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Tuesday, April 3, 2018

• Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
• China, Europe gain share in fabless chip market
• Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
• China startup releases AI processors then raises $100 million
• Chipmakers Expand R&D Amid France's New AI Push
• AI Connects Imagination, Leo Li, China
• Neotion partners with Texplained creating stronger Secure by Design ICs
• ESD Alliance Reports EDA Industry Revenue Increase For Q4 2017

Tuesday, April 3, 2018

• VeriSilicon Announces ZView Developement Environment for its Industry Standard ZSP Processors

Monday, April 2, 2018

• China No.1 in IC package and test
• Intel sells Wind River to TPG
• Apple and TSMC starting Apple Watch MicroLED display mass production later this year
• TSMC advanced packaging seen crucial for HPC chips
• SMIC profit falls 52%
• IP-Maker to launch new NVMe host IP Family
• Global Semiconductor Sales Up 21 Percent Year-to-Year in February
• Imagination Technologies Group Ltd. Announces CEO Succession

Sunday, April 1, 2018

• SiFive Secures $50.6 Million Funding to Advance RISC-V Based Semiconductors
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Santa Clara 2018
• Excluded from M&A, China Focuses on Expansion
• eMemory, Europractice IC Service form eNVM IP partnership

Thursday, March 29, 2018

• SMIC Announces 2017 Annual Results
• Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support
• Silex Inside releases a high throughput, scalable and performant MACsec engine

Wednesday, March 28, 2018

• EU Project Delivers Open-Source Simulator for Cyber-Physical Systems
• CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program
• Cryptocurrency mining demand sucking up TSMC IC production
• Samsung commits to AI R&D in France
• Synopsys Webinar: Getting More From Your IP Vendor
• Killer Apps Driving Adoption of USB 3.1 Gen 2

Wednesday, March 28, 2018

• The Alliance for Open Media Kickstarts Video Innovation Era with "AV1" Release

Tuesday, March 27, 2018

• The Alliance for Open Media Kickstarts Video Innovation Era with
• Chip Equipment Sales Remain Strong
• NVIDIA and Arm Partner to Bring Deep Learning to Billions of IoT Devices
• Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles

Monday, March 26, 2018

• IEEE Publishes IEEE 802.3cc-2017 25 Gb/s Ethernet Standard for Enhanced Enterprise and Metro Network Applications Over Fiber
• Arteris FlexNoC Interconnect IP Powers DJI Drones
• Configurability for Embedded FPGA Hard IP
• Silex spending $300 million on Chinese MEMS fab
• GloFo extends silicon photonics roadmap
• Trump Presses China to Buy More U.S. Chips
• Stock Relisting Could Be a Boon for Arm
• NEOTION and Invia join expertise in hardware-based security

Sunday, March 25, 2018

• When AI Goes Awry
• Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance market
• Palma Ceia SemiDesign Establishes China Subsidiary for Development and Support
• EnSilica builds sales network to extend its design and supply services for the automotive sector
• Innosilicon Announces the World's Most Powerful Dash Miner, 65GH/s, 1500W
• eVaderis collaborates with Mentor on accelerating eMRAM IPs and Compilers development
• Secure Provisioning Solutions from Inside Secure Now Protecting Pay TV Services at Kiwisat
• Intrinsic ID Awarded EU Grant under Horizon 2020/SME Instrument Phase 2 Program for INSTET Project
• Pentek Announces Kintex UltraScale Co-processor Jade XMC for Signal Processing Applications
• Omnitek adds AV over IP and video warp Chipsets

Friday, March 23, 2018

• EDA Chief Calls AI the New Driver

Friday, March 23, 2018

• SIA Statement on Trump Administration Section 301 Action on China

Friday, March 23, 2018

• IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China

Friday, March 23, 2018

• Path to 2nm May Not Be Worth It

Friday, March 23, 2018

• U.S. Companies Maintain Largest Share of Fabless Company IC Sales

Friday, March 23, 2018

• North American Semiconductor Equipment Industry Posts February 2018 Billings

Thursday, March 22, 2018

• Microsemi Switchtec PCIe Gen 4 available

Thursday, March 22, 2018

• SiFive Brings in Mobiveil as Newest Partner in the DesignShare Economy