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Tuesday, May 1, 2018

• DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface
• AI Gets New Benchmark
• Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars
• New MIPI SyS-T Consolidates and Streamlines Embedded Software Debugging in Mobile
• Achronix's Speedcore eFPGA Devices to be Highlighted at TSMC 2018 North America, China Technology Events in May
• Jim Keller Joins Intel to Lead Silicon Engineering
• Control of Arm's China business transferred to Chinese investors
• Alliance Ventures and Definvest acquire stakes in Kalray
• New Arm IP Helps Protect IoT Devices from Increasingly Prevalent Physical Threats
• Global Semiconductor Sales Up 20 Percent Year-to-Year in Q1
• TSMC's Roadmap Full, But Thin
• New MIPI I3C Host Controller Interface Speeds Sensor Integration
• Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium
• Arm Physical IP to Accelerate Mainstream Mobile and IoT SoC Designs on TSMC 22nm ULP/ULL Platform
• Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC
• Samsung Electronics Partners with Avnet ASIC Israel to Strengthen Customer Support at the Forefront of ASIC Design Services
• Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and Wafer-on-Wafer stacking technology

Monday, April 30, 2018

• Arteris FlexNoC Licensed by Canaan Creative for Artificial Intelligence ASICs
• Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
• eSilicon deep learning ASIC in production qualification
• Sondrel and NetSpeed Team Up to Deliver the Fastest, Lowest-risk Route to SoC Solutions
• Cadence Supports New TSMC WoW Advanced Packaging Technology
• New MIPS I7200 Processor Core Delivers Unmatched Performance and Efficiency For Advanced LTE/5G Communications And Networking IC Designs
• Imperas and Andes Extend Partnership, Delivering Models and Virtual Platforms for Andes RISC-V Cores with New AndeStar V5m Extensions

Sunday, April 29, 2018

• SST and UMC Announce Qualification of Embedded SuperFlash Technology on 40 nm CMOS Process
• UltraSoC selected by Andes for RISC-V development with trace and debug
• Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications
• Synopsys and TSMC Collaborate to Deliver DesignWare Foundation IP for Ultra-Low Power TSMC 22-nm Processes
• PLDA Announces XpressCCIX Controller IP Supporting The Cache Coherent Interface For Accelerators (CCIX) Standard
• Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts
• TSMC Certifies Synopsys Design Platform for High-performance 7-nm FinFET Plus Technology

Friday, April 27, 2018

• Intel Delays 10nm Volume Production Until 2019

Friday, April 27, 2018

• Samsung, GF Ramp FD-SOI

Friday, April 27, 2018

• GlobalSign's Cloud-based, Highly Scalable PKI Solution integrated with Arm Mbed Cloud

Friday, April 27, 2018

• eMemory introduces more security features to its eNVM IP for TSMC 7nm Process

Thursday, April 26, 2018

• Sankalp Semiconductor to Participate in Panel Discussion at "The Annual SOI Silicon Valley Symposium"

Wednesday, April 25, 2018

• Xilinx Reports Record Annual And Quarterly Revenues
• Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium
• SEMI Reports 2017 Global Semiconductor Materials Sales of $46.9 Billion
• Cyient Acquires Semiconductor Firm AnSem N.V.
• Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters
• Mobile Semiconductor's 22nm ULL Memory compiler Joins the GLOBALFOUNDRIES FDXcelerator Partner program
• Innovium Closes $77M in Series D Funding to Drive Commercial Volume Ramps and Innovative Product Roadmaps
• Sankalp Semiconductor to Participate in Panel Discussion at The Annual SOI Silicon Valley Symposium

Tuesday, April 24, 2018

• SiFive's Design Democratization Drive
• Samsung's Chip Sales Leadership May be Fleeting
• North American Semiconductor Equipment Industry Posts March 2018 Billings
• Partner in Imagination's owner convicted of insider trading
• TSMC Continues to Dominate the Worldwide Foundry Market
• Autonomous cars will be drivers'eyes and ears
• Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles
• China's upstart chip companies aim to topple Samsung, Intel and TSMC
• Security in DevOps Is Lagging Despite Advantages and Opportunities, According to New Study by 451 Research and Synopsys
• M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process

Tuesday, April 24, 2018

• Accelerators Unite ARM, IBM, X86

Monday, April 23, 2018

• PLDA Announces New Test And Validation Platforms For PCIe
• Solarflare and NovaSparks Launch Pure-FPGA Tick-To-Trade Development Platform That Slashes Man-Years of Effort
• Exostiv Labs now supports Intel Stratix 10 FPGA
• Xylon Launches Three New FMC Expansion Boards Featuring High-Speed Serial Links for FPGA Based Multi-Camera Automotive Application Development
• Arm Mbed Simplifies IoT Security, Development and Device Management
• Dongwoon Anatech Licenses Codasip's Bk3 RISC-V Processor for Motor Control ICs for Mobile Camera
• Cadence Reports First Quarter 2018 Financial Results
• Accelerators Unite ARM, IBM, X86
• eMCOS AUTOSAR, an AUTOSAR-Compliant Scalable RTOS, Receives ISO 26262 Functional Safety Standard Certification at Highest ASIL D Safety Integrity Level

Sunday, April 22, 2018

• RISC-V Foundation and Informa Announce First Annual RISC-V Summit in Silicon Valley and 2018 Workshop Schedule
• Algodone, a Silicon Activation Licensing Technology Provider to the Semiconductor Industry, Expands Executive Team
• Gartner Says Worldwide Semiconductor Revenue Grew 21.6 Percent in 2017 as Samsung Takes Over No. 1 Position
• Alibaba Adds Embedded CPU Core Designer
• Algodone Signs a Strategic Partnership with Accelize
• Fujitsu choose INNOSILICON as cooperative partner
• Facebook to design own processors
• GlobalFoundries choose INNOSILICON as cooperative partner
• 3 Things That TSMC Wants You to Know About Its 7-Nano Tech

Friday, April 20, 2018

• Chipmakers' Rout Widens After TSMC Ignites Smartphone Fears

Thursday, April 19, 2018

• Intel Chip Performs 10 Trillion Calculations per Second

Thursday, April 19, 2018

• IEEE Publishes Standard Revision for SystemVerilog - Unified Hardware Design, Specification and Verification Language