Search News

Tuesday, April 17, 2018

• Europe rises as chip market stays strong in February
• Soitec to hire 300 people in 2018
• NetSpeed: Artificial Intelligence calls for Smart Interconnect
• Microsoft to invest $5 billion in IoT
• Titan IC delivers innovative technology for Deep Packet Processing Module in IRD-100 for Strategic Partner Looking Glass
• Macnica's ST2110 IP Core Successfully Adopted by Sencore for its New SDI over IP Converter
• Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs

Monday, April 16, 2018

• US export ban on ZTE will hurt Qualcomm, others
• Cadence: Tensilica 5th Generation DSP: Mix of Vision and AI
• Microsoft, MediaTek Team on IoT SoC
• Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution
• IoT Security Milestone for Intrinsic ID Authentication: More Than 100 Million Devices Protected
• Arm Backs New Cybersecurity Tech Accord to Protect Consumers and Businesses
• Titan IC has licensed its RegEx Processor to Silicom Ltd for advanced FPGA SmartNIC platforms
• New Flexible SoC Solution from Arm to Enable Rapid Development of Secure IoT Devices
• Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market

Sunday, April 15, 2018

• QuickLogic Announces Webcast with AI Ecosystem Partners
• Samsung is bringing crypto and blockchain tech closer to its core business
• TSMC likely to see flat 2Q18 revenues, say reports
• No NN-dedicated hardware on Qualcomm IoT processors
• EnSilica becomes Arm Approved Design Partner
• Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools
• Rambus Launches CryptoManager RISC-V Root of Trust Programmable Secure Processing Core

Friday, April 13, 2018

• MIPS and NetSpeed partner to deliver solutions for Artificial Intelligence and Machine Learning SoCs

Wednesday, April 11, 2018

• A Cloud-Based Marketplace Designed to Ease FPGA Workload Acceleration
• Dover Microsystems Brings Secure Silicon IP to DesignShare
• China's Unigroup plans to spend $60 billion, says report
• Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
• Cadence: Last Holdout for Vision + AI Programmability
• Faraday Leads ASIC Industry with Supporting Major Projector Technologies
• Lip-Bu Tan on AI, China & Moore
• DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices
• Spectral Edge, the image fusion technology specialists, secures $5.3 million in further funding from existing investors Parkwalk Advisors and IQ Capital

Tuesday, April 10, 2018

• China shows it takes Imagination opportunity seriously
• Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision
• Cryptocurrency mining IC startup now a TSMC top-ten customer?
• JPEG XS - Image coding for video over IP transmission in production quality
• Aldec's HES UltraScale+ Reconfigurable Accelerator and Northwest Logic's PCI Express Cores Provide Proven PCI Express Solution
• Chip Designers Bank on AI, Bitcoin
• Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout
• Semiconductor Leaders' Marketshares Surge Over the Past 10 Years
• Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream
• CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators Awards Program

Monday, April 9, 2018

• Microsemi Achieves QML Class Q Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs
• TSMC set to beat Intel to become the world's most advanced chipmaker
• Partnering with Accelize, Nagase provides a Content-Oriented Find and Replace Accelerator Function on AccelStore for Cloud-based Data Analytics Acceleration
• CAST and Achronix Enable Processing from Data Center to the Edge with Lossless Compression IP
• Accelize Launches AccelStore: A Platform-Independent Marketplace that Brings FPGA-based Workload Acceleration to all Cloud Users
• UMC Reports Sales for March 2018
• TSMC March 2018 Revenue Report
• Arm Under Attack in AI
• Ittiam Licenses its i265 HEVC Codec to Microsoft Azure to Offer High Quality Video Encoding and Decoding Services
• Faraday Monthly Consolidated Sales Report - March 2018

Sunday, April 8, 2018

• GLOBALFOUNDRIES and Toppan Photomasks extend advanced photomask joint venture in Germany
• Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales
• Design Services Need Uber-izing
• Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory
• intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU
• CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators
• MediaTek Announces World's First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services
• intoPIX to unveil newest JPEG-XS compression tech at NAB Show 2018 in Las Vegas - A World First
• Flex Logix Validates EFLX 4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now
• PathPartner Technology unveils FPGA based HEVC & HEIF 4K Decoder on Amazon AWS EC2 Cloud
• GUC Monthly Sales Report - Mar 2018
• Samsung early with 7nm process, says report.
• Achronix: Speedcore eFPGAs Offer Unbeatable Bandwidth and Latency Performance

Thursday, April 5, 2018

• Arastu Systems evolving in the Industry with a strategic roadmap
• Low Voltage SRAM – The Missing Link