Flex Logix EFLX1K eFPGA Cores Enable Array-Efficient Reconfigurable Logic on 40nm to 180nm Nodes
• PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design
• M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market

Monday, June 18, 2018

• North American Semiconductor Equipment Industry Posts May 2018 Billings
• Samsung to Pay $400 Million for Infringing FinFET Patent
• Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales
• Moortec will be exhibiting their In-Chip Monitoring Subsystem IP at DAC 2018 in San Francisco
• Inside Secure to Provide Secure Provisioning Solutions to NationalChip
• Wave Computing Extends AI Lead by Targeting Edge of Cloud Through Acquisition of MIPS
• CCIX Consortium Enables Next Generation Compute Architectures with the Availability of Base Specification 1.0
• Arasan Announces SD Card UHS-II PHY IP for 12nm SoC Designs