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Thursday, October 4, 2018

• TSMC to Start 5nm Production in April
• GUC Monthly Sales Report - Sep 2018
• Apple, Amazon Refute China Chip Hacking Story

Wednesday, October 3, 2018

• Meet grandmaÂ’s new friend: her robot
• TSMC Goes Photon to Cloud
• DRAM Market Braces For Slower Growth
• Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA
• eMemory Receives 2018 TSMC IP Partner Award
• M31 Receives TSMC's 2018 Partner of the Year Award for Specialty Process IP
• Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies
• Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator

Tuesday, October 2, 2018

• TSMC and ANSYS Accelerate Automotive Reliability Solutions
• Cloud Drives Changes In Network Chip Architectures
• Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC N7+ FinFET Process
• TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
• Cadence Delivers Support for TSMC InFO_MS Advanced Packaging Technologies
• Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
• TSMC Announces OIP Ecosystem Enabled in the Cloud
• Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
• Wi-Fi Alliance introduces Wi-Fi 6
• SiFive Welcomes Former Tesla Executive to Lead Global Growth Strategy
• Synopsys Announces Availability of TSMC-certified IC Design Environment in the Cloud
• Xilinx Unveils Versal: The First in a New Category of Platforms Delivering Rapid Innovation with Software Programmability and Scalable AI Inference

Monday, October 1, 2018

• Learning to Share - Embedded FPGA Timing Closure
• Arm Treasure Data Announces Audience Suite
• Xilinx Launches the World's Fastest Data Center and AI Accelerator Cards
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Autotalks for Automotive V2X Communications Chipsets
• Silicon Creations Highlights PLL Developments in 22nm, 12nm, 7nm, and 5nm at TSMC OIP Ecosystem Forum
• T2M announces its first Image Signal Processing (ISP) Technology for advanced mobile camera applications
• Synopsys Digital and Custom Design Platforms Certified on TSMC 5-nm EUV-based Process Technology
• M31 Technology's Diversified TSMC 28HPC+ ULL Memory Compilers Empower More Flexible SoC Design Architecture

Sunday, September 30, 2018

• Samsung and AT&T Create America's First 5G Manufacturing
• Arm adds fpga option and new business model to DesignStart
• China Drives Foundry Business Growth
• Arm expands design possibilities with free Cortex-M processors for Xilinx FPGAs
• Dolphin Integration accelerates the development of energy-efficient SoCs for Arm-based secure IoT devices
• Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara
• Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation
• ESD Alliance Reports EDA Industry Revenue Increase for Q2 2018
• Synopsys Delivers Automotive-Grade IP in TSMC 7-nm Process for ADAS Designs
• Intel Promises to Boost 14nm Production
• GOWIN Semiconductor Licenses Andes Technology RISC-V CPU Core For Its Arora GW-2A FPGA Family Products

Thursday, September 27, 2018

• Attopsemi Technology Provided a Talk Along with an AIoT Panel at the 6th FD-SOI Forum in Shanghai
• The Real Case of Silicon-as-a-Service - A Tale of 3 Innovators

Wednesday, September 26, 2018

• GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications
• GreenWaves Technologies Licenses Intrinsic ID Hardware Root of Trust for RISC-V AI Application Processor
• M31 MIPI M-PHY is certified with ASIL-B safety level of ISO 26262 to provide safe and reliable automotive SoC design
• Arm announces new flagship IP and safety program for automotive
• Andes to discuss news RISC-V offerings at the TSMC Open Innovation Platform Ecosystem Forum

Tuesday, September 25, 2018

• Latest Releases of the LucidShape Product Family Support Faster, More Efficient Automotive Lighting Simulations
• GEO Deploys Mixel's MIPI Solution in the World's First Edge Based Automotive Smart Viewing Camera Processor
• GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems
• Sankalp Semiconductor to Exhibit at Taiwan Innotech Expo 2018
• China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018
• Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms
• Achronix to Showcase Flexibility of Speedcore eFPGAs During TSMC OIP Ecosystem Forum
• Terasic chooses Enyx to offer ultra-low latency development framework and design services for their latest FPGA platform
• GF Grabs AI Wins with FD-SOI
• Floadia G1 eFlash IP has exceeded 30,000 wafers shipment at Powerchip for system LSI customers

Monday, September 24, 2018

• Renesas to Pitch Baby-step AI for Factories
• Mirabilis - Processor generator is AI-driven
• sureCore Opens Low-Power SRAM IP Customization Service
• Chronos Tech Deploys Fabric to Seamlessly Integrate Diverse IPs in Next-Gen System on Chips
• Intel Adds to Portfolio of FPGA Programmable Acceleration Cards to Speed Up Data Center Computing
• Imagination and GLOBALFOUNDRIES Collaborate to Deliver Ultra-Low-Power Connectivity Solutions for IoT Applications
• Lattice Expands Ultra-Low Power sensAI Stack with Optimized Solutions for Always-On, On-Device AI

Sunday, September 23, 2018

• Boeing Defense, Space & Security Licenses Flex Logix's Embedded Field-Programmable Gate Array on GlobalFoundries 14nm Process
• Synopsys and SMART Photonics Expand InP-Based PIC Design Automation
• Intilop to Showcase their 40G-10G TCP-UDP Acceleration Technology and Solutions at MIT's Lincoln Labs