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Friday, May 18, 2018

• Open-Silicon to Demonstrate its HBM2 IP Subsystem Solution for High Performance Computing Applications, and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at TSMC Technology Symposium 2018

Wednesday, May 16, 2018

• Arm Drives Smart Utilities for KEPCO's Behind the Meter Project
• SiFive Inc. and Andes Technology Corporation Join Forces to Promote RISC-V
• Synopsys Introduces Industry's First ASIL D Ready Embedded Vision Processor IP for ADAS Applications and Self-Driving Vehicles
• Startup Maps AI into Flash Array
• Arm TechCon 2018
• RF SOI Wars Begin
• Stars of IP Party Returns to San Francisco
• CTAccel Joins Accelize Ecosystem to Make FPGA-Based Image Transcoding Acceleration Available on AccelStore
• Crossbar Announces Licensing Relationship Agreement With Microsemi

Tuesday, May 15, 2018

• Samsung Lengthens Chip Sales Lead Over Intel
• Thirteen Top-15 1Q18 Semi Suppliers Register Double-Digit Gains
• New VDC-M (VESA Display Compression-M) IP Cores Launched By Hardent
• VESA Publishes Display Compression Standard for Mobile Applications
• MIPI Alliance and VESA Enable Next Generation of High-Performance Displays for Mobile, AR/VR, Automotive, Other Applications
• T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen
• Flex Logix Co-Founders Awarded Interconnect Patent For Connecting Any Kind Of RAM Between eFPGA Cores To Create Application-Optimized eFPGA Arrays

Tuesday, May 15, 2018

• Sankalp Semiconductor Strengthens Management Team

Monday, May 14, 2018

• TSMC Technologies for IoT and Automotive
• NetSpeed Furthers Leadership in Industrial, Factory Automation and Safety-critical Flight Systems with IEC 61508 Certification
• Achronix to Demonstrate Versatility of Speedcore eFPGA Devices Next Week at SEE/MAPLD and Embedded Vision Summit
• Andes Technology Corporation Records a Cumulative 2.5 Billion SoC Shipments Containing Its CPU IP Since Inception
• Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner
• Concentrating Intelligence to Realize Autonomous Driving
• MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions
• True Circuits Provides Low Power PLL Technology to SiFlower in China

Sunday, May 13, 2018

• GlobalFoundries says it needs to build a new fab to compete
• Synopsys IC Validator Certified by GLOBALFOUNDRIES for Signoff Physical Verification
• SMIC to start 14nm risk production in H1 2019
• Crossbar ReRAM Enabling AI at the Edge
• Dolphin Integration joins the RISC-V Foundation
• Socionext Develops AI Accelerator Engine Optimized for Edge Computing
• First Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter to Record Level
• GF Seeks Fab, ASIC Partners

Thursday, May 10, 2018

• So is GlobalFoundries profitable? Yes and no...
• Meet T2M at Bluetooth Asia
• TSMC April 2018 Revenue Report
• Qualcomm reported to be dumping Arm-based server chips

Wednesday, May 9, 2018

• Sankalp Semiconductor Strengthens Management Team
• Adesto Announces Acquisition of S3 Semiconductors
• Silvaco Announces Relocation of Headquarters within Santa Clara
• Express Logic's X-Ware IoT Platform Brings Industrial-Grade IoT Device Connectivity to the AndesCore N25 and NX25 RISC-V Processors
• Chipus concludes important milestone in the development of analog IP in SilTerra I18L technology

Tuesday, May 8, 2018

• Taiwan shares end higher, led by TSMC
• IntelliProp Announces NVMe-to-SATA Bridge IP Core
• Cadence Shortens Automotive Verification Closure with New Verification IP for UFS 3.0, CoaxPress, and HyperRAM
• SMIC Reports 2018 First Quarter Results
• CEVA, Inc. Announces First Quarter 2018 Financial Results
• Antmicro reveals partnership with Thales on the disruptive RISC-V open ISA
• ARM loses IP market share to fast-growing followers
• videantis moves into new office to support growth
• Movellus Closes Funding from Intel Capital for Digital Tool Expansion Technology
• MIPI Alliance Introduces Set of Touch Specifications to Standardize Touch Integration in Mobile Designs
• Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0
• UMC Reports Sales for April 2018
• Gfast Leader Sckipio Raises $50M to Date with New $10M Funding
• Flexera Provides Seamless Monetization Support for Arm Ecosystem

Monday, May 7, 2018

• Chinese chip manufacturers to tap TSMC's 7nm process for next-gen AI chips
• TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains
• SiFive Announces Investment from Intel Capital
• Silvaco Joins Arm Approved Design Partner Program
• NetSpeed and Northwest Logic Partner to Boost Performance in Hyperscale and Automotive SoCs
• Comcores Announce Availability of flexible eCPRI IP solution
• Silex Inside upgrades IP offering for compatibility with Chinese security standards